• Title/Summary/Keyword: Cure kinetics

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Design of Hard Coating Resin for In-mold Decoration (IMD) Foil and Effects of EB Irradiation on IMD Foil Layers (In-mold Decoration(IMD) 포일용 경질 코팅 수지 설계 및 전자빔 조사가 IMD 포일 구성층에 미치는 영향)

  • Sim, Hyun-Seog;Kim, Geon-Seok;Shin, Ji-Hee;Lee, Kwang-Hee
    • Polymer(Korea)
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    • v.36 no.3
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    • pp.268-274
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    • 2012
  • The silane coupling agent, 3-(trimethoxysilyl)propyl methacrylate (${\gamma}$-MPTS), was grafted on the surface of alumina nanoparticles. We used the surface modified nanoparticles in the hard coating layer for in-mold decoration (IMD) foils and evaluated the coating properties such as hardness and anti-abrasion property. The effects of electron beam (EB) irradiation on color layer and anchor layer of IMD foils were observed through the difference in color and the cross-cut tape test, respectively. Also, cure kinetics as studied quantitatively under various reaction temperatures by analysis of surface properties and Fourier transform infrared (FTIR) spectroscopy. From these results, we constructed database for the commercial exploitation of EB curing system.

Study on the Curing Properties of Photo-curable Acrylate Resins (광경화성 아크릴 수지의 경화특성에 관한 연구)

  • Kim, Sung-Hyun;Chang, Hyun-Suk;Park, Sun-Hee;Song, Ki-Gook
    • Polymer(Korea)
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    • v.34 no.5
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    • pp.469-473
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    • 2010
  • The curing mechanism and characteristics of UV curable acrylate resins were studied using Photo-DSC, FTIR, and Raman spectroscopy. Effects of chemical structures of acrylate, numbers of functional group, and UV intensity on curing kinetics were investigated with Photo-DSC. FTIR and Raman spectroscopy has been used to understand curing mechanisms and reaction conversion. In order to investigate the effect of oxygen on the photo-curing reaction, the curing process was compared between the acrylate and thiol-ene resins. The reaction conversion was found to be less than 80% for acrylate resins. The photo-curing reaction of the acrylate resin could not proceed to the end because of oxygen which acts as a reaction inhibitor while the thiol-ene resin was hardly affected from oxygen during the curing process.