Interfacial reaction between lead free solders with Sn-Ag and Cu substrate (Sn-Ag계 Lead-free solder와 Cu substrate간의 계면반응)

• 김봉균;박종현;이창열;서창제
• • Proceedings of the KWS Conference
  • /
  • 2003.11a
  • /
  • pp.72-73
  • /
  • 2003
• PDF

The study on the bonding of FCD60 with Cu-Sn alloy (FCD60과 Cu-Sn합금과의 확산접합에 관한 연구)

• 최기용;하정원;주남순;최종천;강정윤
• • Proceedings of the KWS Conference
  • /
  • 1997.10a
  • /
  • pp.110-111
  • /
  • 1997
• PDF

A study on interfacial reaction between Sn-Ag-Ni solder and Cu, Ni substrate (Sn-Ag-Ni solder와 Cu, Ni substrate간의 계면반응)

• 오은주;김봉균;박종현;이창열;서창제
• • Proceedings of the KWS Conference
  • /
  • 2003.11a
  • /
  • pp.89-90
  • /
  • 2003
• PDF

Brazing of Si$_3$N$_4$/S45C steel by thermal sprayed Cu-Sn-Ti-Al filler metal (Cu-Sn-Ti-Al 용사피막 용가재에 의한 $Si_3N_4$/S45C강의 브레이징 접합)

• 이희호;박경채
• • Proceedings of the KWS Conference
  • /
  • 1999.05a
  • /
  • pp.96-97
  • /
  • 1999
• PDF

A Study on the Intermetallic Layer Growth Between Sn-9Zn Eutectic Solder and Bare Cu Substrate (Sn-9Zn 공정솔더와 bare Cu 기판사이의 금속간화합물 성장에 관한 연구)

• 장형선;김대곤;윤정원;신동수;정승부
• • Proceedings of the KWS Conference
  • /
  • 2003.05a
  • /
  • pp.190-192
  • /
  • 2003
• PDF

Interfacial reaction between lead-free SnAgCu and Ni-P Flip chip bump (Flip Chip 무전해 bump와 lead-free solder SnAgCu와의 계면 반응)

• 이창열;조원종;최혜란;정승부;서창제
• • Proceedings of the KWS Conference
  • /
  • 2002.05a
  • /
  • pp.276-277
  • /
  • 2002
• PDF

Effect of Sn and Aging temperature on precipitation properties of Al-Cu-Mn alloy (Sn이 첨가된 Al-Cu-Mn계 합금에서 석출경화에 미치는 시효 온도의 영향)

• 김철효;이정무;김경현;김인배
• • Proceedings of the Materials Research Society of Korea Conference
  • /
  • 2001.11a
  • /
  • pp.110-110
  • /
  • 2001
• PDF

Metallization Properties of Cu-Sn Alloy Layers Deposited by the Electroplating Method (전해도금법으로 증착한 Cu-Sn 합금막의 배선특성)

• 김주연;박수진;이근우;권영호;배규식
• • Proceedings of the Materials Research Society of Korea Conference
  • /
  • 2001.11a
  • /
  • pp.148-148
  • /
  • 2001
• PDF

Study on Activation Energies of Intermetallic Compound Growth of Sn-5Bi-3.5Ag/Cu System During Aging In Solid State (Sn-5Bi-3.5Ag/Cu의 고상 시효에 의한 금속간화합물 성장의 활성화에너지에 대한 연구)

• 윤정원;이창배;정승부
• • Proceedings of the KWS Conference
  • /
  • 2001.05a
  • /
  • pp.271-272
  • /
  • 2001
• PDF

A Study on Interfacial reaction of Sn-3.5Ag Lead-Free Solder in Cu Substrate (Sn-3.5Ag 무연합금과 Cu 기판에서의 계면반응에 대한 연구)

• 김시중;김주연;배규식
• • Proceedings of the Materials Research Society of Korea Conference
  • /
  • 2000.11a
  • /
  • pp.164-164
  • /
  • 2000
• PDF

---