• Journal of Powder Materials
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• v.10 no.2
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• pp.83-88
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• 2003

Nanocrystalline materials of Ni and Ni-Cu alloy have been synthesized by the pulsed wire evaporation (PWE) method and these abnormal magnetic properties in the magnetic ordered state have been characterized using both VSM and SQUID in the range of high and low magnetic fields. Ni and Ni-Cu particles with an average size of 20 to 80 nm were found to influence magnetic hysterisis behavior and the results of powder neutron diffraction patterns and saturation magnetization curves are shown to indicate the absence of the NiO phase. The shifted hysterisis loop and irreversibility of the magnetization curve in the high field region were observed in the magnetic-ordered state of both Ni and Ni-Cu. The virgin magnetization curve for Ni slightly spillover on the limited hysterisis loop ($\pm$20kOe). This irreversibility in the high field of 50 kOe can be explained by non-col-linear behavior and the existence of the metastable states of the magnetization at the surface layer (or core) of the particle in the applied magnetic field. Immiscible alloy of Cu-Ni was also found to show irreversibility having two different magnetic phases.

• Journal of Surface Science and Engineering
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• v.24 no.2
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• pp.103-113
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• 1991

Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30$0^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50$0^{\circ}C$, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.

• Korean Journal of Materials Research
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• v.13 no.12
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• pp.819-824
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• 2003

The Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy exhibited excellent elongation by the new thermomechanical treatment (TMT) process; solution treatment and furnace cooling\longrightarrowhot and cold rolling and then annealing for short time. Tensile test at high temperature from 430 to $500^{\circ}C$ has been performed with various strain rates using for the Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy obtained by the TMT process. The elongation of the Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc was 550% tensile tested at $470^{\circ}C$ temperature and 2.2 $\times$ $10^{-3}$ $s^{-1}$ strain rate. The m value of Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy deformed 85% increased from 0.33 to 0.46 with increasing total elongation. This new TMT process was very simple and easy to make the sheets in the company.

• Journal of the Korean Society for Heat Treatment
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• v.11 no.1
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• pp.27-34
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• 1998

Effects of different heat treatments on microstructure and damping capacity of Cu-55%Mn alloy were investigated to find an optimum heat treatment condition for a maximum damping capacity. The alloy showed the high level of damping capacity in case of the aging at 375 and $400^{\circ}C$. This is ascribed to the FCC${\rightarrow}$FCT martensitic transformation and microstructural changes from mottled to tweed band type. The damping capacity had a maximum value of 0.33 in logarithmic decrement when the alloy was aged at $375^{\circ}C$ for 14 hours followed by 20 times of thermal cycling between room temperature and $250^{\circ}C$. The refinement of tweed structure by thermal cycling is thought to be responsible for the highest damping capacity.

• Journal of the Korean Society for Heat Treatment
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• v.9 no.3
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• pp.187-197
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• 1996

In this study, the properties of coil spring made by Cu-Zn-Al and B added shape memory alloys are investigated. The measurement of recovery displacement and energy with increasing weight, and thermocycling properties have been studied using displacement measuring device. Transformation temperature and phase change by thermocycling have been also investigated by DSC and X-ray diffractometer. Grain size of the alloy is refined from 1.2mm to $400{\mu}m$ by 0.06wt% of B addition. The maximum recovery energy of the coil spring for B added alloy is larger than that of no B added alloy, it is because of grain refinement. And shape memory ability of the coil spring by thermocycling decrease with increasing thermocycling after thermocycle under load. The degradation of shape memory properties of coil spring by thermocycling is improved by B addition.

• Journal of Powder Materials
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• v.6 no.2
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• pp.171-177
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• 1999

Ti-45.2at.%Ni-5at.%Cu and Ti-40.2at.%Ni-10atat.%Cu alloy powders were fabricated by gas atomization process. The microstructures, Shape, hardness and phase transformation behaviors of the powders were investigated by means of optical microscopy, scanning electron microscopy, micro-hardness measurement, x-ray diffraction analyses and differential scanning calorimetry. The hardness of the Ti-Ni-XCu alloy powders decreased as Cu-content increased. The x-ray diffraction analyses were carried out for powders without heat treatment, and those that treated at 85$0^{\circ}C$ for an hour in a vaccum state($10^5$ torr) and then quenched into ice water. The intensity of B$19^t$ phase increased with heat treating. The monoclinic B$19^t$ martensite was formed in the Ti-Ni-XCu alloy powders during cooling.

• Journal of Korea Foundry Society
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• v.17 no.4
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• pp.379-384
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• 1997

Al-15Cu-lMg alloys have been directionally solidified in 3mm diameter alumina tubes under the conditions of $760^{\circ}C$ of furnace temperature and 12 cm/hr of furnace moving velocity(V). By analyzing the evolution of the temperature profiles along the alloy length, the position of the solid/liquid interface, temperature gradient(G) and local growth velocity (R) were determined. These growth characteristics were compared for 6, 10, 14 cm length alloys. Steady state growth region was obtained in 15 cm length alloy, not in 6, 10 cm.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.85-101
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• 1994

Effect of Cr, Cu and Ni metal powders addition on the alloyed layer of aluminum alloy (AC2B) has been investigated with the plasma transferred arc (PTA) overlaying process. The overlaying conditions were 125-200A in plasma arc current, 150mm/min in process speed and 5-20g/min in powder feeding rate. Main results obtained are summarized as follows: 1) It was made clear that formation of thick surface alloyed layer on aluminum alloy is possible by PTA overlaying process. 2) The range of optimum alloying conditions were much wider in case of Cu and Ni powder additions than the case of Cr powder addition judging from the surface appearance and the bead macrostructure. 3) Alloyed layer with Cu showed almost the homogeneous microstructure through the whole layer by eutectic reaction. alloyed layers with Cr and Ni showed needle-like and agglomerated microstructures, the structure of which has compound layer in upper zone of bead by peritectic and eutectic-peritectic reactions, respectively. 4) Microconstituents of the alloyed layer were analyzed as A1+CrA $l_{7}$ eutectics, C $r_{2}$al sub 11/, CrA $l_{4}$, C $r_{4}$A $l_{9}$ and C $r_{5}$A $l_{*}$ 8/ for Cr addition, Al+CuA $l_{2}$(.theta.) eutectics and .theta. for Cu addition, and Al+NiA $l_{3}$ eutectics. NiA $l_{3}$, N $i_{2}$A $l_{3}$ and NiAl for Ni addition. 5) Concerning defect of the alloyed layer, many blow holes were seen in Cr and Ni additions although there was lesser in Cu addition. Residual gas contents in blow hole for Cu and Ni alloyed layer were confirmed as mainly $H_{2}$ and a littie of $N_{2}$ Cracking was observed in compound zone of the alloyed layer in case of Cr and Ni addition but not in Cu alloyed layer.r.r.

• Korean Journal of Materials Research
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• v.29 no.4
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• pp.258-263
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• 2019

Since the directly bonded interface between TiAl alloy and SCM440 includes lots of cracks and generated intermetallic compounds(IMCs) such as TiC, FeTi, and $Fe_2Ti$, the interfacial strength can be significantly reduced. Therefore, in this study, Cu is selected as an insert metal to improve the lower tensile strength of the joint between TiAl alloy and SCM440 during friction welding. As a result, newly formed IMCs, such as $Cu_2TiAl$, CuTiAl, and $TiCu_2$, are found at the interface between TiAl alloy and Cu layer and the thickness of IMCs layers is found to vary with friction time. In addition, to determine the relationship between the thickness of the IMCs and the strength of the welded interfaces, a tensile test was performed using sub-size specimens obtained from the center to the peripheral region of the friction-welded interface. The results are discussed in terms of changes in the IMCs and the underlying deformation mechanism. Finally, it is found that the friction welding process needs to be idealized because IMCs generated between TiAl alloy and Cu act to not only increase the bonding strength but also form an easy path of fracture propagation.