• Journal of the Korean Wood Science and Technology
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• v.43 no.1
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• pp.112-121
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• 2015

In this study, Copper Azole (CuAz), a domestically available wood preservative for pressure treatment, was employed to perform an experimental research on its infiltration and decay properties in Japanese Red Pine. Test specimens were pressure-injected with CuAz-2 preservative to measure its preservative effectiveness, and then its impact on weight and mass losses. Furthermore, wood specimens were treated with CuAz-2 preservatives of various concentration levels before they were decayed with brown-rot-fungi in order to observe decay properties on light microscope (LM) and field emission scanning electron microscope (FE-SEM). As a result, untreated specimen by Fomitopsis palustris showed the mass loss of more than 40%, and the value of preservative effectiveness of CuAz-2 by indoor decay was $1,73-3.32kg/m^3$. The concentration levels of CuAz-2 preservative were shown to cause significant variations in terms of decay progresses in the cross section, radial section, and tangential section. By contrast, untreated specimens had underwent serious decays in early wood, late wood, longitudinal resin canals, and ray, which led to vertical destruction of wood texture. As for the radial section, ray tracheid, ray parenchyma cell, and window like pits were decayed and destroyed. In the case of tangential section, uniseriate rays and vertical resin canals were seriously decayed. In conclusion, this study indicates that the adequacy of the current CuAz injection amount should be reviewed in the domestic environment because there are significantly different decays at different decay conditions.

• Journal of the Korean Wood Science and Technology
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• v.31 no.4
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• pp.44-49
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• 2003

This study was carried out to evaluate the weathering durability of waterborne preservative (AAC, ACQ, CCA, CuAz) treated Japanese red pine (Pinus densiflora S. et Z.) sapwood samples by accelerated weathering, and to find out the factor of stability. When considered the color changes, weight losses, surface degradation, and microstructure changes due to weathering, ACQ-, CCA-, and CuAz-treated samples were durable against weathering; the weathering durability of AAC-treated samples was poor and similar to untreated controls. The lignin content in aqueous extracts collected from ACQ-, CCA-, and CuAz-treated samples during weathering was lower than that from untreated and AAC-treated ones. From these findings, we might concluded that weathering durability of ACQ-, CCA-, and CuAz-treated samples was enhanced by the fixation of preservative component(s) onto the lignin structure, which is very susceptible to weathering.

• Journal of the Korean Wood Science and Technology
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• v.39 no.6
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• pp.521-530
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• 2011

Nowadays, market demand of structural Glulam is growing and diversifying. The durability of Glulam should be significantly considered when they are intended to apply for out-door use such as timber bridge and pergola. This study was aimed to develop the manufacturing process of preservative treated structural Glulam using domestic softwood species. 10 m long structural Glulam were manufactured from domestic pitch pine logs with CuAz-3 preservative treatment. At each manufacturing process, the production yield was evaluated. Finally, bending tests were performed to verify the structural performance of manufactured Glulam. From the results, it was shown that the preservative treatment process hardly influenced on the production yield. But domestic pitch pine was proved to not be suitable for making the preservative treated Glulam due to the large difference of preservative permeability between sapwood and heartwood.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.4
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• pp.180-184
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• 2020

The crystallographic texture plays an important role in both the plastic deformation and the macroscopic anisotropy of magnesium alloys. In previous study for AZ80 magnesium alloy, it was found that the main texture components of the textures vary with the deformation conditions at high temperatures. Also, the basal texture was formed at stress of more than 15-20 MPa and the non-basal texture was formed at stress of less than 15-20 MPa. Therefore, in this study, uniaxial compression deformation of AZ80 magnesium alloy was carried out at high temperature (stress of 15-20 MPa). The uniaxial compression deformation is performed at temperature of 723 K and strain rate 3.0 × 10^-3s^-1, with a strain range of between -0.4 and -1.3. Texture measurement was carried out on the compression planes by the Schulz reflection method using nickel filtered Cu Kα radiation. EBSD measurement was also conducted in order to observe spatial distribution of orientation. As a result of high temperature deformation, the main component of texture and its development vary depending on deformation condition of this study.

• Journal of the Korean Wood Science and Technology
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• v.37 no.3
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• pp.245-254
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• 2009

As a substitute for CCA, which is inhibited due to its environmental pollution and human harmfulness, and CuAz and ACQ with a high cost, okara-based wood preservatives were formulated with okara hydrolyzates using copper sulfate and/or borax as a metal salt. The efficacy of the preservatives and X-ray microanalysis of wood specimens treated with the preservatives were examined to confirm the potential of the okara-based wood preservatives. Most of the preservatives showed excellent decay resistance against brown-rot fungi, Postia placenta and Gloeophyllum trabeum. The efficacy was improved when the acid concentration and temperature used for the hydrolysis of okara increased. In addition, when borax was added into copper sulfate/okara hydrolyzates preservative formulations, any decay was not found in the specimens. From the microscopic observation of the specimens treated with okara-based wood preservatives, it seems that okara is contributed to the fixing of metal salts in wood blocks. Therefore, it is speculated that okara-based wood preservatives can effectively protect wood against fungal attack as CuAz, and that the preservatives are sufficient to use as an alternative wood preservative of CCA, ACQ and CuAz.

• Journal of Korean Society of Environmental Engineers
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• v.22 no.3
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• pp.511-521
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• 2000

Investigation was carried out lean burn de-NOx properties of Pt-$TiO_2$ bifunctional catalyst by propylene in order to get the high de-NOx activity and the wide temperature window under coexistence of $SO_2$ and $H_2O$. Only noncatalyst and carrier catalyst themselves had NOx conversion activity at high temperature over $400^{\circ}C$. NOx conversion activity of catalysts exchanged copper ion resulted in Cu-$TiO_2$>Cu-ZSM-5>Cu-$Al_2O_3$>CU-YZ>Cu-AZ. Catalysts impregnated with platinum based on titania gave the results of high NOx conversion activity at low temperature. $250^{\circ}C$. Bifunctional catalysts based on Pt-$TiO_2$ showed high NOx conversion activity both at a low zone of $300^{\circ}C$ and a high zone of $500^{\circ}C$. Pt-$TiO_2$/$Al_2O_3$ catalyst gave the highest NOx conversion activity at a low temperature zone. and Pt-$TiO_2$/$Mn_2O_3$(21) catalyst gave the highest NOx conversion activity at a high temperature zone. Under the coexistence of $SO_2$ and $H_2O$. NOx conversion activities of 0.55wt%Pt-$TiO_2$/5wt%Cu-ZSM-5 catalyst was high both at a low and high temperature zone, and increased depending on oxygen concentration. 0.55wt%Pt-$TiO_2$/5wt%Cu-ZSM-5 catalyst showed the best correlation between de-NOx activities and the propyl ere conversion rates to CO on the log function.

• Journal of the Korean Wood Science and Technology
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• v.43 no.6
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• pp.804-809
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• 2015

Since Korea is home to Reticulitermes speratus, a kind of subterranean termites that prefer dark and humid conditions, there have been increasing damages to wooden structures by termites. One noticeable attribute of Korean subterranean termites is that they prefer than Pinus densiflora, the major construction material for Korean traditional houses. And because wide varieties of termites are distributed all over the world, it is not so easy to choose appropriate control methods depending on specific areas. This necessitates careful applications of the following control methods depending on the kinds of termites: fumigation treatment, soil termiticide, preservatives and insect treatment, termite colony elimination system, chemical treatment, and other physical and biological treatment methods. The purpose of this study is to investigate the control effects of environmentally-friendly Alkaline copper quaternary (ACQ), Copper Azole (CuAZ) and Micronized copper quarter (MCQ) on the termites contributing to the damage of wooden structures. It was found in this study that wood with preservative treatment produced a significantly higher termicidal efficacy than untreated wood.

• Journal of the Korean Wood Science and Technology
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• v.40 no.3
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• pp.212-227
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• 2012

Current research trends in wood preservatives for enhancing durability was reviewed. Due to leaching of recent Copper-Based Preservatives commonly used as chemicals for pressure treatment; they have been a growing concern, especially in improving the fixation of the copper as alkyl ammonium quat. and azol in wood and preventing the leaching of active ingredients. With the appearance of emulsion type chemicals using micronized and nano-sized wood preservatives, researchs on characteristics of Copper-Based Preservatives regarding penetration and fixation in wood are debatable. Moreover, unlike the case of CCA, the recent alkyl ammonium quat. and azol bear a serious threat in the decrease of antimicrobial effectiveness against wood destroying fungi with copper tolerance. Therefore, development and research of co-biocide is needed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.