• Journal of Welding and Joining
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• 제32권6호
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• pp.75-81
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• 2014

Usage of heavy metal element (Pb, Hg and Cd etc.) in electronic devices have been restricted due to the environmental banning of the European Union, such as WEEE and RoHS. Therefore, it is needed to develop the Pb-free solder plated ribbon in photovoltaic (PV) module. This study described that degradation characteristics of PV module under damp heat (DH, $85^{\circ}C$ and 85% R.H.) condition test for 1,000 h. Solar cell ribbons were utilized to hot dipping plate with Pb-free solder alloys. Two types of Pb-free solder plated ribbons, Sn-3.0Ag-0.5Cu (SAC305) and Sn-48Bi-2Ag, and an electroless Sn-40Pb solder hot dipping plated ribbon as a reference sample were prepared to evaluate degradation characteristics. To detect the degradation of PV module with the eutectic and Pb-free solder plated ribbons, I-V curve, electro-luminescence (EL) and cross-sectional SEM analysis were carried out. DH test results show that the reason of maximum power (Pm) drop was mainly due to the decrease fill factor (FF). It was attributed to the crack or oxidation of interface between the cell and the ribbon. Among PV modules with the eutectic and Pb-free solder plated ribbon, the PV module with SAC305 ribbon relatively showed higher stability after DH test than the case of PV module with Sn-40Pb and Sn-48Bi-2Ag solder plated ribbons.

• Journal of Welding and Joining
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• 제32권3호
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• 열처리공학회지
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• 제18권4호
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• pp.235-241
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• 2005

Thermal creep properties of the advanced zirconium fuel claddings named by HANA alloys which were developed for high burn-up application were evaluated. The creep test of HANA cladding tubes was carried out by the internal pressurization method in temperature range from 350 to $400^{\circ}C$ and in the hoop stress range from 100 to 150 MPa. Creep tests were lasted up to 800 days, which showed the steady-state secondary creep rate. The creep resistance of HANA fuel claddings was affected by final annealing temperature and various factors, such as alloying element, applied stress and testing temperature. From the results the microstructure observation of the samples before and after creep test by using TEM, the dislocation density was increased in the sample of after creep test. The Sn as an alloying element was more effective in the creep resistance than other elements such as Nb, Fe, Cr and Cu due to solute hardening effect of Sn. In case of HANA fuel claddings, the improved creep resistance was obtained by the control of final heat treatment temperature as well as alloying element.

• 대한금속재료학회지
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• 제48권12호
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• pp.1056-1063
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• 2010

We present a new joining method for Pd-Cu membrane foils used as permeation tubes to collect $CO_2$. Since foils have poor mechanical strength, joining should be done at low temperatures to reduce residual stresses and without joining pressure. This contradicts the well known conditions for good contact between base materials that determines joint qualities. We selected Sn-Ag-Cu alloys that are highly reactive with Pd and Cu as a filler metal. As the filler melts at joining temperatures as low as $220{\sim}280^{\circ}C$, Pd and Cu are dissolved into the melt and react with the filler elements, which raises the melting temperature of the filler based on eutectic structures among the elements. Then, isothermal solidification progresses for the rest of the joining time. Intermetallic compounds (IMC) in the joints, one of the main factors for brittle joints, are inevitably formed. However, by optimizing both joining time and temperature, we balanced the wettability with IMC. Sealing test results confirmed that the joints are mechanically reliable during operation.

• 헤리티지:역사와 과학
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• 제49권3호
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• pp.4-11
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• 2016

본 연구에서는 태안 마도해역에서 출수된 고려시대 청동숟가락 8점의 양식을 비교하고, 생산지와 출수지와의 관계를 파악하기 위한 성분분석 및 납동위원소비 분석을 실시하였다. 출수 청동숟가락의 술잎은 대부분이 타원형이었으며 술총은 능형과 연미형으로 구분된다. 청동숟가락은 구리(Cu)와 주석(Sn)의 2원계 합금으로 제작되어 납(Pb)이 인위적으로 첨가되지 않음을 확인할 수 있다. 같은 유물일지라도 시험편 채취 후 분석위치에 따라 미량원소 성분변화가 다르게 나타남을 알 수 있으며, 미량원소 중 은(Ag)이 높게 부화되는 것을 확인할 수 있다. 출수 청동숟가락의 납동위원소비 분석결과 충청남북도, 전라남북도를 포함하는 zone 3에서 원료를 공급 받았음을 알 수 있다. 청동제작에 사용되는 원료 광석의 미량원소 분석결과가 축적된다면 납동위원소비와 더불어 산지추정에 좋은 인자가 될 것으로 사료된다.

• 한국표면공학회지
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• 제49권1호
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• 한국결정성장학회지
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• 제24권5호
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• pp.224-228
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• 2014

최근 금속자원 재활용과 환경보호에 대한 기술적 필요성에 의해 구리(Cu)를 주성분으로 하는 동합금으로부터 니켈, 주석 등의 유가금속의 분리/회수에 대한 관심이 높아지고 있다. 본 연구에서는 기존에 발표한 니켈과 주석의 분리연구 결과를 토대로 보다 높은 농도로 분리할 수 있는 공정을 검토하였다. 니켈의 경우 유기용매를 이용하여 동합금에서 니켈을 선택적으로 분리한 후 환원열처리를 통하여 순도 98.0 % 이상의 니켈 금속분말을 성공적으로 제조하였다. 주석의 경우에는 3회의 연속적인 선택적 용해법과 환원열처리를 통하여 주석 분말의 농도를 97.5 % 이상으로 향상시켰다. 제조된 분말의 FE-SEM 및 TEM 분석을 통하여 미세구조 변화여부를 분석하였다.

• Tribology and Lubricants
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• 제9권2호
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• pp.49-55
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• 1993

The dry sliding wear properties of the sintered Cu-10 wt%Sn bronze alloys reinforced with $SiC_w$ and $SiC_p$ were investigated by a pin-on-disc wear testing machine. The worn surfaces and the cross sections of the wear specimens and the wear debris were observed by SEM to study the effect of the variation of the ceramic phase contents in the composite and the wear condition on the wear behaviors. The wear of bronze matrix was dominated by the adhesive wear. The transition from mild to severe wear was found in the bronze matrix specimens at the applied load higher than 20N where the surface delamination caused the severe wear. The addition of $SiC_w$ and $SiC_p$ reinforcements in the romposites was proved to reduce the wear rate by the matrix strengthening at the applied load higher than 20N. SiC whiskers having a large length to diameter ratio which hold the deformed matrix were effective to hinder the crack propagation near the worn surface. Thus the maximum wear resistance was obtained in the composite reinforced by $SiC_w$ at the higher applied load.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

• 보존과학회지
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• 제34권6호
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• pp.493-502
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• 2018

현재 유기공방에서는 전통기술로 하나의 방짜유기 숟가락을 만들기 위해 10단계의 작업 공정을 거쳤으며, 형태 제작에 큰 영향을 주는 열간 단조는 3~4단계의 과정을 거친다. 열간 단조를 통해 방짜유기 숟가락의 미세조직은 수지형상의 ${\alpha}$상이 미세화되고 잘게 분산되었으며, 두드림이 가해진 부분의 ${\alpha}$상에는 쌍정이 생성되었다. 또한 ${\alpha}$상은 가해지는 망치질에 따라 점점 다각형에서 원형으로 변형되었다. 이 과정에서 서로 근접한 ${\alpha}$상은 합쳐지는 현상이 발생하였고, 담금질 후에도 합쳐진 상태로 존재하였다. 이처럼 여러 개의 ${\alpha}$상이 합쳐진 미세조직은 방짜조성의 청동유물에서도 관찰되는 것으로 기술체계의 연관성을 보여준다. 방짜조성의 Cu-22%Sn 합금을 대상으로 실시한 열간 단조 실험결과, 주조 당시 형성된 수지상의 감소율은 가공횟수에 따라 비례했으며, 두드림 작업에 의한 결정립의 미세화는 재질의 강도를 높이는 효과를 준 것으로 판단된다. 고대 유적에서 출토된 청동유물과 전통 유기공방에서 만든 방짜유기에서 동일하게 관찰되는 메자국은 문헌으로 남아 있지 않은 고대의 방짜유기 기술체계가 오늘날의 방짜유기 전통기술로 전승되었음을 보여준다.