• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 B
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• pp.792-794
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• 2003

AC loss is an important issue in the design of high-$T_c$ superconducting power cables which consist of a number of Bi-2223 tapes wound on a former. In the cables, the tapes have different critical currents intrinsically. And they are electrically connected to each other and current leads. In this work we have prepared a conductor composed of three Bi-2223 tapes with different critical currents. The critical current characteristics in the conductor have experimentally investigated. The results show that for uniform current distributions the conductor's critical current is proportional to the critical current of the Bi-2223 tape to which a voltage lead is attached. However it depends on the current non-uniformity parameter in the conductor rather than the tape's critical currents for nonuniform current distributions.

• Journal of Biosystems Engineering
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• 제39권4호
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• pp.310-317
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• 2014

Purpose: This study was conducted to analyze the air flow characteristics in a plant factory with different inlet and outlet locations using computational fluid dynamics (CFD). Methods: In this study, the flow was assumed to be a steady-state, incompressible, and three-dimensional turbulent flow. A realizable k-${\varepsilon}$ turbulent model was applied to show more reasonable results than the standard model. A CFD software was used to perform the numerical simulation. For validation of the simulation model, a prototype plant factory ($5,900mm{\times}2,800mm{\times}2,400mm$) was constructed with two inlets (${\Phi}250mm$) and one outlet ($710mm{\times}290mm$), located on the top side wall. For the simulation model, the average air current speed at the inlet was $5.11m{\cdot}s^{-1}$. Five cases were simulated to predict the airflow pattern in the plant factory with different inlet and outlet locations. Results: The root mean square error of measured and simulated air current speeds was 13%. The error was attributed to the assumptions applied to mathematical modelling and to the magnitude of the air current speed measured at the inlet. However, the measured and predicted airflow distributions of the plant factory exhibited similar patterns. When the inlets were located at the center of the side wall, the average air current speed in the plant factory was increased but the spatial uniformity was lowered. In contrast, if the inlets were located on the ceiling, the average air current speed was lowered but the uniformity was improved. Conclusions: Based on the results of this study, it was concluded that the airflow pattern in the plant factory with multilayer cultivation shelves was greatly affected by the locations of the inlet and the outlet.

• 대한전자공학회논문지
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• 제9권5호
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• pp.34-42
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• 1972

전류잡음은 탄소피막고정저항기의 품질을 나타내는 중요한 척도이다. 저항체피막상의 결함은 전류밀도의 불균형을 초래하고 결과적으로 전류잡음의 기대를 유발한다. 전류잡음의 크기는 저항재의 고유한 성질과 저항체의 처리, 조립 및 외장 등에 의한 여러 요인에 의존하고 있으나 각종 수명시험결과 저항기의 전기적특성과 전류잡음문에는 명백한 관계가 성립하고 있다. 대표군의 저항기에 대한 전류잡음지수의 정규분포를 표시하는 parameter를 해석하면 제품의 품질관리와 생산의 균일성을 판단하는 지표로서 매우 유용한 수단이다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.589-592
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• 1998

The performance of inductively coupled plasma (ICP) is enhanced by axial magnetic field driven by alternating current Helmholtz coils in this work. Langmuir pobe is used to characterize the plasma, and the etching performance is demonstrated with phororesist stripping process. It is shown that its density and uniformity depends on the frequency of driving current to the magnetic field.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.573-576
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• 1998

In this paper, we analyzed electric field density and plasma condition to ICP reactor geometry structure, to generate plasma, to maintain plasma uniformity of large area LCD panel in ICP reactor also, we simulated electric field density for all kind existence current (antena and plasma current) in ICP reactor to analyze plasma antena structure

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2006년도 High Temperature Superconductivity Vol.XVI
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• pp.64-64
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• 2006

• Journal of Electrochemical Science and Technology
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• 제10권4호
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• pp.408-415
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• 2019

Electroplating is a widely used surface treatment method in the manufacturing process of electronic parts and uniformity of the electrodeposition thickness is very crucial for these applications. Since many variables including fluid flow influence the uniformity of the film, it is difficult to conduct efficient research only by experiments. So many studies using simulation have been carried out. However, the most popular simulation technique, which calculates secondary current distribution, has a limitation on the considering the effects of fluid flow on the deposition behavior. And modified method, which is calculating a tertiary current distribution, is limited to a two-dimensional study of simple shapes because of the massive computational load. In the present study, we propose a new electroplating simulation method that can be applied to complex shapes considering the effect of flow. This new model calculates the electroplating process with three steps. First, the thickness of boundary layers on the surface of the cathode plane and velocity magnitudes at the positions are calculated from the simulation of fluid flow. Next, polarization curves of different velocities are obtained by calculations or experiments. Finally, both results are incorporated into the electroplating simulation program as boundary conditions at the cathode plane. The results of the model showed good agreements with the experimental results, and the effects of fluid flow of electrolytes on the uniformity of deposition thickness was quantitatively predicted.

• 한국자기학회지
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• 제2권3호
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• pp.268-275
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• 1992

솔레노이드 중심 부근에서 균일자장을 형성하기위해 주전류와 보조전류로 이루어진 다전류 방법을 사용하였으며, 자장의 Legendre 전개로 부터 구대칭 균일자장 공간형성을 위한 보조전류의 조건을 구하였다. 분극된 흐르는 물을 이용한 Rabi 핵자기 공명법에 의한 저자장 측정시스템을 구하고 이를 이용하여 솔레노이드 축상의 자장분포를 측정하였으며, 보조전류를 미세조정하여 그 균일도를 향상시켰다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.111-114
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• 2003

In order to improve the surface uniformity and the conduction properties of the fabricated YBCO thick films, a system that applies alternating field vertically to the EPD field has been developed for the first time and applied to the electrophoretic deposition process. The applied alternating electric field caused a force to be exerted on each YBCO particle and resulted in a shaking of the particle in the direction of applied electric field, accomplishing a uniform particle orientation. The usual commercial electrical power was used for the vertically applied alternating voltage and the induced electric field was 25-120 V/cm at 60Hz. The thick film fabricated by the method developed in this paper showed better surface uniformity without crack and porosity and improved film characteristics such as critical temperature ($T_{c,zero}$ : 90 K) and critical current density ($2354\;A/cm^2$). Therefore, it is expected that the shaky-aligned electrophoretic deposition method can be used to fabricate superconductor films through a simpler process and at less expense.

• 한국전기전자재료학회논문지
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• 제16권11호
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• pp.1041-1046
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• 2003

In order to improve the surface uniformity and the conduction properties of the fabricated YBCO thick films, a system that applies alternating field vertically to the EPD field has been developed for the first time and applied to the electrophoretic deposition process. The applied alternating electric field, so called Shaky Alternating Assisted Field, caused a force to be exerted on each YBCO particle and resulted in a shaking of the particle in the direction of applied electric field, accomplishing a uniform particle orientation. The usual commercial electrical power was used for the vertically applied alternating voltage and the induced electric field was 25-120 V/cm at 60Hz. The thick film fabricated by the method developed in this paper showed better surface uniformity without crack and porosity and improved film characteristics such as critical temperature (Tc,zero = 90 K) and critical current density (2354 A/$\textrm{cm}^2$), Therefore, it is expected that the shaky-aligned electrophoretic deposition method can be used to fabricate superconductor films through a simpler process and at less expense.