• Journal of the Korean Society for Heat Treatment
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• v.12 no.4
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• pp.303-312
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• 1999

An investigation of the CrMoV rotor steel weldment which experienced by cyclic thermal aging heat treatment and as-received condition was performed. This evaluation was carried out to confirm whether this type of weldment is appropriate for the service environment in terms of microstructural examinations, microhardness measurements and tensile tests. The cyclic thermal aging heat treatment, containing continuous heating and cooling thermal cycle was programmed to simulate the real rotor service condition. The heat treatment was performed for 40 cycles(5920hrs). The results indicated that the weldment was composed of 4 different regions such as heat affected zone of the base metal, butter weld(initial weld), full thickness weld(final weld) and the base metal. The double welding process was applied to eliminate the susceptibility of reheat cracking at heat affected zone of base metal. The grain refinement at the HAZ due to the welding process could reduce the possibility of cracking susceptibility, but its tensile properties was appeared to be low due to the weld metal in as-received condition. The benefit effect, grain refinement was extended with carbides coarsening during the cyclic thermal aging heat treatment. However the poor mechanical properties of the weldment was more degraded as undergoing the heat treatment.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.175-180
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• 2016

Nondestructive evaluation for material health monitoring is important in aerospace industries. Composite laminates are exposed to heat cyclic loading and humid environment depending on flight conditions. Cyclic heat loading and moisture absorption may lead to material degradation such as matrix breaking, debonding, and delamination. In this paper, the moisture absorption ratio was investigated by measuring the Lamb wave velocity. The composite laminates were manufactured and subjected to different thermal aging cycles and moisture absorption. For various conditions of these cycles, not only changes in weight and also ultrasonic wave velocity were measured, and the Lamb wave velocity at various levels of moisture on a carbon-epoxy plate was investigated. Results from the experiment show a linear correlation between moisture absorption ratio and Lamb wave velocity at different thermal fatigue stages. The presented method can be applied as an alternative solution in the online monitoring of composite laminate moisture levels in commercial flights.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.427-434
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• 2004

Ferritic stainless steel is recently used in high temperature structures because of its good properties of thermal fatigue resistance, corrosion resistance, and low price. Tensile and low-cycle fatigue (LCF) tests on 429EM stainless steel used in exhaust manifold were performed at several temperatures from room temperature to 80$0^{\circ}C$. Elastic Modulus, yield strength, and ultimate tensile strength monotonically decreased when temperature increased. Cyclic hardening occurred considerably during the most part of the fatigue life. Dynamic strain aging was observed in 200~50$0^{\circ}C$, which affects the cyclic hardening behavior. Among the fatigue parameters such as plastic strain amplitude, stress amplitude, and plastic strain energy density (PSED), PSED was a proper fatigue parameter since it maintained at a constant value during LCF deformation even though cyclic hardening occurs considerably. A phenomenological life prediction model using PSED was proposed considering the influence of temperature on fatigue life.

• Proceedings of the KIEE Conference
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• 2008.05a
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• pp.131-132
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• 2008

This paper describes a method to estimate the thermal lifetime of coil used in the dry-type molded transformer which is widely used in the domestic distribution system. In order to reduce the testing time, temperature accelerated aging test is planned. Finally, the thermal lifetime estimation method is composed of a temperature aging test and a cyclic test of temperature, humidly and lightning impulse voltage withstand test.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2183-2190
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• 2000

A thermal aging is observed in a primary reactor cooling system(RCS) made of a casting stainless steel when the RCS is exposed for long period at the reactor operating temperature, 290~3300C An investigation of effects of thermal aging on a low cycle fatigue characteristics included a stress variations caused by a reactor operation and trip, is required. The purpose of the present investigation is to find an effect of a thermal aging of the CF8M on a low cycle fatigue life. The specimen of CF8M are prepared by an artificially accelerated aging technique holding 300 and 1800hr at 4300C respectively. The low cycle fatigue tests for the virgin and two aged specimens are performed at the room temperature for various strain amplitudes($\varepsilon$ta), 0.3, 0.5, 0.8, 1.0, 1.2 and 1.5% strain. Through the experiment, it is found that the fatigue life is rapidly reduced with an creasing of the aging time. The experimental fatigue life estimation formulas between the virgin and two aged specimen are obtained and are proposed to a analysis purpose.

• Nuclear Engineering and Technology
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• v.40 no.3
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• pp.239-250
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• 2008

If there is a water flow with a range of temperature inside a pipe, the wanner water tends to float on top of the cooler water because it is lighter, resulting in the upper portion of the pipe being hotter than the lower portion. Under these conditions, such thermal stratification can play an important role in the aging of nuclear power plant piping because of the stress caused by the temperature difference and the cyclic temperature changes. This stress can limit the lifetime of the piping, even leading to penetrating cracks. Investigated in this study is the effect of thermal stratification on the structural integrity of the pressurizer surge line, which is reported to be one of the pipes most severely affected. Finite element models of the surge line are developed using several element types available in a general purpose structural analysis program and stress analyses are performed to determine the response characteristics for the various types of top-to-bottom temperature differentials due to thermal stratification. Fatigue analyses are also performed and an allowable environmental correction factor is suggested.

• The Journal of Advanced Prosthodontics
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• v.12 no.4
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• pp.218-224
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• 2020

PURPOSE. The objectives of this study were to evaluate the fracture strength and fracture patterns of provisional crowns fabricated from different materials and techniques after receiving stress from a simulated oral condition. MATERIALS AND METHODS. A monomethacrylate-based resin (Unifast Trad) and a bis-acryl-based (Protemp 4) resin were used to fabricate provisional crowns using conventional direct technique. A milled monomethacrylate resin (Brylic Solid) and a 3D-printed bis-acrylate resin (Freeprint Temp) were chosen to fabricate provisional crowns using the CAD/CAM process. All cemented provisional crowns (n=10/group) were subjected to thermal cycling (5,000 cycles at 5°-55℃) and cyclic occlusal load (100 N at 4 Hz for 100,000 cycles). Maximum force at fracture was tested using a universal testing machine. RESULTS. Maximum force at fracture (mean ± SD, N) of each group was 657.87 ± 82.84 for Unifast Trad, 1125.94 ± 168.07 for Protemp4, 953.60 ± 58.88 for Brylic Solid, and 1004.19 ± 122.18 for Freeprint Temp. One-way ANOVA with Tamhane post hoc test showed that the fracture strength of Unifast Trad was statistically significantly lower than others (P<.01). No statistically significant difference was noted among other groups. For failure pattern analysis, Unifast Trad and Brylic Solid showed less damage than Protemp 4 and Freeprint Temp groups. CONCLUSION. Provisional crowns fabricated using the CAD/CAM process and the conventionally fabricated bis-acryl resins exhibited significant higher fracture strength compared to conventionally fabricated monomethacrylate resins after the aging regimen. Therefore, CAD/CAM milling and 3D printing of provisional restorations may be good alternatives for long term provisionalization.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.11
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• pp.2913-2921
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• 1994

In SMA(shape memory alloy), the degradation by fatigue is one of the most important problems to be overcome, when SMA is used for robot-actuator material. The actuator is operated repeatitively for long time and its repeating operation develops the fatigue degradation of SMA. The fatigue degradation changes the transformation temperature and deformation behavior and results in inaccurate operation control of robot. Accordingly, the changing behavior of transformation temperature and deformation which results from repeating operation is to be investigated in advance and the scheme to resolve those problems have to be made for the design of actuator. In this study, the fatigue tests were carried out on SMA specimens prepared to have different condition of aging time and pre-strain with the direct-current heating-cooling method, which was a general method of operation in robot actuators. The behavior of transformation temperature and deformation were examined and analyzed in each specimen and the study was performed to establish the optimistic manufacturing condition of SMA against the fatigue degradation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.