• Journal of Welding and Joining
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• v.15 no.4
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• pp.136-142
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• 1997

In this study, the amorphous foil filler, thickness of 20 - $20~30\mu\textrm{m}$ was made to develop Cu-7.5wt%Mn-7.5wt%Si insert alloy(melting point temperature : solidus line 1003K, liquidus line 1070K). Liquid phase diffusion bonding of 304 stainless steels (STS304), is carried out successfully by using developed Cu-7.5Mn-7.5Si insert alloy. Bonding conditions are taken from bonding pressure of 5MPa, bonding temperatures from 1073K to 1423K varied within 50K and brazing holding times of 0, 30, 60 and 240 minutes. As the results, the tensile strength in the liquid phase diffusion bonding is a little bit lower than that in the solid phase diffusion bonding. The authors find out that the liquid phase diffusion bonding needs lower bonding pressure than the others. Therefore, the liquid phase diffusion bonding had an excellent brazability in which the bonding process showed the typical mechanism of diffusion bonding. In corresponding, the new developed insert alloy of low melting pointed Cu-7.5Mn-7.5Si makes possible brazing between the STS304.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• Transactions of Materials Processing
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• v.10 no.7
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• pp.565-572
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• 2001

It is well known that a multicomponent $Zr_{4l.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ bulk metallic glass alloy shows good bulk glass forming ability due to its high resistance to crystallization in the undercooled liquid state. DSC and XRD have been performed to confirm the amorphous structure of the master alloy. To investigate the mechanical properties and deformation behavior of the bulk metallic $Zr_{4l.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy, a series of compression tests has been carried out at the temperatures ranging from $351^{\circ}C$ to $461^{\circ}C$at the various initial strain rates from $2{\times}10^4s^1$ to $2{\times}10^2s^1$. Three types of nominal stress-strain curves have been identified such as linear stress-strain relationship meaning fracture at maximum stress, plastic deformation including stress overshoot and steady-state flow, plastic deformation without stress overshoot depending on the strain rate and test temperature. Also DSC analysis for the compressed specimens was carried out to investigate the change of structure, thermal stability and crystallization behavior for the various test conditions.

• Korean Journal of Materials Research
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• v.13 no.6
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• pp.352-359
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• 2003

In order to control the grain size, the spark plasma sintering technique is applied for the manufacturing of Cu-26.7Al-4.05AI(wt.%) shape memory alloy with pure Cu, Zn, and Al element powders. The sintering processes were carried out under different atmospheres. The sintered bodies were denser under Ar or Ar＋4%$H_2$gas atmosphere than under vacuum. With use of small-sized powders, a very small average grain size of 2∼3 $\mu\textrm{m}$ was obtained, but the single phase was not formed. With the large-sized powders the single austenitic phase was observed with the average grain size of $70∼72\mu\textrm{m}$. When the different size of raw powders was mixed, it is confirmed that the average grain size of the manufactured alloys was 15 $\mu\textrm{m}$ with single austenitic phase, but the distribution of grain size was not uniform.

• Journal of the Korean Society for Heat Treatment
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• v.3 no.2
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• pp.1-9
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• 1990

Since the reverse shape memory effect(RSME) was reported in a CuZnAl alloy, further study has been done on the mechanism of this phenomenon and reported that it occurs by the bainitic transformation. But the present authors revealed in the previous work that the RSME in a B2 CuZnAl alloy is not caused by the shear process involved in the bainitic transformation and also that the RSME takes place as the remaining ${\alpha}^{\prime}{_2}$ phase, which is two-step transformed strain induced martensite, is newly transformed into ${\alpha}$ phase. In order to provide further evidence in supporting the facts, thus, more detailed investigations have been carried out in a $DO_3$ CuZnAl alloy.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.6
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• pp.277-283
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• 2020

Cu-Co-Si based alloy has a strengthening mechanism for Co₂Si intermetallic compounds deposited on the copper matrix after aging treatment and the solution treatment has a key influence on the strength and electrical conductivity of the final products. In this paper, the Cu-1.6%Co-0.38%Si alloy was fixed at the time and the solution treatment temperature was set at a temperature in the range of 800 to 950℃, and the change in mechanical properties was observed by fixing the temperature at 950℃ and changing the time. The microstructure was observed using an electron microscope and an optical microscope, and the changes in hardness, electrical conductivity, and bending workability after aging treatment were investigated. When the solution treatment time is less than 20 seconds, the solution treatment is not sufficient and the formation of precipitates contributing to the increase in hardness decreases and the hardness decreases after the aging treatment, and in more than 50 seconds, the hardness decreases due to the coarsening of the grains and the bending workability got worse.

• Transactions of Materials Processing
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• v.32 no.1
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• pp.35-40
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• 2023

In the case of a wire with a very fine diameter during the multi-stage drawing process, the heterogeneity of the deformation in the radial direction tends to develop strongly as the amount of deformation is accumulated. It is known that the heterogeneity of deformation in the radial direction of the wire is closely related to the process parameters during the multi-stage drawing process. In this study, finite element analysis (FEA) was used to theoretically examine the effect of friction between the surface of the wire and the drawing die during the multi-stage drawing process of Cu-0.2wt%Mg alloy on the deformation heterogeneity developed in the radial direction of the wire. The distribution of effective strain, radial strain, circumferential strain, and shear strain developed in the radial direction of the wire during the multi-stage drawing process was analyzed while changing the friction coefficient, and the results were analyzed and compared for each path and position. The FEA results revealed that the shear strain developed in the radial direction of the wire during the multi-stage drawing process of Cu-0.2wt%Mg alloy showed the most non-uniform distribution and was also severely affected by the friction coefficient.

• Korean Journal of Materials Research
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• v.15 no.11
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• pp.697-704
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• 2005

The deformation behavior of a bulk amorphous and crystallized amorphous $Zr_{22.5}Ti_{14}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy extracted from a commercial golf club head was characterized at room temperature ana $300^{\circ}C$. At room temperature, amorphous specimens revealed higher yield stress and ductility than partially crystallized alloy specimens. Amorphous alloy displayed some plasticity before fracture, which resulted from strain hardening and repeated crack initiation and propagation. The fracture is mainly localized on one major shear band, and the compressive fracture angle of the amorphous specimen between the stress axis and the fracture plane was about $40^{\circ}$ Scanning electron microscope observations revealed mainly a vein-like structure in the amorphous alloy But the fracture surface of partially crystallized amorphous alloy consisted of vein-like and featureless fracture structure. The partially crystallized alloy extracted from the thick part of the club fractured in the elastic region, at a much lower stress level than the amorphous, suggesting that relatively coarse crystal particles formed during cooling cause the brittle fracture.

• Journal of Technologic Dentistry
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• v.24 no.1
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• pp.65-71
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• 2002

This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker's hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

• Journal of Technologic Dentistry
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• v.19 no.1
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• pp.21-35
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• 1997

The Ag-Pd-Cu alloys containing a small amount of Au is commonly used for dental purposes, because this alloy is cheaper than Au-base alloys for clinical use. However, the most important characteristic of this alloy is age-hardenability, which is not exhibited by other Ag-base dental alloys. The specimens used were Ag-20Pd-20Cu ternary alloy and Au addition alloy. These alloys were melted and casted by induction electic furace and centrifugal casting machine in Ar atmoshpere. These specimens were solution treated for 2hr at $800^{\circ}C$ and were then quenched into iced water, and aged at $350{\sim}550^{\circ}C$ Age-hardening characteristics of the small Au-containing Ag-pPd-Cu dental alloys were investigated by means of hardness testing, X-ray diffraction and electron microscope observations, electrical resistance, differential scanning calorimetric, emergy dispersed spectra and electron probe microanalysis. Principal results are as follows : Hardening occured in two stages, I. e., stage I in low temperature and stage II in high temperature regions, during continuous aging. The case of hardening in stage I was due to the formation of the Llo type face centered tetragonal PdCu-ordered phase in the grain interior and hardening in stage I was affedted by the Cu concentration. In stage II, decomposition of the $\alpha$ solid solution to a PdCu ordered phase(L1o type) and an Agrich ${\alpha}2$ phase occurred and a discontiunous precipitation occurred at the grain boundary. Form the electron microscope study, it was concluded that the cause of age-hardening in this alloy is the precipitation of the PdCu ordered phase, which has AuCu I type face-centered tetragonal structure. Precipitation procedure was ${\alpha}\to{\alpha}+{\alpha}2+PdCu\to{\alpha}1+{\alpha}2+PdCu$ at Pd/Cu = 1 Ag-Pd-Cu alloy is more effective dental alloy as ageing treatment and is suitable to isothermal ageing at $450^{\circ}C$.