• 한국환경농학회지
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• 제9권2호
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• pp.113-119
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• 1990

토양중(土壤中) Cr, Ni, Cd, Cu, Zn을 각각(各各) 0, 20, 50, 100, 200ppm첨가(添加)하고 무와 배추의 발아(發芽) 및 생육(生育)에 미치는 각(各) 중금속(重金屬)의 영향(影響)을 조사(調査)하였다. 무우와 배추의 발아(發芽)는 Ni와 Cr 200ppm첨가(添加) 토양(土壤)에서 심한 억제(抑制)를 받았으나 Cu, Cd, Zn 200 ppm첨가(添加) 토양(土壤)에서는 크게 영향(影響)을 받지 않았다. 5종(種)의 중금속(重金屬)이 무우와 배추의 생육(生育) 억제(抑制)에 미치는 영향(影響)은 Cr>Ni>Cd>Cu>Zn순(順)였으며 무우보다 배추가 더 크게 억제(抑制)를 받았다. 무우에 대하여 50%이상(以上) 심한 생육억제(生育抑制)를 보였던 각 중금속(重金屬)의 첨가농도(添加濃度) Cr가 20ppm, Ni, Cd과 Cu은 50ppm, Zn은 200ppm였으며, 배추에 대하여 Cr, Ni, Cd, Cu가 20ppm, Zn은 200ppm였다. 중금속(重金屬)에 의한 2가지 작물(作物)의 생육억제(生育抑制)는 토양중(土壤中) 퇴비(堆肥)와 석회(石灰)의 첨가(添加)에 의하여 현저(顯著)히 경감(輕減)되었다.

• 한국표면공학회지
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• 제29권5호
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2011년도 춘계학술논문집 2부
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• pp.683-686
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• 2011

The effect of welding material such as welding wires and materials for contact tip on the contact tip wear was investigated. Two types welding wires such as solid and flux cored wire and a variety of contact tips made of Cu-P, Cu-Cr(0.25%), Cu-Cr(1%) and Cu-Cr-Zr were employed for the comparison of wear resistance. It was found that the wear resistance of contact tips materials was Cu-Cr-Zr, Cu-Cr(1%), Cu-Cr(0.25%), Cu-P in order while the solid wire had a better wear resistance than flux cored wire.

• 한국재료학회지
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• 제19권3호
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

• 한국표면공학회지
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• 제27권5호
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• pp.261-272
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• 1994

Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

• 한국표면공학회지
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• 제29권3호
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• 한국해양환경ㆍ에너지학회지
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• 제19권3호
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• pp.203-210
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• 2016

본 연구는 국내에서 유통되고 있는 해조류(김, 다시마, 미역)와 양식장에서 채취한 미가공 김에서 9종의 중금속 함량을 분석하고, 해조류 섭취에 따른 식품 위해성평가를 실시하였다. 가공된 해조류에서의 중금속 함량은 Fe>As>Zn>Cu>Cd>Pb>Cr>Ni>Hg 순으로 높게 나타났다. 미가공 김과 가공 김의 중금속 농도를 비교한 결과 미가공 김이 가공된 김보다 Cd과 Zn을 제외한 7종의 중금속 농도가 높게 나타났다. 해조류에서 검출된 중금속 성분간 상관관계는 미가공 김에서 Cr-Fe간에 통계적으로 유의한 상관관계를 나타내었고, 가공된 김에서 Cu-Cd, Cu-Zn, Cd-Zn, Pb-Ni간에 통계적으로 유의한 상관관계를 나타내었으며, 다시마에서 Cu-Cr, Cu-Zn, Cd-Cr, Ni-Fe간에 높은 상관관계를 나타내었고 미역에서는 Cu-Cd, Cu-Pb, Cd-Ni, Cr-Zn, Cr-Fe, Zn-Fe간에 높은 상관관계를 나타내었다. 미가공 김과 가공 김에서 중금속의 농도차이나 중금속간에 상관관계의 양상이 다른 것을 고려하면 가공과정 중에 중금속에 따라 제거효율이 다른 것으로 예상되어졌다. 해조류를 통한 Cu, Cd, Zn, Fe, Hg의 주간섭취량은 잠정주간섭취허용량의 0.1~7.6%에 해당되므로 해조류 내 중금속 함량은 매우 안전한 농도수준으로 판단된다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.142-142
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• 2011

Epitaxial $CuCrO_2$ thin films have been grown on single crystal substrate of c-plane $Al_2O_3$, $SrTiO_3$, YSZ and Quarts by laser ablation of a $CuCrO_2$ target using 266nm radiation from a Nd:YAG laser. X-ray measurements indicate that the $CuCrO_2$ grows epitaxially on all substrate, with its orientation dependent on the kinds of substrates. Most of the layer were polycrystalline with (001), (015) and random as the dominant surface orientation on c-plane YSZ, $SrTiO_3$ and quarts substrate, respectively. (001) orientated $CuCrO_2$ grows on C-plane $Al_2O_3$ and YSZ substrate, (015) orientated $CuCrO_2$ films are found on c-plane $SrTiO_3$ substrate and random orientated $CuCrO_2$ films grows on quarts substrate. These data are compared with the in-plane orientation and the mismatch of the $CuCrO_2$ and each substrate lattices in an attempt to relate the preferred orientation to the plane of the sapphire on which it is grown. Further characterization show that the grain size of the films increases for a substrate temperature increase, whereas the electrical properties of $CuCrO_2$ thin films depend upon their crystalline orientation.

• Transactions on Electrical and Electronic Materials
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• 제12권1호
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• pp.28-31
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• 2011

Transformation behavior and shape memory characteristics of Ti-(45-x)Ni-5Cu-xCr (x=0.5-2.0) alloys have been investigated by means of electrical resistivity measurements, differential scanning calorimetry, X-ray diffraction and thermal cycling tests under constant load. Two-stage B2-B19-B19' transformation occurred in Ti-(45-x)Ni-5Cu-xCr alloys. The B2-B19 transformation was separated clearly from the B19-B19' transformation in Ti-44.0Ni-5Cu-1.0Cr and Ti-43.5Ni-5Cu-1.5Cr alloys. A temperature range where the B19 martensite exists was expanded with increasing Cr content because decreasing rate of Ms (85 K / % Cr) was larger than that of Ms' (17 K / % Cr). Ti-(45-x)Ni-5Cu-xCr alloys were deformed in plastic manner with a fracture strain of 68% ~ 43% depending on Cr content. Substitution of Cr for Ni improves the critical stress for slip deformation in a Ti-45Ni-5Cu alloy due to solid solution hardening.

• 한국환경보건학회지
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• 제16권2호
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• pp.83-87
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• 1990

This study was carried out to investigate the pollution of heavy metals in soil of seven stations from the upper spot (Yeungchun Dam) of Kumho River to the downstream(Gangchang Bridge). The results obtained were as follows: 1. The content of heavy metals in soil of Kumho River basin was highest at Gangchang Bridge [expresed in $\mu$g/g : Mn(246.0), Cd(1.90), Fe(551.2), Cu(108.2), Zn(86.4), Cr(80.2), respectively]. Whereas, the content of heavy metals expect for Mn, Cu was lowest at Yeungchun Dam [Cd(0.40), Fe(548.0), Zn(30.7), Cr(6.2), respectively] Also, the content of Cr, Zn was increased when the sampling areas are changed from upstream to downstream except for Hayang Bridge, and Hayang Bridge was the diverging point of the heavy metals content. 2. There were relatively correlated between Mn : FE, Cu, Zn, Cr, Fe : Cu, Zn, Cr(0.40 < $\left$\mid${r}\right$\mid$$ < 0.70), and were high correlated between Cd : Mn, Fe, Cu, Zn, Cu : Zn, Zn : Cr(0.70 < $\left$\mid${r}\right$\mid$$ < 0.90). Particularly, there was higest correlated between Cd : Cr, Cu : Cr(0.90< $\left$\mid${r}\right$\mid$$ < 1.0)