• 마이크로전자및패키징학회지
• /
• 제15권2호
• /
• pp.37-45
• /
• 2008

본 논문에서는 유기 기판 위에 $100{\mu}m$ 피치를 갖는 플립칩 구조인 Cu(60 um)/SnAg(20 um) 더블 범프 플립칩 어셈블리를 구현하여 이의 리플로우, 고온 유지 신뢰성, 열주기 신뢰성, Electromigration 신뢰성을 평가하였다. 먼저, 리플로우의 경우 횟수와 온도에 상관없이 범프 접속 저항의 변화는 거의 나타나지 않음을 알 수 있었다. 125도 고온 유지 시험에서는 2000시간까지 접속 저항 변화가 관찰되지 않았던 반면, 150도에서는 Kirkendall void의 형성으로 인한 접속 저항의 증가가 관찰되었다 또한 Electromigration 시험에서는 600시간까지 불량이 발생하지 않았는데 이는 Al금속 배선에서 유발되는 높은 전류 밀도가 Cu 칼럼의 높은 두께로 인해 솔더 영역에서는 낮아지기 때문으로 해석되었다. 열주기 시험의 경우, 400 cycle 이후부터 접속 저항의 증가가 발견되었으며, 이는 열주기 시험 동안 실리콘 칩과 Cu 칼럼 사이에 작용하는 압축 변형에 의해 그 사이에 있는 Al 및 Ti 층이 바깥쪽으로 밀려나감으로 인해 발생하는 것으로 확인되었다.

• 마이크로전자및패키징학회지
• /
• 제25권3호
• /
• pp.13-19
• /
• 2018

본 연구에서는 태양광 접속함 모듈 적용을 위한 유연 솔더(Sn-Pb) 및 무연 솔더(Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In)의 특성을 비교 평가하였다. 접속함 내에는 전압 및 전류 검출용 모듈, 고내압용 다이오드가 실장된 정류모듈 등 다양한 모듈이 내장되어있다. 본 연구에서는 솔더링특성, 인쇄성, 솔더형상 검사, X-ray를 이용한 솔더 내 void 검사 및 접합강도를 측정하였고, 무연 솔더 합금의 공정최적화는 step 1과 step 2로 구분하여 검토를 실시하였다. Step 1은 유연 솔더와 무연 솔더 페이스트 인쇄 검사 시험을 1차와 2차로 나누어 실험을 진행하였고 printability는 void 함량 및 접합강도의 상관관계로 검토하였다. 전체적으로 유연 솔더의 특성은 무연 솔더에 비하여 상대적으로 우수하였다. Step 2는 리플로우 공정의 최고점 온도 변화에 따른 접합부 특성 변화를 관찰하였다. 리플로우 최고 온도가 증가할수록 접합부 내의 void 함량이 2~4% 정도 감소하였고, 접합강도는 약 0.5 kgf 범위내에서 큰 차이 없이 나타났다. 기판 표면처리종류에 있어서는 ENIG 표면처리가 OSP 및 Pb-free 솔더 표면처리보다 우수한 접합강도를 나타내었다. 1종류의 무연솔더와 OSP 표면처리로 접합된 태양광 접속함 모듈의 500 싸이클 열충격 신뢰성시험 전후에 전기적 특성변화는 0.3% 내의 범위에서 안정적으로 작동함을 확인하였다.

• 통합자연과학논문집
• /
• 제10권4호
• /
• pp.245-248
• /
• 2017

The Cu and CuSn/PVP nanofibers were fabricated by electrospinning method by controlling various parameters. The precursor solution was prepared with copper(II) acetate monohydrate ($Cu(CH_3COO)_2$) and tin chloride dihydrate ($SnCl_2{\cdot}2H_2O$), and polyvinylpyrrolidone (PVP) for adjusting viscosity. The fabricated nanofibers were calcined at 873 K in Ar atmospheric environment for 5 hours to remove the solvent and polymer. The morphology and diameter of nanofibers were measured by optical microscopy (OM) with Motic image plus 2.0 program. The components and chemical environment were investigated with X-ray photoelectron spectroscopy (XPS). From the XPS survey spectra, we confirmed that CuSn/PVP nanofibers were successfully fabricated. The XPS peaks of C 1s and N 1s were remarkably decreased after calcination of the nanofibers at 873 K. It implies that the PVP was completely decomposed after calcination at 873 K.

• 마이크로전자및패키징학회지
• /
• 제6권3호
• /
• pp.45-50
• /
• 1999

동(CU)은 전기전자부품에 널리 사용되어 왔는데, 특히 점 저항용접된 동은 콘덴서나 저항의 리드부분에 사용되고 있다. 그러나 일반적으로 동은 전기 저항이 낮아 저항용접이 어렵다. 본 연구에서는 동의 점 용접성을 개선하기 위하여, 상대적으로 전기 저항이 높은 Sn-37%Pb 솔더를 동 표면에 도금하였다. 실험변수로, 가 압력은 100kgf에서 200kgf, 용접시간은 20ms에서 50ms, 용접전류는 100A에서 2500A까지 변화시켰다. 실험결과, 솔더 도금된 동박판은 용접전류 400~2200A, 가압력 100~200kgf, 용접시간 20~50ms범위에서 저항용접이 가능하였다. 점 용접부의 인장전단 강도는 임계 전류값까지는 용접전류가 증가함에 따라 증가하고, 임계 전류값 이후부터는 용접전류에 따라 인장전단 강도가 감소하였다.

• 대한금속재료학회지
• /
• 제46권1호
• /
• pp.26-32
• /
• 2008

Examination of two bronze vessels supposedly from the Koryo dynasty revealed that they consist of bowls and stands that are fixed together using rivet joints made of Cu-Ag alloys. The bowls and stands were forged out of unleaded bronze alloys of approximately 22 weight % Sn before being quenched from the ${\alpha}+{\beta}$ region of the Cu-Sn phase diagram. This specific alloy and the thermo-mechanical treatment constitute two key elements of the unique technical tradition called Bangcha (방짜) that has long been established in Korea. The high Sn content ensures better casting and the thermal treatment causes the brittle ${\delta}$ phase to be avoided in forging as well as in services. The experiment on the laboratory Cu-Ag alloys of varying Ag contents suggested that the Cu-Ag system was the best choice of materials for the rivets at the time in view of their color, availability, ductility and low melting points.

• 마이크로전자및패키징학회지
• /
• 제15권4호
• /
• pp.1-7
• /
• 2008

본 실험에서는 두가지 리플로 시스템에 따라 솔더 범프 내에 생성되는 금속간 화합물의 성장거동에 대하여 연구하였다. 산화막이 증착된 Si 기판 위에 직류 마그네트론 스퍼터링을 이용하여 Ti(50 nm), Cu($1{\mu}m$), Au(50 nm), Ti(50 nm)의 박막을 형성한 후, 전해 도금을 이용하여 $5{\mu}m$두께의 Cu 범프와 $20{\mu}m$ 두께의 Sn 범프를 형성하였다. 급속열처리장치(RTA)와 일반 리플로를 이용하여 전해 도금으로 형성된 Sn($20{\mu}m$)/Cu($5{\mu}m$) 범프를 동일한 온도에서 각각 리플로 공정을 진행한 결과, 급속열처리장치를 이용하여 리플로를 할 때, 플럭스를 사용하지 않고 범프로 형성할 수 있었으며, 솔더 계면에 형성된 금속간 화합물이 일반 리플로의 경우보다 더 얇게 형성되었다.

• 한국표면공학회지
• /
• 제35권1호
• /
• pp.39-46
• /
• 2002

$Cu_2$$ZnSnS_4$(CZTS) thin film is one of the candidate materials for the solar cell. It has an excellent optical absorption coefficient as well as appropriate 1.4~1.5eV band gap. The purpose of this study is replacing a half of high-cost Indium(In) atoms with low-cost Zinc(Zn) atoms and the other half with low-cost Tin(Sn) atoms in the lattice of CIS. Thin films were deposited on ITO glass substrates using a compact target which were made by $Cu_2$S, ZnS, SnS$_2$ powder at room temperature by rf magnetron sputtering and were annealed in the atmosphere of Ar and $S_2$(g). We investigated potentialities of a low-cost material for the solar cell by measuring of thin film composition, the structure and optical properties. We could get an appropriate $Cu_2$$ZnSnS_4$ composition. Structure was coarsened with increasing temperature and (112), (200), (220), (312) planes appeared to conform to all the reflection Kesterite structure. A (112) preferred orientation was advanced with increasing the annealing temperature as shown in the diffraction peaks of the CIS cells and was available for photovoltaic thin film materials. The band gap increased from 1.51 to 1.8eV as the annealing temperature increased. The optical absorption coefficient of the thin film was about $10^4$$cm^{-1}$.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
• /
• pp.84-87
• /
• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• 한국주조공학회지
• /
• 제21권4호
• /
• pp.239-245
• /
• 2001

Microstructure and mechanical properties of Sn-3.1 wt.%Ag-6.9 wt.%Bi system solders on Cu-substrate were studied. The Sn3.1 wt.%Ag-6.9 wt.%Bi alloy was designed by phase diagram and chemical properties and was prepared by melting in argon atmosphere. The mechanical properties of solder/Cu joints were examined by shear strength test, and also creep test. The microstructure of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy consists of Bi-rich phase and $Ag_3Sn$ precipitate in {\beta}-Sn$ matrix phase. The shear strength of the joint was decreased with aging treatment. Crack path under shear test was through the solder. Similar crack path change mode was observed at the creep test of solder/Cu joint. The creep behavior of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy represented the inverse primary creep behavior at all test condition. It is suggested that the inverse primary creep behavior is induced from Bi solute atoms in Sn-matrix. The creep resistance of Sn-3.1Ag-6.9Bi alloy is better than that of Sn-3.5 wt.%Ag alloy at all test conditions.

• 한국공작기계학회논문집
• /
• 제16권5호
• /
• pp.151-156
• /
• 2007

In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of $100^{\circ}C$ and $130^{\circ}C$ under the load of 15$\sim$20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.