• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.169-171
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• 2006

Solderability and reaction properties were investigated for four Pb-free alloys as a function of Ag contents; Sn-4.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu, Sn-2.5Ag-0.5Cu, and Sn-1.0Ag-0.5Cu. The alloy of the lowest Ag content, i.e., Sn-1.0Ag-0.5Cu, showed poor wetting properties as the reaction temperature decreased to 230oC. Variation of Ag concentration in the Sn-xAg-0.5Cu alloy shifted exothermic peaks indicating the undercooling temperature in DSC curve. For the aging process at 170oC, the thickness of IMCs at the board-side solder/Cu interface increased with the Ag concentration.

• 한국주조공학회지
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• 제12권3호
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• pp.238-247
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• 1992

A carbon fiber(CF) reinforced Cu-10%Sn alloy matrix composite was successfully fabricated by squeeze casting method employing preheated graphite mold and proper process controlling factors. The matrix solidification microstructure of the Cu-10%Sn/CF composite reveals ${\alpha}-dendrite$ and ${\alpha}+{\delta}$ eutectoid. To compare the squeeze cast Cu-10%Sn/CF compostie with PM route fabricated Cu-graphite composites for electric contact material, mechanical wear and electrical arc wear tests were performed. Mechanical wear rate of the Cu-10%Sn/CF is much lower than that of the Cu-graphite composite. Weight loss with a variation of contact number in electrical arc wear tests shows a similar trend between the squeeze cast Cu-10%Sn/CF and PM Cu-graphite composites.

• Journal of Welding and Joining
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• 제17권5호
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• pp.69-76
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• 1999

A copper-tungsten sintered alloy(Cu-W) has been friction welded to a tough pitch copper in order to investigate the effect of upset pressure on friction weldability. Under the condition of friction time 0.8sec, upset pressure 150MPa, the tensile strength and Charpy impact value of the friction welded joint were 336MPa, $400KJ/m^2$ respectively. And highest temperature of the weld measured was below $800^{circ}K$ which is very lower than melting point of Cu($1356^{circ}K$). Under the same conditions, W grains picked up in Cu matrix from Cu-W profitably affected on these mechanical fracture, and were dispersed in Cu by plastic flow during brake time.

• 대한치과보철학회지
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• 제27권1호
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• pp.143-179
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• 1989

To observe the bonding behavior of palladium-based alloys to porcelain; 1. Pd-Co binary alloy with the higher cobalt content, 2. Pd-Co binary alloy with the lower cobalt content, 3. Pd-Ag-Sn ternary alloy, 4. Pd-Ag binary alloy, 5. Pd-Cu-Au ternary alloy and 6. Pd-Cu binary alloy were made as 6 groups of experimental alloys. Each group of alloy was divided into 4 sub-groups such as one sub-group that was not degassed and three sub-groups that degassed for 5 minutes, 10 minutes and 15 minutes. On each specimen, weight changes after degassing, morphological changes of oxide layer by changing the degassing time, compositional changes at metal-ceramic interface and bond strength of metal-ceramic measured with planar shear test were observed and compared. The results of the present study allow the following conclusions to be drawn: 1. The alloy showing the greatest bond strength was Pd-Cu alloy without gold and bond strength was decreased by alloying gold to them. 2. Although Pd-Co alloy showed the most prominent oxidation behavior, bond strength of them to porcelain was not greatly high by the formation of porosities at metal-ceramic interfaces. 3. Likewise tin, cobalt formed the peaks on line profiles at metal-ceramic interface, however copper did not exhibit such peaks on line profiles. 4. Mainly, oxide layer on Pd-Co alloy was composed with cobalt, and for Pd-Co alloy with higher cobalt content the rise of bond strength was not significant by increased degassing time. 5. On Pd-Ag alloy not containing tin, during degassing for 15 minutes silver content was increased at metal-ceramic interface. 6. As an oxidized element, tin formed the oxide layers that widen their area by increasing the degassing time, while cobalt and copper showed the morphological changes of particle or crystal on oxide layer.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.403-403
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• 2010

The Pt-Ni alloy is an electro-catalyst of interest in the low temperature direct methanol fuel cells(DMFCs). It has been already reported that the Pt-Ni alloy catalysts may even have enhanced activity compared to pure platinum catalyst, depending on how the surfaces are prepared. The order-disorder transition in bimetallic alloy such as $\beta$-CuZn, Cu3Au, and CuAu have been investigated greatly by x-ray diffraction. After annealing the bimetallic alloy, the crystal structure changes as observed in the order-disorder transition of Cu3Au which changes from the face centered cubic to a simple cubic structure. Pt-Ni bimetallic alloy has been already reported to have the face centered cubic structure. However, in nano-scale Pt-Ni bimetallic alloy crystals the crystal structures changes to a simple cubic structure. In this experiment, we have studied the order-disorder transition in Pt-Ni bimetallic nanocrystals. Pt/Ni thin films were deposited on sapphire(0001) substrates by e-beam evaporator and then Pt-Ni alloy were formed by RTA at 500, 600, and $700^{\circ}C$ in a vacuum environment and Pt-Ni nano particles were formed by RTA at $1059^{\circ}C$ in a vacuum environment. We measured the structure of Pt-Ni bimetallic alloy films using synchrotron x-ray diffraction and SEM.

• 한국재료학회지
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• 제23권9호
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• pp.525-530
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• 2013

This study investigated the continuous cooling transformation, microstructure, and mechanical properties of highstrength low-alloy steels containing B and Cu. Continuous cooling transformation diagrams under non-deformed and deformed conditions were constructed by means of dilatometry, metallographic methods, and hardness data. Based on the continuous cooling transformation behaviors, six kinds of steel specimens with different B and Cu contents were fabricated by a thermomechanical control process comprising controlled rolling and accelerated cooling. Then, tensile and Charpy impact tests were conducted to examine the correlation of the microstructure with mechanical properties. Deformation in the austenite region promoted the formation of quasi-polygonal ferrite and granular bainite with a significant increase in transformation start temperatures. The mechanical test results indicate that the B-added steel specimens had higher strength and lower upper-shelf energy than the B-free steel specimens without deterioration in low-temperature toughness because their microstructures were mostly composed of lower bainite and lath martensite with a small amount of degenerate upper bainite. On the other hand, the increase of Cu content from 0.5 wt.% to 1.5 wt.% noticeably increased yield and tensile strengths by 100 MPa without loss of ductility, which may be attributed to the enhanced solid solution hardening and precipitation hardening resulting from veryfine Cu precipitates formed during accelerated cooling.

• 한국기계가공학회지
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• 제17권3호
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• pp.102-108
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• 2018

The objective of this study is to develop the mechanical properties of an AlSiCu aluminum alloy using the two-step solution heat treatment. The microstructure of the gravity casting specimen represents a typical dendrite structure with a secondary dendrite arm spacing (SDAS) of 40 um. In addition to the Al matrix, a large amount of coarsen eutectic Si phase, $Al_2Cu$ intermetallic phase, and Fe-rich phases is generated. The eutectic Si phases are fragmented and globularized with the solution heat treatment. The $Al_2Cu$ intermetallic phase is also resolutionized into the Al matrix. The $2^{nd}$ solution temperature at $525^{\circ}C$ may be an optimal condition to enhance the mechanical properties of the AlSiCu aluminum alloy.

• 한국분말재료학회지
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• 제10권2호
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• pp.83-88
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• 2003

Nanocrystalline materials of Ni and Ni-Cu alloy have been synthesized by the pulsed wire evaporation (PWE) method and these abnormal magnetic properties in the magnetic ordered state have been characterized using both VSM and SQUID in the range of high and low magnetic fields. Ni and Ni-Cu particles with an average size of 20 to 80 nm were found to influence magnetic hysterisis behavior and the results of powder neutron diffraction patterns and saturation magnetization curves are shown to indicate the absence of the NiO phase. The shifted hysterisis loop and irreversibility of the magnetization curve in the high field region were observed in the magnetic-ordered state of both Ni and Ni-Cu. The virgin magnetization curve for Ni slightly spillover on the limited hysterisis loop ($\pm$20kOe). This irreversibility in the high field of 50 kOe can be explained by non-col-linear behavior and the existence of the metastable states of the magnetization at the surface layer (or core) of the particle in the applied magnetic field. Immiscible alloy of Cu-Ni was also found to show irreversibility having two different magnetic phases.

• 한국표면공학회지
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• 제24권2호
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• pp.103-113
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• 1991

Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30$0^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50$0^{\circ}C$, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.

• 한국재료학회지
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• 제16권4호
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.