• Title/Summary/Keyword: D3-modules and D4-modules

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3:1 Bandwidth Switch Module by Using GaAs PH Diode (GaAs PIN Diode를 이용한 3:1 대역폭 스위치 모듈)

  • 정명득;이경학;박동철
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.13 no.5
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    • pp.451-458
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    • 2002
  • Absorptive type SP3T(Single Pole Three Throw) and SP8T switch modules over the 6-18 GHz are designed and fabricated. The epitaxial structure of GaAs PIN diode for switch modules are designed for low loss and high power capability. The maximum input power of SP3T and SP8T switch modules are 2 W and 1 W, respectively. The switching time with driver circuit is less than 130 nsec. The maximum insertion loss of SP3T switch module and SP8T module shows 2.8 dB and 4.2 dB, respectively. The isolation between input port and output port is more than 55 dB. Two switch modules for electronic warfare system have passed the environment tests of the related test items.

A DECOMPOSITION THEOREM FOR UTUMI AND DUAL-UTUMI MODULES

  • Ibrahim, Yasser;Yousif, Mohamed
    • Bulletin of the Korean Mathematical Society
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    • v.58 no.6
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    • pp.1563-1567
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    • 2021
  • We show that if M is a Utumi module, in particular if M is quasi-continuous, then M = Q ⊕ K, where Q is quasi-injective that is both a square-full as well as a dual-square-full module, K is a square-free module, and Q & K are orthogonal. Dually, we also show that if M is a dual-Utumi module whose local summands are summands, in particular if M is quasi-discrete, then M = P ⊕ K where P is quasi-projective that is both a square-full as well as a dual-square-full module, K is a dual-square-free module, and P & K are factor-orthogonal.

V-band Self-heterodyne Wireless Transceiver using MMIC Modules

  • An, Dan;Lee, Mun-Kyo;Lee, Sang-Jin;Ko, Du-Hyun;Jin, Jin-Man;Kim, Sung-Chan;Kim, Sam-Dong;Park, Hyun-Chang;Park, Hyung-Moo;Rhee, Jin-Koo
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.5 no.3
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    • pp.210-219
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    • 2005
  • We report on a low-cost V-band wireless transceiver with no use of any local oscillator in the receiver block using a self-heterodyne architecture. V-band millimeter-wave monolithic IC (MMIC) modules were developed to demonstrate the wireless transceiver using coplanar waveguide (CPW) and GaAs PHEMT technologies. The MMIC modules such as the MMIC low noise amplifier (LNA), medium power amplifier (MPA) and the up/down-mixer were installed in the transceiver system. To interface the MMIC chips with the component modules for the transceiver system, CPW-to-waveguide fin-line transition modules of WR-15 type were designed and fabricated. The fabricated LNA modules showed a $S_{21}$ gain of 8.4 dB and a noise figure of 5.6 dB at 58 GHz. The MPA modules exhibited a gain of 6.9 dB and a $P_{1dB}$ of 5.4 dBm at 58 GHz. The conversion losses of the up-mixer and the down-mixer module were 14.3 dB at a LO power of 15 dBm, and 19.7 dB at a LO power of 0 dBm, respectively. From the measurement of V-band wireless transceiver, a conversion gain of 0.2 dB and a $P_{1dB}$ of 5.2 dBm were obtained in the transmitter block. The receiver block showed a conversion gain of 2.1 dB and a $P_{1dB}$ of -18.6 dBm. The wireless transceiver system demonstrated a successful data transfer within a distance of 5 meters.

Development of the 3-D Fracture Network Analysis and Visualization Software Modules (삼차원 불연속면 연결구조 해석 및 가시화 소프트웨어 모듈 개발)

  • Noh, Young-Hwan;Choi, Yosoon;Um, Jeong-Gi;Hwang, Sukyeon
    • Tunnel and Underground Space
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    • v.23 no.4
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    • pp.261-270
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    • 2013
  • As part of the development of the 3-D geologic modeling software, this study addresses on new development of software modules that can perform the analysis and visualization of the fracture network system in 3-D. The developed software modules, such as BOUNDARY, DISK3D, FNTWK3D, CSECT and BDM, are coded on Microsoft Visual Studio platform using the MFC and OpenGL library supported by C++ program language. Each module plays a role in construction of analysis domain, visualization of fracture geometry in 3-D, calculation of equivalent pipes, production of cross-section map and management of borehole data, respectively. The developed software modules for analysis and visualization of the 3-D fracture network system can be used to tackle the geomechanical problems related to strength, deformability and hydraulic behaviors of the fractured rock masses. All these benefits will further enhance the economic competitiveness of the domestic software industry.

Development of a Linear Power Amplifier Module for PCS Handy Phone (휴대용 PCS 단말기를 위한 선형 전력증폭기 모듈의 구현)

  • 노태문;한기천;김영식;박위상;김범만
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.8 no.6
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    • pp.558-567
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    • 1997
  • Linear power amplifier modules with high-efficiency have been developed for PCS handy phone. These modules were designed using extracted large-signal models of MESFETs and harmonic balance simulation. The modules are intended for low-tier and high-tier at the operation frequency range of 1750 ~ 1780 MHz. For low-tier module, the output power and $IMD_3$ were 23.2 dBm and 31 dBc, respectively, at power-added efficiency of 34% with the supply drain bias of 3.6 V. For high-tier module, the output power and $IMD_3$ were 272.2 dBm and 31 dBc, respectively, at power-added efficiency of 33% with the supply drain bias of 4.2 V. These linear power amplifier modules are suitable for PCS handy phone.

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Development of V-band Wireless Transceiver using MMIC Modules (MMIC 모듈을 이용한 V-band 무선 송수신 시스템의 구축)

  • Lee, Sang-Jin;An, Dan;Lee, Mun-Kyo;Go, Du-Hyun;Jin, Jin-Man;Kim, Sung-Chan;Kim, Sam-Dong;Park, Hyun-Chang;Park, Hyung-Moo;Rhee, Jin-Koo
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.575-578
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    • 2005
  • We report on a low-cost V-band wireless transceiver with no use of any local oscillator in the receiver block using a self-heterodyne architecture. V-band Microwave monolithic IC (MMIC) modules were developed to demonstrate the wireless transceiver using coplanar waveguide (CPW) and GaAs PHEMT technologies. The MMIC modules such as the MMIC low noise amplifier (LNA), medium power amplifier (MPA) and the up/down-mixer were installed in the transceiver system. To interface the MMIC chips with the component modules for the transceiver system, CPW-to-waveguide fin-line transition modules of WR-15 type were designed and fabricated. The fabricated LNA modules showed a $S_{21}$ gain of 8.4 dB and a noise figure of 5.6 dB at 58 GHz. The MPA modules exhibited a gain of 6.9 dB and a $P_1$ $_{dB}$ of 5.4 dBm at 58 GHz. The conversion losses of the up-mixer and the down-mixer module were 14.3 dB at a LO power of 15 dBm, and 19.7 dB at a LO power of 0 dBm, respectively. From the measurement of V-band wireless transceiver, a conversion gain of 0.2 dB and a P $_{1dB}$ of 5.2 dBm were obtained in the transmitter block. The receiver block showed a conversion gain of 2.1 dB and a P $_{1dB}$ of -18.6 dBm. The wireless transceiver system demonstrated a successful data transfer within a distance of 5 meters.

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Case Study on 5kWp Transparent Thin-Film BIPV System (5kW급 투광형 박막 BIPV시스템의 실증연구)

  • An, Young-Sub;Kim, Sung-Tae;Lee, Sung-Jin;Song, Jong-Hwa;Hwang, Sang-Kun;Yoon, Jong-Ho
    • Journal of the Korean Solar Energy Society
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    • v.30 no.4
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    • pp.29-35
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    • 2010
  • This study has been carried out empirical research on Transparent Thin-film BIPV modules, BIPV modules installed on the exterior of the building are applied a laminated module 1kWp, double-glazing module 3kWp and triple-glazing module 1kWp. Applied to the total capacity of BIPV modules are 5kWp. In this study, design and construction process of BIPV systems is presented. In addition, through monitoring of the BIPV system, the temperature and the power characteristics of each module were analyzed. During the measurement period, the module temperature measurement results, the maximum surface temperature of $51.5^{\circ}C$ triple-glazing BIPV module showed the highest, followed by double-glazing BIPV module $49.1^{\circ}C$, $44.7^{\circ}C$ laminated modules, respectively. Power output results, the daily average double-layer modules showed 4.10kWh/day, triple-glazing module 1.57kWh, respectively 1.81kWh laminated modules. In particular, the power efficiency of triple-glazing BIPV module was lower than the power efficiency of the laminated BIPV module. This phenomenon is considered to be affected by the module temperature. In the future, BIPV modules in this study the relationship between module temperature and power characteristics plans to identify.

A Study on Fashion Design Using Shape Grammar (형상문법(Shape Grammar)을 활용한 패션디자인 연구)

  • Soo Kyung Ko;Chul Yong Choi
    • Journal of the Korea Fashion and Costume Design Association
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    • v.25 no.4
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    • pp.123-132
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    • 2023
  • The term 'module' is an architectural term. It refers to the components or systems that make up a finished product. As industries develop, modules have become one of the methods that can create diverse and creative designs. Traditional modular fashion design mainly focused on structural methods, such as the combination, assembly, overlap, and arrangement of modules, as well as the tessellation of geometric shapes. However, in this paper, significance lies in exploring the application of shape grammar, a design method in architecture, to fashion design. It aims to search for ways to express three-dimensional designs, derive designs that can be worn and produced, and propose fashion design by applying the rules of shape grammar to the design process. Through this analysis, the paper aims to examine the methods and characteristics of shape grammar. The research method of this paper is as follows. First, by utilizing optimized programs for implementing the modules of shape grammar, it was possible to propose a method for producing modules of shape grammar and suggest module designs. Additionally, effective methods of representation using the Clo 3D program were explored in the design development process. Second, by applying shape grammar to the fashion design process, five-dimensional modular fashion designs were proposed, including a bolero, dress 1, dress 2, setup, and coat. The proposed modular fashion design using shape grammar in this paper provides a rational design process that differentiates itself from traditional modular fashion design. By formalizing the shapes between modules and creating rules, it overcomes the limitations of design that rely on the designer's intuition or sensibility and enables the development of more diverse modular fashion designs. This application of shape grammar in fashion design can provide an important direction in exploring a sustainable fashion industry.

Heat transfer enhancement in electronic modules using a turbulence promoter (난류촉진체에 의한 전자칩의 열전달촉진에 관한 연구)

  • 박시우;정인기
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.11 no.6
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    • pp.861-870
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    • 1999
  • An experimental study was carried out to investigate the effects of using various shapes of turbulence promoter on the heat-transfer enhancement of 2-D and 3-D arrays of rectangular modules in a rectangular channel for design of noiseless and low-powered cooling fan in the electronic systems. Measurements of heat/mass transfer coefficients were made using a naphthalene sublimation technique, and the friction factors were measured for Reynolds numbers in the range$3.3{\time}10^3$~$1.6{\time}10^4$. Flow visualization was peformed by oil-film method. It was found that heat transfer and pressure drop increased remarkably due to the existence of the promoter. The results of the performance evaluation based on equal pumping power were showed that substantial heat-transfer enhancement was obtained at low Reynolds number range by use of a turbulence promoter.

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A Design for Extension Codec based on Legacy Codec (레거시 코덱 기반 확장 코덱 설계)

  • Young, Su Heo;Bang, Gun;Park, Gwang Hoon
    • Journal of Broadcast Engineering
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    • v.20 no.4
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    • pp.509-520
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    • 2015
  • A design for the merge mode of three dimensional High Efficiency Video Coding (3D-HEVC) is proposed in this paper. The proposed design can reduce the implementation complexity by removing the duplicated modules of the HEVC. For the extension codec, the implementation complexity is as crucial as coding efficiency, meaning if possible, extension codec needs to be easily implemented through by reusing the design of the legacy codec as-is. However, the existing merging process of 3D-HEVC had been built-in integrated in the inside of the HEVC merging process. Thus the duplicated merging process of HEVC had to be fully re-implemented in the 3D-HEVC. Consequently the implementation complexity of the extension codec was very high. The proposed 3D-HEVC merge mode is divided into following two stages; the process to reuse the HEVC modules without any modification; and the reprocessing process for newly added and modified merging modules in 3D-HEVC. By applying the proposed method, the re-implemented HEVC modules, which accounted for 51.4% of 3D-HEVC merge mode confirmed through the operational analysis of algorithm, can be eliminated, while maintaining the same coding efficiency and computational complexity.