• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.13-18
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• 2009

Building is a major energy consumer, and now many efforts are made to save energy in the design and using equipments. The most noticeable achievement in those efforts is a building energy performance assessment program. But most programs are not satisfying enough to provide exact meteorological data, and data source and calculation, and data collection period are not clearly defined. That is common in most of domestic programs. This study collects typical meteorological data in 16 items and analyzes them with Visual DOE 4.0 to compare with existing data. The comparison found that revised data shows a 11% increase on average during cooling period from June to September, and a 13% decrease on average during heating period from December to February, in terms of building heating and cooling load in a monthly basis.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.939-945
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• 2002

The rise throughput and the stability in the device fabrication can be obtained by applying chemical mechanical polishing (CMP) process in 0.18 $\mu\textrm{m}$ semiconductor device. However, it still has various problems due to the CMP equipment. Especially, among the CMP components, process variables are very important parameters in determining the removal rate and non-uniformity. In this paper, we studied the DOE (design of experiment) method in order to get the optimized CMP equipment variables. Various process parameters, such as table and head speed, slurry flow rate and down force, have investigated in the viewpoint of removal rate and non-uniformity. Through the above DOE results, we could set-up the optimal CMP process parameters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.711-714
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• 2004

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. However, it still has various problems to the CMP equipment, in particular, among the CMP components, process variables are very important parameters in determining the removal rate and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the interaction between the various parameters such as turntable and head speed, down force and back pressure during CMP. Using statistical analysis techniques, a better understanding of the interaction behavior between the various parameters and the effect on removal rate, no-uniformity and ETC (edge to center) is achieved.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.708-713
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• 2000

The design of experiment(DOE) is getting more attention in the engineering community since it is easy to understand and apply. Recently, engineering designers are adopting DOE with orthogonal arrays when they want to design products in a discrete design space. In this research, a design flow with orthogonal arrays is defined fur structural design according to the general DOE. The design problem is defined as a general structural optimization problem. Sensitivity information is evaluated by the analysis of variance(ANOVA), and an optimum design is determined from analysis of means(ANOM). Interactions between design variables are investigated to achieve additivity which should be valid in DOE. When strong interactions exit, a method is proposed. Some methods to consider the problem are suggested.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.109-114
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• 2005

The large injection molded parts technology such as instrument panel, front and rear bumper are presented for a precision molding. Some lead time and cost are required to product these part from design to mass product. Recently, CAE is widely used in product design, mold design and analysis of molding conditions to reduce time and cost. The optimal molding conditions can be obtained by DOE(Design of Experiment). The optimal design applications with CAE and DOE have been used in small molded parts. However, application to the large molded body is not reported. In this paper, optimization of injection molding process is studied for quality control in mass production of automobile bumper. Mold temperature difference is chosen through robust design of injection molding process, the molding process being optimized in term of shrinkage and deflection. The optimal conditions through DOE are validated by using injection molding analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.9 s.252
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• pp.1142-1147
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• 2006

A practical method for reducing the number of spot welds in automotive structures considering fatigue crack initiation life is suggested. At first, an influence index for the durability and the fatigue life of a spot weld itself is defined and then taken as the main effect of the DOE analysis. Spot welds that can be removed without serious reduction of durability through numerical experiments are selected by the results of DOE. The proposed method was applied to the shock tower and LCA(lower control arm) structure of a vehicle, which are important components in durability-related point of view.

• Applied Chemistry for Engineering
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• v.31 no.2
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• pp.138-146
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• 2020

Design of experiments (DOE) is a method that has been applied in the industry to improve value for many decades. This study provides an overview of 115 cases of statistical DOE applications in the field of chemical engineering. All cases were published in important scientific journals for the last ten years. The applied design type, the experiment size, the number of factors and levels affecting the response variable, and the area of application for the design were all analyzed. Obviously, the number of publications related with statistical DOE increased over time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.159-160
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• 2008

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.351-353
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• 2007

• Proceedings of the Optical Society of Korea Conference
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• 2002.11a
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• pp.98-99
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• 2002