• Proceedings of the KIEE Conference
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• 2001.11b
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• pp.216-218
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• 2001

The transformer role is very important in power system operation and control; also its price is very expensive. Therefore many kinds of the efforts for transformer protection have been executed. So for as, current differential relay(87) has been mainly used for transformer protection. But current differential relaying method has several troubles as followings. Differential current can be occurred by transformers inrush current between winding1 and winding2 of transformer when transformer is initially energized. Also harmonic restrained element used in current differential relaying method is one of the causes of relays mal-operation because recently harmonics in power system gradually increase by power switching devices(SVC, FACTS, DSC, etc). Therefore many kinds of effort have been executed to solve the trouble of current differential relay and one of them is method using ratio of increment of flux linkages(RIFL) of the primary and secondary windings. This paper introduces a novel protective relay for power transformers using RIFL of the primary and secondary windings. Novel protective relay successfully discriminates between transformer internal faults and normal operation conditions including inrush and this paper includes real time test results using RTDS(Real Time Digital Simulator) for novel protective relay. A novel protective relay was designed using the TMS320C32 digital signal processor and consisted of DSP module. A/D converter module, DI/DO module, MMI interface module and LCD display module and developed by Xelpower co., Ltd.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.412-415
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• 2008

In a research on the practical dye-sensitized solar cell, a study on a large module have preference because module must be able to generate the proper current that is possible to convert electrically. So the parallel connection of dye-sensitized solar cells which outputs a large current easily is essential. However, there is a current loss in a paralle connection of dye-sensitized solar cells and the loss becomes larger according to increasing the number of parallel connection. In this study, we analyzed the cause of the current loss in the parallel connection by using the equivalent circuit analysis. One DSC used in this experiment had an active area $8cm^2$(4.62cm$\times$1.73cm) and it attained a conversion efficiency of 5.43% under 1 sun illumination ($P_{in}$ of 100 mW/$cm^2$) using a solar simulator.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.100-106
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• 2009

A novel 8 V DC power source with an external series-parallel connection of 50 Dye-sensitized Solar Cells (DSCs) has been proposed. One DSC has the optimized length to width ratio of $5.2{\times}2.6\;cm$ and an active area $8\;cm^2$ ($4.62{\times}1.73\;cm$) which attained a conversion efficiency of 4.02%. From the electrochemical impedance spectroscopic analysis, it was found that the resistance elements related to the Pt electrode and electrolyte interface behave like that of diode and the series resistance corresponds to the sum of the other resistance elements. Surface morphology and sheet resistance of Pt counter electrode did not degrade the performance of the cell. This novel 8V-0.33A DC power source shows stable performance with an energy conversion efficiency of 4.24% under 1 sun illumination (AM 1.5, Pin of $100\;mW/cm^2$).

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.71-79
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• 2021

In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni₃Sn₄ intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.421-421
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• 2012

Cu(In,Ga)$Se_2$ (CIGS) 화합물은 직접천이형 반도체로 열적으로 매우 안정하고 에너지밴드갭이 1.04 eV로 이상적인 값에 가깝고, 특히 높은 광흡수계수를 가지기 때문에 박막 태양전지로서 커다란 응용 잠재력을 갖고 있는 광흡수층 재료이다. CIGS 화합물 박막 태양전지의 효율은 연구실에서는 ~20%를 높은 효율을 보고하고 있으며, 모듈급에서도 ~13%의 효율을 보이고 있다. 그러나 CIGS 박막 태양전지를 대면적 또는 양산화에 적용하기 위해서는 20년 이상의 장기적인 수명을 보장할 수 있는 내구성을 갖추어야 한다. 본 연구에서는 CIGS 모듈의 장기적인 신뢰성을 평가하기 위해 CIGS PV 모듈을 대상으로 대표적인 고온 고습 조건인 IEC-61646 규격을 이용하여 $85^{\circ}C$/85% RH에서 1000시간 동안 가속시험이 수행되었고, 고온 환경하에서 모듈의 성능 저하에 미치는 영향을 고찰하기 위해 모듈을 $85^{\circ}C$에서 1000시간 노출시켰다. 두 종류의 가속 스트레스시험 후에 모듈들의 외형적인 노화현상 및 전기적 열화 성능을 분석하였다. 또한 모듈의 효율저하의 원인을 규명하기 위해 모듈 구성 재료 중 충진재료로 사용하는 EVA sheet와 투명전극 AZO를 대상으로 고장분석을 수행하였다. AZO의 미세구조 관찰, 결정상 분석, XPS 분석 및 전기적 분석과 EVA sheet의 FT-IR 분석과 TG-DSC 분석들을 종합하여 CIGS PV 모듈의 성능저하의 원인을 규명하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05b
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• pp.15-18
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• 2004

피뢰기에 뇌 또는 이상전압과 같은 정격이상의 고장전류가 유입되어 발생하게 되는 순간적인 열 충격과 내부압력 상승은 폭탄이 내부에서 터지는 것과 같은 엄청난 양의 충격에너지이다. 본 연구에 있어서 폴리머 피뢰기의 제조에 사용된 모듈용 브레이드 복합재료는 압력해소 및 폭발 비산하지 않도록 하는 기능을 수행하도록 설계되어있다. 기존의 폴리머 피뢰기에 적용된 복합재료보다 충격에너지를 흡수하는 구조물에 유리한 브레이드 복합재료를 피뢰기 모듈의 제조에 도입한 것은 매우 의미 있는 일이라 판단된다. 따라서 본 연구에서는 열경화성 브레이드 복합재료를 제조하기 위하여 프리폼을 먼저 제작한 다음 금형에 삽입한 후 진공상태에서 수지를 주입하여 경화시키는 RTM공법을 이용하였다. 본 연구의 목적은 브레이드 패턴 및 방압개소 설계 등의 기초적인 자료조사 및 실험을 통하여 폴리머 피뢰기의 폭발 비산을 방지할 수 있는 압력해소 성능을 위한 기초 자료를 확보하고자 하는 것이다. 브레이드 복합재료의 기본적인 경화거동을 등온 및 동적 DSC를 이용하여 고찰하였고, 기본적인 전기적 특성을 평가하였으며, 방압개소를 가진 폴리머 피뢰기 모듈의 고장전류시험시 예상되는 열 충격에 대한 성능을 검증하기 위하여 열팽창계수를 측정하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).