• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.11
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• pp.2853-2865
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• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it takes a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20 mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one, and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• Applied Chemistry for Engineering
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• v.7 no.3
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• pp.511-517
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• 1996

In this research, we studied curing and filler systems for preparation of fast cure SMC and low-density SMC, respectivly. Two curing systems were evaluated for fast cure SMC formulation. One is a mixed initiator system and the other is an activator system. For low-density SMC, glass micro-baloon(GMB) was used as a filler. Various SMC formulations were cured in an appropriate way, and their curing behavior and physical/mechanical properties were characterized. Curing rates were increased with increasing quantity of mixed initiator and activator, but mechanical properties were not affected. As the quantities of GMB increased, density and mechanical properties were decreased.

• Macromolecular Research
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• v.12 no.3
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• pp.282-289
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• 2004

We have extensively characterized the fluorescence behavior of unsaturated polyester (UP) resin in the absence and presence of a 1,3-bis-(l-pyrenyl)propane (BPP) fluorescent probe at various dynamic and isothermal cure histories by means of a steady-state fluorescence technique using a front-face illumination equipment. In addition, we explored the effect of the fluorescence intensity on the relaxation of the fluorescent probe in the UP resin by resting the dynamically and isothermally cured resin at ambient temperature and pressure for 24 h. The monomer fluorescence intensity, which has two characteristic peaks at 376 and 396nm, changed noticeably depending on the cure temperature and time and provided important information with respect to the molecular and photophysical responses upon curing. The result of the fluorescence study indicates that the increased local viscosity and restricted molecular mobility of the UP resin surrounding the BPP probe after curing are both responsible for the enhancement of the monomer fluorescence intensity. Our results also demonstrate that once the BPP probe has enough time to rearrange and become isolated prior to fluorescence, a sufficient amount of fluorescence is emitted. Therefore, we note that the fluorescence behavior of this UP resin system is influenced strongly by the relaxation process of the fluorescent probe in the resin as well as process used to cure the resin.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1992.03a
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• pp.177-200
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• 1992

A thermo-viscoplastic finite element program was developed to analyze the compression molding of SMC process. Deformation of the material was modelled by using the flow-rule. Heat balance during the process was coupled to the deformation. In the cure study, a kinetic model was adopted to describe the cure behavior. The numerical kinetic model was integrated with the thermo-viscoplastic numerical analysis by adding heat generation due to the chemical reaction of the workpiece in the heat transfer analysis. The integrated finite element program can simulate a whole sequential molding process including deformation, heat transfer, and chemical reaction. A practical SMC molding process with T-shaped substructure was simulated. The simulated results showed good agreements with experiments.

• Korean Chemical Engineering Research
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• v.40 no.6
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• pp.681-686
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• 2002

In the industrial field, the theory of drying process is different from the practical application, and it is effective to reduce energy by recirculation of the heat of exhausting gas. But the study of this field may not be performed still. The cure properties of the urea resin moulding compounds was investigated according to drying temperature, drying time, recycle rate of exhausting gas and moulding temperature in the process of drying and moulding. We obtained the following results; water content of material decreases with increasing drying time and drying temperature, and the rate of drying also decreases with increasing recycle rate of exhausting gas. Specially, The cure fluidity of the urea resin moulding compounds decreases, with increasing drying temperature, recycle rate of exhausting gas and moulding temperature. And the correlation equations on water content and cure fluidity of the urea resin moulding material were obtained through a regression analysis of experimental data.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.211-216
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• 2016

In several industrial fields, epoxy resin is widely used as an adhesive for co-curing and manufacturing various structures. Controlling the manufacturing process is required for ensuring robust bonding performance and the stability of the structures. A fiber optic sensor is suitable for the cure monitoring of epoxy resin owing to the thready shape of the sensor. In this paper, a fiber Bragg grating (FBG) sensor was applied for the cure monitoring of epoxy resin. Based on the experimental results, it was demonstrated that the FBG sensor can monitor the status of epoxy resin curing by measuring the strain caused by volume shrinkage and considering the compensation of temperature. In addition, two types of epoxy resin were used for the cure-monitoring; moreover, when compared to each other, it was found that the two types of epoxy had different cure-processes in terms of the change of strain during the curing. Therefore, the study proved that the FBG sensor is very profitable for the cure-monitoring of epoxy resin.

• Macromolecular Research
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• v.13 no.1
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• pp.30-38
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• 2005

Sulfur-cured gum natural rubber vulcanizates were devulcanized using two different concentrations of diallyl disulfide. The devulcanization process was performed at $110^{\circ}C$ min in an open two-roll cracker-cum-mixing mill. Natural rubber vulcanizates having various sulfur/accelerator ratios were used to study the cleavage of monosulfide, disulfide, and polysulfide bonds. The properties of devulcanized natural rubber increased upon increasing the disulfide concentration and the mechanical properties of the revulcanized natural rubber increased upon decreasing the sulfur content in the original rubber vulcanizates. The scorch time and the maximum state of cure both increased when the ground vulcanizates were treated with higher amounts of disulfide. TGA and DMA were conducted to study the effects of the devulcanization on the thermal stability and the $T_g$ behavior of the vulcanizates. SEM analysis was conducted to study how the failure mechanism was affected by the devulcanization process. It was possible to recover $70-80\%$ of the original gum rubber properties by using this process. From IR spectroscopic analysis, we observed that the oxidation of the main chains did not occur during high-temperature milling.

• Composites Research
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• v.15 no.1
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• pp.21-31
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• 2002

To overcome the disadvantages of conventional excavation technology various trenchless (or excavation free, or no-dig) repair-reinforcement technologies have been developed and tried. But trenchless technologies so far developed have some drawbacks such as high cost and inconvenience of operation. In this study, a repairing-reinforcing process for underground pipes with glass fiber fabric polymer composites using VARTM (Vacuum Assisted Resin Transfer Molding) has been developed. The developed process requires shorter operation time and lower cost with smaller and simpler operating equipments than those of the conventional trenchless technologies. For the reliable operation of the developed method, a simple method to apply pressure and vacuum to the reinforcement was devised and flexible mold technology was tried. Also, resin filling and cure status during RTM process were monitored with a commercial dielectrometry cure monitoring system, LACOMCURE. From the investigation, it has been found that the developed repairing-reinforcing technology with appropriate process variables and on-line cure monitoring has many advantages over conventional methods.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.49-52
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• 2000

A new composite manufacturing technique which combines winding and curing together is studied and analyzed. This method is especially suited to the manufacture of thick composite materials in which thermal spiking is a common problem. An experimental apparatus was designed and built for use with a filament winder to continuously cure a thick composite cylinder. A hoop-wound composite cylinder with 152 mm wall thickness was manufactured and embedded thermocouples and strain gages were monitored throughout the cure process. The experimental data were compared with analytical results.