• Structural Engineering and Mechanics
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• v.50 no.4
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• pp.459-469
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• 2014

One of the most important structural components of steel structures is the column-base connections which are obliged to transfer horizontal and vertical loads safely to the reinforced concrete (RC) or concrete base. The column-base connections of steel or composite steel structures can be organized both moment resistant and non-moment resistant leading to different connection styles. Some of these connection styles are ordinary bolded systems, socket systems and embedded systems. The structures are frequently exposed to cycling lateral loading effects causing fatal damages on connections like columns-to-beams or columns-to-base. In this paper, connection of steel column with RC base was investigated analytically and experimentally. In the experiments, bolded connections, socket and embedded connection systems are taken into consideration by applying cyclic lateral loads. Performance curves for each connection were obtained according to experimental and analytical studies conducted and inelastic behavior of connections was evaluated accordingly. The cyclic lateral performance of the connection style of embedding the steel column into the reinforced concrete base and strengthening of steel column in upper level of base connection was found to be higher and effective than other connection systems. Also, all relevant test results were discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

• Journal of the Korean Solar Energy Society
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• v.30 no.5
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• pp.63-68
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• 2010

To guarantee life time more than 20 years for manufacturer without stopping photovoltaic(PV) system, it is really important to test the module in realistic time and condition compared to outside weather. In here, we tested PV modules in highly stressed condition compared to IEC standards. In IEC 61215 and IEC 61646 standards, damp-heat, thermal cycle(TC200) and mechanical test are main test items for evaluating long-term durability of PV module in controlled temperature and humidity condition. So in this paper, we have lengthened the test time for TC200 and damp-heat test and increased the loading stress on surface of module. Through this test, we can get some clue of proper the method for measuring realistic life cycle of PV modules and suggested the minimum time for PV test method. The detail description is specified as the following paper.

• Magazine of the Korea Concrete Institute
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• v.9 no.3
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• pp.137-147
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• 1997

Interface shear strength of' concrete under static loading and deterioratiion of interface strength by fatigue loading in shear were experimentally investigated using composite beam test specimens. Thirteen beams were constructed. Five composite beams were tested statically until interface delaminations were observed in the static tests. Seven composite beam and one monolithically cast beam were subjected to two to three million cycles of fatigue load. Test variables were interface roughness, interface shear reinforcement, and presence of interface bond. The average interface shear strength of the composite beams with bonded-rough interface was 6, 060 kPa. No interface delamination was observed after cycling for the composite beams with bonded - rough interface and interface bond was not influenced by repeated application of the shear stress of 2.000 kPa(about 1/3 of the static interface shear strength). Smooth interface and unbonded-rough interface with shear reinforcement deteriorated under repeated shear loading.

• Structural Monitoring and Maintenance
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• v.1 no.3
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• pp.273-292
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• 2014

The effectiveness of a retrofitting method for concrete columns with particular weaknesses is experimentally evaluated and presented in this paper. Structural deficiencies namely the inadequacy of transverse reinforcement and short length of lap splices are very common in columns found in structures built prior to the 1960s and 1970s. Recent earthquakes worldwide have caused severe damages and collapses of these structures. Nevertheless, the importance of improving the load transfer capacity between the deficiently lap-spliced bars is usually underestimated during the strengthening procedures applied in old buildings, though critical for the safety of the residents' lives. Thus, the seismic performance of the enhanced columns is frequently overestimated. The retrofitting approach presented herein involves reinforced concrete jacketing of the column sub-assemblages and welding of the lap-spliced bars to prevent the splice failure and conform to the provisions of modern design Codes. The cyclic lateral loading response of poorly confined original column specimens with insufficient lap splices and the seismic behavior of the retrofitted columns are compared. Test results clearly demonstrate that the retrofitting procedure followed is an effective way of significantly improving the seismic performance of substandard columns found in old buildings.

• Geomechanics and Engineering
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• v.17 no.4
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• pp.393-403
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• 2019

The cycling impact test of red sandstone soil under different axial pressure and different impact loads are conducted to reveal the mechanical properties and energy consumption mechanism of red sandstone soil with static-dynamic coupling loading. The results show that: Under the action of different axial pressure and different impact loads, the peak stress of the specimen increases, and then tends to be stable with the times of impact. With the increase of impact times, the specific energy absorption value of the red sandstone soil specimen is increased first and then gentle development trend. When the impact loads are certain, the larger the axial pressure is, the smaller the peak value of energy absorption, which indicates that the energy utilization rate is not high under the condition of large axial pressure. Through the analysis of energy utilization, it is found that the smaller the impact load, the higher the energy utilization rate. The greater the axial pressure, the lower the energy utilization rate. when the axial pressure is large, the impact loads corresponding to the maximum values of reflectivity, transmissivity and absorptivity are the same. The relationship between reflectivity and transmissivity is negatively correlated.

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.33 no.12
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• pp.37-44
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• 2017

Due to structural characteristics, construction costs and duration of a modular system would be saved by minimizing the schedule on the job site. As such, it is crucial to develop a connection that can guarantee stiffness while allowing for simple assembling. Particularly, the mid- to high-rise construction of the modular system necessitates the securing of the structural stability and seismic performance of multi-unit frames and connections, and thus, the stiffness of unit-assembled structures needs to be re-evaluated and designed. However, evaluating a frame consisting of slender members and reinforcing materials is a complicated process. Therefore, the present study aims to examine the structural characteristics of a modular unit connection based a method for reinforcing connection brackets and hinges while minimizing the loss of the cross section. Toward this end, the study modeled the beam-to-column connection of a modular system with the proposed connection, and produced a specimen which was used to perform a cycling loading test. The study compared the initial stiffness, the attributes of the hysteretic behavior, and the maximum flexural moment, and observed whether the model acquired the seismic performance, compared to the flexural strength of the steel moment frame connection that is required by the Korean Building Code. The test results showed that the proposed connection produced a similar initial stiffness value to that of the theoretical equation, and its maximum strength exceeded the theoretical strength. Furthermore, the model with a larger ceiling bracket showed higher seismic performance, which was further increased by the reinforcement of the plate.

• The korean journal of orthodontics
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• v.37 no.6
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• pp.432-439
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• 2007

The purpose of this study was to evaluate the influence of intraoral temperature changes on the orthodontic force level of a superelastic nickel-titanium alloy wire. Methods: Nickel-titanium archwires of $0.016"{\times}0.022"$ thickness were tested with a three point bending test setup, and temperature changes were applied. The force level changes according to temperature changes were measured at a 1.5 mm deflection during the loading phase and a 1.5 mm deflection during the unloading phase from a deflection to 3.1mm. Ten cycles of thermal cycling from baseline $(37^{\circ}C)$ to cold $(20^{\circ}C)$ or hot $(50^{\circ}C)$temperature were applied. Results: Alter thermal cycling, the force level during the loading phase decreased and the force level during the unloading phase increased even after the temperature was changed to the initial $37^{\circ}C$. Conclusions: The results suggest that the orthodontic force level can not return to the initial force level after temperature changes. When applying superelastic nickel-titanium archwires, we must consider that a lighter force than the loading force and a heavier force than the unloading force will be applied after intraoral temperature changes caused by eating and drinking.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.