• Title/Summary/Keyword: DGEBA

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Effects of Curing Agent Content and Post-curing Conditions on Dielectric Deterioration Characteristics of DGEBA/MDA/SN System (경화제 함량과 후기경화조건에 따른 DGEBA/MDA/SN계의 절연열화 특성)

  • 조영신;박수길;임기조;심미자;김상욱
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1997.11a
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    • pp.313-316
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    • 1997
  • The effects of aromatic curing agent of MDA contents and post curing conditions on dielectric deterioration characteristics of DGEBA/MDA/SN system were investigated. The dielectric properties were measured by using needle-plane electrode geometry under the commercial AC high electric field application. As the curing agent content increased, the dielectric breakdown strength increased and then decreased slightly. All the trees initiated from the tip of needle electrode and the shape of the tree in this system was a dendrite type.

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Dielectric Breakdown Characteristics of $Al_2O_3$ Filled DGEBA/MDA/SN System ($Al_2O_3$가 충전된 DGEBA/MDA/SN 계의 절연열화 특성)

  • Cho, Young-Shin;Shim, Mi-Ja;Kim, Sang-Wook
    • Proceedings of the KIEE Conference
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    • 1996.11a
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    • pp.209-211
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    • 1996
  • The dielectric breakdown characteristics of DGEBA/MDA/SN system filled with $Al_2O_3$ under AC high electric field were investigated. As the filler content increased, the dielectric breakdown strength increased, but decreased at higher filler content than 5 phr. The probability of defects such as air bubbles, peel between filler and epoxy resin insulator, etc. increase proportionally to filler contents. Fillers blockade the treeing growth and relax the electric field at the tip of electrical tree and the treeing propagation rate decreases so that the strength showed higher strength at lower filler content than 5 phr.

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Thermal Behavior of Nylon 6 and Bisphenol-A Polycarbonate Blends Compatibilized with an Epoxy Resin (에폭시 수지로 상용화된 Nylon 6와 비스페놀-A PC 블렌드의 열적거동)

  • Abdrhman, Mabrouk J.M.;Zhang, Liye;Zhou, Bing;Li, Hangquan
    • Polymer(Korea)
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    • v.32 no.6
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    • pp.523-528
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    • 2008
  • Diglycidyl ether of bisphenol-A (DGEBA) was selected as a compatibilizer in Nylon 6 and bisphenol-A polycarbonate (PC) blends. SEM revealed a much finer morphology in the presence of DGEBA. The thermal properties, such as glass transition, melting point, crystallization temperature and rate, of the blends were examined using DSC. Overall, the introduction of DGEBA caused a strong dependence of these thermal properties on the composition due to compatibilization.

A Study of Rheological Properties on Thermoinitiated Cationic Catalyst/DGEBA Curing System (DGEBA계 에폭시 수지의 양이온 열 개시 반응에 의한 유변학적 특성연구)

  • 이재락
    • The Korean Journal of Rheology
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    • v.10 no.2
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    • pp.92-97
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    • 1998
  • 열잠재성 경화제인 N-benzylpyrazinium hexafluoroantimonate (BPH)를 이용하여 함 량에 따른 DGEBA계 에폭시 수지의 경화반응에서의 유변학적 특서 및 반응속도를 연구하 였다. 경화시의 활성화 에너지를 Barrett 방법을 이용한 동적 DSC 측정방법으로 조사 하였 다. DSC 실험 결과 BPH의 함량이 증가할수록 활성화 에너지는 감소함을 알수 있었다. Rheomter를 이용하여 DGEBA/BPH 계의 유변학적 특성을 등온경화와 tdmdhsrud화 조건하 에서 살펴보았다. BPH의 함량이 증가함에 따라 겔화점 도달시간 빠르게 나타나는데 이는 낮아진 활성화 에너지에 기인한 것으로 사료된다. 두 번째 damping 피크를 이용하여 유리 화점을 측정하여 Time-Temperature-Transformation (T-T-T) cure diagram을 작성한 결 과 열잠재성 경화제의 특성인 일정온도 이상에서 활성이 나타남을 확인할수있었다.

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Effects of PGE-AcAm on the Tensile and Impact Properties of DGEBA/MDA System (DGEBA/MDA계의 인장 및 충격 특성에 미치는 PGE-AcAm의 영향)

  • Lee, Jae-Yeong;Sim, Mi-Ja;Kim, Sang-Uk
    • Korean Journal of Materials Research
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    • v.7 no.6
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    • pp.460-463
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    • 1997
  • 에폭시 수지 계의 경화반응 속도를 증가시키고 기계적 물성을 향상시키기 위해 합성 pheny1 glycidy1 ether(PGE)-acetamide(AcAm)를 diglycidy1 ether of bispenol A(DGEBA)/4,4'-methylene dianiline(MDA)계에 도입하였다. PGE와 AcAm을 2:1의 몰비로 혼합한 후 18$0^{\circ}C$에서 1시간 반응시켜서 PGE-AcAm을 합성하였다. 5phr의 PGE-AcAm이 첨가되었을 때 인장강도가 15% 개선되었으며, 그 이후로는 PGE-AcAm을 합성하였다. 5phr의 PGE-AcAm이 첨가되었을 때 인장강도가 15% 개선되었으며, 그 이후로는 PGE-AcAm의 함량에 관계없이 거의 비슷한 값을 나타내었다. 반면에유리전이 온도(Tg)와 충격강도는 PGE-AcAm의 함량이 증가함에 따라 감소하였다. 파단면은 PGE-AcAm이 첨가됨으로써 더 복잡한 형상을 나타내었다.

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Chemo-Mechanical Analysis of Bifunctional Linear DGEBA/Linear Amine (DDM, DDS) Resin Casting Systems (DGEBA/방향족 아민(DDM, DDS) 경화제의 벤젠링 사이의 관능기 변화가 물성 변화에 미치는 영향에 대한 연구)

  • 명인호;정인재;이재락
    • Composites Research
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    • v.12 no.4
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    • pp.71-78
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    • 1999
  • To determine the effect of chemical structure of linear amine curing agents on thermal and mechanical properties, standard epoxy resin DGEBA was cured with diaminodiphenyl methane (DDM), diaminodiphenyl sulphone (DDS) in a stoichiometrically equivalent ratio. From this work, the effect of aromatic amine curing agents. In contrast, the results show that the DGEBA/DDS cure system having the sulfone structure between the benzene rings had higher values in the conversion of epoxide, density, shrinkage (%), glass transition temperature, tensile modulus and strength, flexural modulus and strength than the DGEBA/DDM cure system having methylene structure between the benzene rings, whereas the DGEBA/DDM cure system presented higher values in the maximum exothermic temperature, thermal expansion coefficient, and thermal stability. These results are caused by the relative effects of sulfone group having strong electronegativity and methylene group having (+) repulsive property and stem from the effect of the conversion ratio of epoxide group. The result of fractography shows that the each grain size of the DDM/DGEBA system with feather-like structure is larger than that of the DDS/DGEBA system.

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A Study on Thermal and Mechanical Interfacial Properties of Difunctional Epoxy/PMMA Blends (이관능성 에폭시/폴리메틸메타크릴레이트 블랜드의 열적 및 기계적 계면 특성)

  • 박수진;김기석;이재락;민병각;김영근
    • Composites Research
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    • v.17 no.1
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    • pp.10-17
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    • 2004
  • In this work, the blend system prepared from epoky(DGEBA)/polymethylmethacrylate(PMMA) was investigated in thermal and mechanical interfacial property measurements. The thermal properties were carried out by DSC, DMA, and TGA measurements. Also, the surface free energy and fracture toughness were determined by contact angle and critical stress intensity factor($K_{IC}$), respectively. And the fracture surface was observed by SEM after $K_{IC}$ tests. As experimental results, the curing temperature and glass transition temperature were slightly increased in addition of PMMA. Surface free energy of the blends showed an improved value at low contents of PMMA which could be attributed to the both increasings of London dispersive and polar components. From measurement of $K_{IC}$ of the blends, the highest value was found at 5 phr. This was due to the increasing of compatibility or physical interaction in macromolecular chains between DGEBA and PMMA of the blends.

Zn-Ion Coated Structural $SiO_2$ Filled LDPE: Effects of Epoxy Resin Encapsulation

  • Reddy C. S.;Das C. K.;Agarwal K.;Mathur G N.
    • Macromolecular Research
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    • v.13 no.3
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    • pp.223-228
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    • 2005
  • In the present work, a low-density polyethylene (LDPE) composite, filled with Zn-ion coated structural silica encapsulated with the diglycidyl ether of bisphenol-A (DGEBA), was synthesized using the conventional melt-blending technique in a sigma internal mixer. The catalytic activity of the Zn-ions (originating from the structural silica) towards the oxirane group (diglycidyl ether of bisphenol-A (DGEBA): encapsulating agent) was assessed by infrared spectroscopy. Two composites, each with a filler content of $2.5 wt\%$ were developed. The first one was obtained by melt blending the Zn-ion coated structural silica with LDPE in a co-rotating sigma internal mixer. The second one was obtained by melt blending the same LDPE, but with DGEBA encapsulated Zn-ion coated structural silica. Epoxy resin encapsulation of the Zn-ion coated structural silica resulted in its having good interfacial adhesion and a homogeneous dispersion in the polymer matrix. Furthermore, the encapsulation of epoxy resin over the Zn-ion coated structural silica showed improvements in both the mechanical and thermal properties, viz. a $33\%$ increase in the elastic modulus and a rise in the onset degradation temperature from 355 to $371^{\circ}C$, in comparison to the Zn-ion coated structural silica.

Effects of Succinonitrile on the Thermal Properties of diglycidyl ether of bisphenol A/ methylene dianiline system (Succinonitrile 이 diglycidyl ether of bisphenol A/ methylene dianiline계의 열적 성질에 미치는 영향)

  • Sim, Mi-Ja;Kim, Sang-Uk
    • Korean Journal of Materials Research
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    • v.3 no.2
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    • pp.145-150
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    • 1993
  • Abstract In order to improve the brittleness of diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA) system, the reactive additive, succinonitrile(SN) was added to DGEBA/MDA system. In this case, thermal properties, glass transition temperature(Tg), thermal decomposition temperature(Td) and 5% weight loss temperature($T_{-5%}$)were investigated according to the different SN contents and cure temperatures. Tg, Td and $T_{-5%}$ decreased as the SN content was increased, but increased as the cure temperature was increased.

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Estimation of Thermal Stability for DGEBA/MDA/PGE-AcAm/CTBN System by TG Analysis (열중량 분석에 의한 DGEBA/MDA/PGE-AcAm/CTBN계의 열적 안정성 평가)

  • Lee, Jae-Yeong;Choe, Hyeong-Gi;Sim, Mi-Ja;Kim, Sang-Uk
    • Korean Journal of Materials Research
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    • v.7 no.3
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    • pp.229-233
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    • 1997
  • Estimation of thermal stability for diglycidy1 ether of bisphenol A(DGEMA)/4, 4'-methylene dianiline (MDA)/pheny1 glycidy1 ether(PGE)-acetamide(AcAm)/carboxy1-terminated acrylonitrile butadiene copolymer (CTBN) system was studied by thermogravimetry(TG) analysis. To get activation energy for thermal degradation, Freeman & Carroll, Kissinger, and Flynn & Wall expressions were used. The activation energy of Freeman & Wall expression was 112.9kj/mol, that of Kissinger expression was 151.5 kj/mol and that of Flynn & Wall was 168.3kj/mol.

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