• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.293.1-293.1
• /
• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• Journal of Welding and Joining
• /
• v.30 no.2
• /
• pp.54-58
• /
• 2012

Al-coated steel sheets with excellent heat and corrosion resistance are widely used in various applications. In welding of thin plate, some defects such as unmelted zone and metal-through occur easily in the beginning and ending of welding line. In the study, the welding defects in Al-coated steel sheets were investigated with respect to plasma arc current, height between Cu block and base metals, and using a roller to align the height of the base metal. Full penetration and voids free welds were obtained with a plasma arc current 52A and weld speed 2.3m/min. An unmelted zone increased and Ericshen rate decreased as the height between Cu block and base metal increased from 0 to 0.6mm. Using a roller moving ahead of the plasma arc, the length of unmelted zone decreased from 1.7mm to 0.5mm.

• Journal of the Korean Ceramic Society
• /
• v.28 no.9
• /
• pp.675-682
• /
• 1991

Among many problems that need to be solved in the process of preparing multilayer chip LC filters, we studied the control of shrinkage in order to prevent the crack, warpage, and/or delamination which occurs at the interface between the inductance (L part) and the capacitance (C part). Shrinkage was controlled by compositions, powder size, calcining temperature and amount of organic binder. Capacitance sheet was prepared by mixing 65 wt% binder with the composition of 96 wt% TiO2 having an average particle size of 0.5 $\mu\textrm{m}$, 3 wt% CuO. After small amount of MnO2 and SiO2 added, it was calcined at 750$^{\circ}C$ for 2 hr. Inductance sheet was prepared by mixing 60 wt% binder with the composition of 49.5% mol% Fe2O3, 20.5 mol% ZnO, 20 mol% NiO and 10 mol% CuO which was calcined at 775$^{\circ}C$ for 2 hr. These sheets was laminated at 250 kg/$\textrm{cm}^2$, and cofired at 900$^{\circ}C$ for 2 hr to give rise to a multilayer chip LC filter without any warpage.

• Transactions of Materials Processing
• /
• v.26 no.1
• /
• pp.35-40
• /
• 2017

Laser forming is an advanced process in sheet metal forming in which thermal stress originated from the laser heat source is used to shape the metal sheet. However, substantial waiting time is normally necessary for the workpiece to cool down between consecutive scans so that a steep temperature gradient can be reestablished in the next scan. In order to solve this drawback, laser bending characteristics are experimentally implemented in underwater condition. Laser forming effects under various conditions, including different laser power, scanning velocity, beam diameter, number of passes and material, are investigated. The results show that the underwater laser forming facilitates deliberate forming. The bending angle per respective laser scan is decreased with increasing the number of passes and scanning velocity.

• Korean Journal of Materials Research
• /
• v.24 no.3
• /
• pp.140-144
• /
• 2014

The contact mechanism of devices is usually researched at electrode contacts. However, the contact between a dielectric and channel at the MOS structure is more important. The graphene was used as a channel material, and the thin film transistor with MOS structure was prepared to observe the contact mechanism. The graphene was obtained on Cu foil by the thermal decomposition method with $H_2$ and $CH_4$ mixed gases at an ambient annealing temperature of $1000^{\circ}C$ during the deposition for 30 min, and was then transferred onto a $SiO_2/Si$ substrate. The graphene was doped in a nitrogen acidic solution. The chemical properties of graphene were investigated to research the effect of nitric atoms doping. The sheet resistance of graphene decreased after nitrogen acidic doping, and the sheet resistance decreased with an increase in the doping times because of the increment of negative charge carriers. The nitric-atom-doped graphene showed the Ohmic contact at the curve of the drain current and drain voltage, in spite of the Schottky contact of grapnene without doping.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.23 no.2
• /
• pp.173-177
• /
• 2014

In this study, a 20,000Hz ultrasonic horn was designed and fabricated using a finite element analysis. The horn's resonate frequency was 19,991Hz, and the harmonic response frequency was 20,000Hz. In order to observe the developed horn's performance, 4,000 pieces of displacement data were obtained using an optical sensor and were analyzed using a fast Fourier transform. Finally, the developed horn's resonate frequency was found to be 19,992Hz. The effect of the tip area of the developed horn on the weldability of a Cu sheet was experimentally investigated. It was found that the welding strengths of specimens welded using a small tip area were generally higherthan those of specimens welded using a large tip area.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.4
• /
• pp.328-335
• /
• 2001

In this work, we made the precision thin film resistors of NiCr alloy (74wt%Ni-f18wt%Cr-4wt%Al-4wt%Cu) using DC/RF magnetron sputtering method and studied the sheet resistance and TCR(Temperature Coefficient of Resistance) etc... of the Ni-Cr-Al-Cu alloy thin film according to the change by annealing treatment to 400$\^{C}$ in air and nitrogen atmosphere and the change(power, pressure, substrate temperature) of sputtering process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.05a
• /
• pp.302-305
• /
• 2009

This paper examines the effect of nitride formation on formability for Cu bearing high strength extra low carbon (ELC) steel sheets. For this purpose, we have investigated the effect of addition of aluminium (Al) and boron (B) on texture and precipitation behavior of the ELC steel during continuous annealing. Mechanical properties and microstructures of the ELC steel sheets were analyzed as well using uni-axial tensile test, electron back-scattered diffraction (EBSD) technique and transmission electron microscopy (TEM) following pilot rolling and continuous annealing. It has been found that the addition of Al and B increases the precipitation of AlN and BN. What is more, the scavange of solute nitrogen is effective in increasing the formability of the ELC steels. In addition, the Al and B addition improves the aging property of the ELC steel.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.786-787
• /
• 2006

The magnetic inductance of nanocrystalline $Fe_{73}Si_{16}B_7Nb_3Cu_1$ and an amorphous FeSiB powder sheet has been investigated to identify RFID performance. The powder was mixed with binder and solvent and tape-casted to form films. Results show annealing significantly influenced on the inductance of the material. The surface oxidation of the particles was the main reason for the reduced inductance. The maximum inductance of $Fe_{73}Si_{16}B_7Nb_3Cu_1$ alloy was about $88{\mu}H$ at 17.4 MHz, about 65% greater compared to the FeSiB alloy. The higher inductance in the nanocrystalline alloy indicates it may be used as a potential replacement of current RFID materials.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.430.1-430.1
• /
• 2016

We present the concept of reducible fugitive material that conformally surrounds core Cu nanowire (NW) to fabricate transparent conducting electrode (TCE). Reducing atmosphere can corrodes/erodes the underlying/surrounding layers and might cause undesirable reactions such impurity doing and contamination, so that hydrogen-/forming gas based annealing is impractical to make device. In this regards, we introduce novel reducible shell conformally surrounding indivial CuNW to provide a protection against the oxidation when exposed to both air and solvent. Uniform copper lactate shell formation is readily achievable by injecting lactic acid to the CuNW dispersion as the acid reacts with the surface oxide/hydroxide or pure copper. Cu lactate shell prevents the core CuNW from the oxidation during the storage and/or film formation, so that the core-shell CuNW maintains without signficant oxidation for long time. Upon simple thermal annealing under vacuum or in nitrogen atmosphere, the Cu lactate shell is easily decomposed to pure Cu, providing an effective way to produce pure CuNW network TCE with typically sheet resistance of $19.8{\Omega}/sq$ and optical transmittance of 85.5% at 550 nm. Our reducible copper lactate core-shell Cu nanowires have the great advantage in fabrication of device such as composite transparent electrodes or solar cells.