• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2011.04a
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• pp.77-79
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• 2011

본 논 연구에서는 가전제품 중에서 야간 절전 버튼의 작동 불량 원인을 규명하여 제품의 성능 및 신뢰성 향상을 위한 객관적 근거를 제시하였다. 시판된 제품을 수거하여 불량품 검사(전기적 특성 및 decap)를 실시한 결과 절전 버튼 IC pin No.2의 단락(short)에 의한 오작동 요소를 밝힐 수 있었다. 동일한 사양의 재현실험에서 EOS(전기적 과도전압에 의한 스트레스)보다 정전기 방전에 스트레스에 의해서 소손되는 특성을 나타내는 것을 확인할 수 있었다. 오작동 요소로 확인된 IC pin 2번에 바리스터(Varistor)를 부착하고 11kV를 인가하여 시험한 결과 오작동 요소를 제거할 수 있었다.

• Journal of IKEEE
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• v.23 no.2
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• pp.474-478
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• 2019

In this paper, we analyze the degradation of receiving sensitivity due to the coupling between digital noise and mobile handset antenna using characteristic mode. First, we analyze the coupling mechanism between the antenna and digital noise, and analyze the role of the decoupling capacitor of the ground signal line, which is one of the ways to improve the antenna receiving sensitivity degradation due to camera noise. For the analysis, the digital signal line and the ground line of the FPCB of the camera module are modeled as a loop type feeder that excites the characteristic mode of the PCB ground, and improved model which has a ground line with a capacitor are analyzed.