• Title/Summary/Keyword: Cutting machine

Search Result 1,298, Processing Time 0.023 seconds

Development of Post-Processor and Cutting Motion Simulator for 5-axis CNC Laser Cutting Machine (5축 레이저 절단기용 포스트프로세서 및 절단 모션 시뮬레이터 개발)

  • Kang, Jae-Gwan
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.8 no.4
    • /
    • pp.7-13
    • /
    • 2009
  • Five-axis laser cutting has great advantages when it is applied to 3-dimensional machining requiring high cutting quality. For developing 5-axis CNC laser cutting systems, however, many problems such as rotating a laser head or a working table, 5-axis servo-control mechanism, tool path generation and post processing, and collision avoidance between a laser head and a work-piece should be solved. In this paper, we deal with developing a dedicated CAM system based on UG-NX3 for 5-axis laser cutting machine. Two essential modules such as post-processor and cutting motion simulation was developed. The developed system was applied to cutting curve defined on 3-D workpiece in order to show the validity of the proposed methods.

  • PDF

Design Alterations of a Pipe Cutting Machine for the Improved Precision Machining (가공정도 향상을 위한 Pipe Cutting Machine의 설계 개선)

  • Kil, Sa Geun;Ro, Seung Hoon;Shin, Ho Beom;Kim, Young Jo;Kim, Dong Wook;Noh, Ho Chul
    • Journal of the Semiconductor & Display Technology
    • /
    • v.17 no.3
    • /
    • pp.53-58
    • /
    • 2018
  • The modern industry requires the precision machining as well as the high productivity. The machine tool structure should be evaluated in aspects such as durability, static stability, precision rate and the dynamic stability which is one of the most critical characteristics in determining the magnitude of vibrations. In this study, the dynamic properties of a pipe cutting machine were investigated to analyze the structural vibrations of the machine, and further to improve the structural stability and precision machining. Frequency response test and computer simulation have been utilized for the analysis and the design alterations. And the result shows that proposed design alterations can reduce the vibrations of the machine substantially.

A Study on Indentification of Machine Tool Dynamics by Impulse Shock (충격력 에 의한 공작기계 동특성 규명 연구)

  • 신민재;이종원
    • Transactions of the Korean Society of Mechanical Engineers
    • /
    • v.7 no.2
    • /
    • pp.138-144
    • /
    • 1983
  • To evaluate the dynamic characteristics of machine tool system, the system is modelled as a closed-loop system composed of cutting process and improved machine tool structures. The proposed machine tool structure model is constructed in consideration of energy transfer through the system. A new methodology to identify the machine tool dynamics by adopting impulse response and impulse cutting techniques is also proposed. It is shown that the methodology is successfully applied to a machine tool system to identify its dynamic characteristics employing the improved model.

Development of the Freeform Master I - a desktop RP machine based on a new sheet lamination process (정전기 방식을 이용한 박판 적층형 쾌속조형기술에 관한 연구)

  • 박정욱;이관행
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2000.05a
    • /
    • pp.767-770
    • /
    • 2000
  • A novel process is newly developed for building RP(Rapid Prototyping) parts using a sheet lamination technique. The build process of existing sheet lamination type RP machines consists of the following steps : feeding, lamination and cutting. In this process, the laminated part of an object is often scratched by a cutter or damaged by a laser beam due to the cutting operation preceded by lamination, In addition, decubing of the unused portion from the laminated block is difficult. In the new process, cutting operation is performed before lamination. The cutting operation takes place while a paper sheet is firmly attached on the plate using electrostatic force. Then liquid glue is applied to the calculated region of the given contour for lamination. The process aims to manufacture a $2k RP machine, what we call the Freeform Mater I, that can use A4 or latter-size used papers. A prototype machine that demonstrates the design concept is built and further research issues are discussed.

  • PDF

Monitoring of Chatter Vibration by Frequency analysis of AE & Force Signals (AE 및 Force 신호의 주파수분석에 의한 Chatter 진동의 감시)

  • 조대현
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 2000.04a
    • /
    • pp.14-19
    • /
    • 2000
  • A machine tool has some serous stability problem in the from of tool chatter during the cutting process. Chatter vibration deteriorates the surface finish, reduce tool and machine life, accelerate machine tool system component wear, and may lead to an unacceptable noise sound in the working environment. In this study, in order to moni색 of the chatter vibration on the cutting process, the behavior of spectral density of AE signal and principal cutting force signal has been investigated. Furthermore, its reliability from obtained the results has been studied to evaluate and confirm the proposed method with the application procedure and the experimental results.

  • PDF

The Design Evaluation of Cutting Chip Collecting Apparatus to Manufacture Aircraft Components (항공기 기체 가공용 대용량 절삭칩 회수 장치의 설계 평가)

  • Kim K. Y.;Kim D. S.;Kang J. H.
    • Transactions of the Korean Society of Machine Tool Engineers
    • /
    • v.14 no.6
    • /
    • pp.110-116
    • /
    • 2005
  • A single-piece-machined-part has superior characteristics to an assembly of several pieces of part especially for aircraft components. It is necessary to develop high efficient 'multi-head router machine' for machining a large size single-piece-part on a large scale. In this type machine, many cutting chips are generated. These chips should be removed automatically f3r productivity and part precision. In this study, the design evaluation of the cutting chip collecting apparatus for 'multi-head router machine' was complemented using performance test and finite element analysis.

Effect of Cooling Method on Surface Roughness in Turning (선삭가공에서 표면 거칠기에 미치는 냉각방법의 영향)

  • Kim, Yeong-Duck
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.10 no.3
    • /
    • pp.87-93
    • /
    • 2011
  • CNC lathe machining has been widely used for parts machining of vehicles, aircraft, ships, electronics, etc. because cost savings for shortening processing time and increasing productivity are great. In this study, the purpose is to investigate the effect of cooling methods such as oil mist, water-soluble cutting oils on the workpiece surface roughness with the cutting speed, cutting depth, tool nose radius and feed rate of CNC lathe machine as a parameter in the cutting process of the aluminum alloy 2024 which is used a lot recently on aircraft parts. It is found that oil mist is coolant and water-soluble cooled by cutting the experimental conditions, cutting speed and cutting depth without effecting the surface roughness value was constant.

Model-Based Monitoring of the Turning Force (모델에 근거한 선삭력 모니터링)

  • 허건수
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 1999.10a
    • /
    • pp.11-15
    • /
    • 1999
  • Monitoring of the cutting force signals in cutting process has been well emphasized in machine tool communities. Although the cutting force can be directly measured by a tool dynamometer, this method is not always feasible because of high cost and limitations in setup. In this paper an indirect cutting force monitoring system is developed so that the cutting force in turning process is estimated based on a AC spindle drive model. This monitoring system considers the cutting force as a disturbance input to the spindle drive and estimates the cutting force based on the inverse dynamic model. The inverse dynamic model represents the dynamic relation between the cutting force, the motor torque and the motor power. The proposed monitoring system is realized on a CNC lathe and its estimation performance is evaluated experimentally.

  • PDF

Analysis of Non-uniform Tension Effect on Dynamic Characteristics of Spinning Circular Plates in the Wafer Cutting Machine (웨이퍼 가공기에서 회전 원판의 동특성에 미치는 불균일 장력의 영향 분석)

  • 임경화
    • Journal of KSNVE
    • /
    • v.8 no.2
    • /
    • pp.324-330
    • /
    • 1998
  • The forced vibration analysis of the outer-clamped spinnig annular disk with arbitrary in-plane is formulated to investigate the influence of non-uniform tension on the cutting accuracy of wafer cutting machine. The arbitrary in-plan force along the outer edge of an annular plate is expressed as a Fourier series. Galerkin method and modal superposition method are employed to obtain the forced responses under the static force and the impulse force in astationary coordinate. Through qualitative and quantitative analyses, it can be found that forced and impulse responses are sensitive to the non-uniformity of in-plane force, which can bring a bad effect to the accuracy of wafer cutting process. Also, in case of a spinning disk with non-uniform in-plane force, critical speed is required to define in a different way, compared with conventional definition in axi-symmetrical spinning disk.

  • PDF

Development of Scribing Machine for Dicing of GaN Wafer (GaN 웨이퍼의 다이싱을 위한 스크라이빙 머신의 개발)

  • Cha, Young-Youp;Go, Gyong-Yong
    • Journal of Institute of Control, Robotics and Systems
    • /
    • v.8 no.5
    • /
    • pp.419-424
    • /
    • 2002
  • After the patterning and probe process of wafer have been achieved, the dicing processing is necessary to separate chips from a wafer. The dicing process cuts a semiconductor wafer to lengthwise and crosswise directions to make many chips. The existing general dicing method is the mechanical cutting using a narrow circular rotating blade impregnated diamond particles or laser cutting. Inferior goods can be made by the mechanical or laser cutting unless several parameters such as blade, wafer, cutting water and cutting conditions are properly set. Moreover, we can not apply these general dicing method to that of GaN wafer, because the GaN wafer is harder than general semiconductor wafers such as GaAs, GaAsP, AIGaAs and so forth. In order to overcome these problems, this paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism.