• 제목/요약/키워드: Cure Process

검색결과 291건 처리시간 0.023초

유전기법을 이용한 복합재료의 경화 모니터링 (Cure Monitoring of Composite Materials Using Dielectrometry)

  • 권재욱;김진국;김학성;이대길;최진경
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2000년도 추계학술발표대회 논문집
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    • pp.42-45
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    • 2000
  • The properties of thermosetting resins are dependent on the degree of cure and consolidation quality. Since the consolidation process of thermosetting resin matrix fiber composites is much dependent on the viscosity of resin in the composites, in this study, the dissipation factor which is a function of viscosity was measured by the newly developed Lacomtech dielectrometry apparatus and sensors. Using the measured dissipation factors, the relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

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경화도에 따른 고분자 기지 복합재의 경화 수축률 거동 (Cure Shrinkage Behavior of Polymer Matrix Composite according to Degree of Cure)

  • 권혁;황성순;최원종;이재환;김재학
    • Composites Research
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    • 제27권3호
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    • pp.90-95
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    • 2014
  • 복합재료의 경화 시 발생하는 수축 변형률은 복합재료 구조물 내에 잔류응력을 발생시키며 이러한 잔류응력은 spring-in, spring-out, warpage와 같은 구조물 변형의 원인이 된다. 본 연구에서는 Hexcel사의 "Hexply M21EV/34%/UD268NFS/IMA-12K" prepreg를 사용하였다. 시험편의 경화에 따른 cure shrinkage 변화를 DSC(differential scanning calorimetry)와 TMA(thermomechanical analyzer)를 이용하여 측정하였다. 수지의 수축률은 $140{\sim}240^{\circ}C$ 구간에서 $20^{\circ}C$ 간격으로 질소 분위기에서 측정하였다. 경화도는 dynamic과 isothermal DSC scanning을 통하여 측정된 반응열을 이용하여 산출하였으며, DSC 시험은 Argon 분위기에서 수행하였다. 시험결과, 열경화성 수지는 27~80% 경화도에서 급격한 수축이 일어났으며, 경화온도가 높을수록 더 낮은 경화도에서 수축이 시작되는 것을 알 수 있었다.

필라멘트 와인딩 플라이휠의 스마트 경화에 관한 연구 (A Study on Smart Cure of Filament Wound Composite Flywheel)

  • 이도훈;김선경;김동진;이우일;하성규
    • Composites Research
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    • 제16권1호
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    • pp.34-41
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    • 2003
  • 두꺼운 필라멘트 와인딩 복합재료의 경화 공정의 최적화를 위만 모델이 제안되었다. 스마트 경화는 중심 축 부분과 바깥 쪽의 온도 조건을 같게 하는 방법과 중심 푹 쪽의 온도가 약간 높게 조절하여 경화 반응이 안쪽부터 시작될 수 있도록 하는 방법의 두 가지로 제안되었으며, 이는 잔류응력을 줄이기 위함이다.

복합재료 수지 전달 공정의 몰드플로우를 이용한 유동과 경화 시뮬레이션 (Flow and Cure Simulation of resin transfer molding process for composites using MoldFlow)

  • 정재성;홍지선;김선경
    • Design & Manufacturing
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    • 제16권3호
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    • pp.44-49
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    • 2022
  • In this study, the simulation of the resin transfer molding process method using MoldFlow has been investigated. This work explains the thermoset material model, fabric permeability model, the flow model and the cure model. It has been shown that the simulation result can predict filling and cure performances.

고온 복합재료의 경화 모니터링을 위한 고온 유전센서의 제작 및 성능평가에 관한 연구 (A Study on the Performance Test and Manufacture of the Dielectric Sensor for the Cure Monitoring of the High Temperature Composites)

  • 김일영;최진호;이대길
    • Composites Research
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    • 제14권1호
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    • pp.30-38
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    • 2001
  • 복합재료는 우수한 비강성, 비강도 특성 때문에 기존의 항공우주산업뿐만 아니라 로봇 팔. 공작기계 등에 널리 사용되고 있다. 복합재료 경화중의 온라인 모니터링기법은 생산성 향상 및 품질의 신뢰성 향상을 위하여 매우 중요한 연구분야로 대두되고 있다. 본 논문에서는 휘스톤 브리지식 유전회로를 설계하고 제작하였다. 또한 고온 경화 복합재료에 적용할 수 있는 고온 유전센서를 개발하여 그 성능을 평가하였다. 유한요소해석을 이용하여 유전 센서에 작용하는 열 잔류응력을 계산하였으며, 고온분위기 하에서 유전센서의 유전특성을 평가하였다. 이상에서 개발된 유전회로와 고온 유전센서를 이용하여 BMI(Blsmaleimlde) 수지의 경화모니터링을 수행하였다.

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Effect of the Laser Beam Size on the Cure Properties of a Photopolymer in Stereolithography

  • Sim, Jae-Hyung;Lee, Eun-Dok;Kweon, Hyeog-Jun
    • International Journal of Precision Engineering and Manufacturing
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    • 제8권4호
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    • pp.50-55
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    • 2007
  • Stereolithography (SLA) is a technique using a laser beam to cure a photopolymer liquid resin with three-dimensional computer-aided design (CAD) data, The accuracy of the prototype, the build time, and the cured properties of the resins are controlled by the SLA process parameters such as the size of the laser beam, scan velocity, hatch spacing, and layer thickness, In particular, the size of the laser beam is the most important parameter in SLA, This study investigated the curing properties of photopolymers as a function of the laser beam size, The cure width and depth were measured either on a single cure line or at a single cure layer for various hatch spacings and laser beam sizes, The cure depth ranged from 0.23 to 0.34 mm and was directly proportional to the beam radius, whereas the cure width ranged from 0.42 to 1.07 mm and was inversely proportional to the beam radius, The resulting surface roughness ranged from 1.12 to $2.23{\mu}m$ for a ratio of hatch spacing to beam radius in the range 0.5-2.0 at a beam radius of 0.17 mm and a scan velocity of 125 mm/sec.

복합재료 경화모니터링용 유전센서의 해석 (Analysis of the Dielectric Sensor for Cure Monitoring of Composite Materials)

  • 김진수;이대길
    • 대한기계학회논문집
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    • 제19권7호
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    • pp.1563-1572
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    • 1995
  • The on-line cure monitoring during the cure process of fiber reinforced resin matrix composite material is important for the better quality and productivity. Among several cure monitoring methods, the dielectrometry that uses electrodes as its sensor is known to be the most promising method. In this study, the sensitivity of the dielectric sensor for the on-line cure monitoring was analyzed by finite element method and compared to the experimental results. Using the analytical results, the equation for the capacitance of the sensor was derived. Also, the optimal sensor design method was suggested after analyzing several different sensor shapes.

고온 복합재료의 경화 모니터링을 위한 유전센서의 개발 (Development of the Dielectric sensor for the Cure monitoring of the high temperature Composites)

  • 김일영;최진경;최진호;이대길
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2000년도 추계학술발표대회 논문집
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    • pp.22-28
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    • 2000
  • The fiber reinforced composite materials is widely used in aircraft, space structures and robot arms because of high specific strength and high specific modulus. The on-line cure monitoring during the cure process of the composite materials has become an important research area for the better quality and productivity. In this paper, the dielectric circuit of the wheatstone bridge type for measuring the dissipation factor was designed and manufactured. Also, the dielectric sensor for the cure monitoring of the high temperature composites was developed. The residual thermal stresses of the dielectric sensor were analyzed by the finite element method and its dielectric characteristics under high temperature were evaluated. The on-line cure monitoring of the BMI resin was performed using the wheatstone bridge type circuit and developed high-temperature dielectric sensor.

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침을 이용한 국소 피부주름 치료에 대한 연구 (Study on the Local Wrinkle Cure Using Acupuncture Needle)

  • 임명진;김병수;강정수
    • 동의생리병리학회지
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    • 제23권6호
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    • pp.1261-1266
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    • 2009
  • The wrinkle is a typical sign showing aging. These days lots of people want to have a young and healthy appearance and many medical doctors are studying about wrinkle cure. In fact a young face without wrinkle looks more healthy and energetic. Therefore the wrinkle cure is important at the point of medical view. This research is an investigation of several studies about wrinkle cure using acupuncture needle. We have to consider the problem of the whole body which is related 12 meridians and meridian muscles as well as topical skin and tissues. There are three parts affecting wrinkle formation and cure. The first is a meridian and meridian muscle, the second is a local muscle and fascia on the head and neck, the third is a local skin structure. There are three kinds of method to cure the wrinkle locally. The first one is the perpendicular treatment of acupuncture, called the microneedle therapy, the process of this method is that lots of microneedles stab in the skin to dermis. The second one is the transverse treatment of acupuncture. The process of this method is that an acupuncture needle inserts just under the wrinkle skin. The third one is the incision treatment of acupuncture, called subcision, the process of this method is to cut the fibrous band which connect from the facial muscle to SMS(superficial musculoaponeurotic system) using cuttable needle. The hematoma after treatment let a collagen increase.

승온 반응속도식을 이용한 LED용 실리콘 렌즈의 경화공정해석 (Cure simulation in LED silicone lense using dynamic reaction kinetics method)

  • 송민재;홍석관;박정연;이정원;김흥규
    • Design & Manufacturing
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    • 제8권2호
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    • pp.46-49
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    • 2014
  • Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

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