• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.43-47
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• 2001

Sn-3Ag-8Bi-5In was developed for the intermediate melting point solder. Although In-contained solder is expensive, its melting point is lower than these of Sn-Ag-Cu alloys. Sn-3Ag-8Bi-5In solder used for this research has a melting range of 188~$204^{\circ}C$. On this study wetting characteristics of Sn-3Ag-8Bi-5In were evaluated in order to investigate its availability as a Pb-free solder. Wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-3Ag-8Bi-5In. Experimental results showed that the zero-cross-time and wetting time at $240^{\circ}C$ for the Sn-3Ag-8Bi-5In were 1.1 and 2.2 second respectively. These values are a little better than these of Sn-37Pb and Sn-3.5Ag solders. The equilibrium wetting farce of the Sn-3Ag-8Bi-5In was 5.8 mN at $240^{\circ}C$, and it was tuned out to be a little higher than that of Sn-3.5Ag and lower than that of Sn-37Pb.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.864-873
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• 1995

Amorphous $Fe_{73.5}Cu_{1}Nb_{3}Si_{16.5}B_{6}$ ribbons were annealed for different time at $500^{\circ}C$ and $552^{\circ}C$, just before and after the exothermic reaction in DSC curve. The development of nanocrystalline phase was investigated by means of $M\"{o}ssbsuer$ spectroscopy. The crystalline phase consists mainly of $DO_{3}Fe-Si$. Though slight in amount (5%), another ferromagnetic phase which could be presumed $t-Fe_{3}B$ was detected Si content of $DO_{3}Fe-Si$, Si/(Fe+Si), was 0.218 under the heat treatment at $500^{\circ}C$ for 60 min and 0.222 at $552^{\circ}C$ for 10 min. Since then both of those values decreased with time until 120 min and finally these two values remained constant at 0.210. The variation in Si content with annealing time results in the variation in the hyperfine field and the isomer shift. The increase in the mean hyperfine fields and the decrease in the mean isomer shifts of Fe-Si are caused by the increase in Si content. The volume fractions of residual amorphous phase rapidly decrease during the early stage of annealing and come nearer to saturation after 120 min both at $500^{\circ}C$ and $552^{\circ}C$. The decrease in the mean hyperfine field of residual amorphous. in spite of slight changes in the volume fractions of Fe-Si and of residual amorphous after 120 min. is caused by the increase in the content of Nb and B in residual amorphous phase. The saturated volume fraction of the crystalline phase was 81% for $500^{\circ}C$ (180 min) and 77% for $552^{\circ}C$ (960 min), different from expectation.

• Journal of Korea Foundry Society
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• v.14 no.3
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• pp.240-247
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• 1994

TiC particulate reinforced magnesium matrix composites were fabricated by melt stirring method. The effect of alloying elements on TiC particulate dispersion into molten magnesium and mechanical properties were investigated. The incorporation time is defined as the time required for dispersion of solid particles into molten metal. The incorporation time of TiC particles into molten pure magnesium was remarkably shorter and the particulated dispersion was more uniform than that of pure aluminum which was reported previously. The incorporation time was, prolonged by the addition of Al, Bi, Ca, Ce, Pb, Sn or Zn. The tensile strength increased and elongation decreased by the addition of Cu or Sn into the matrices and composites. Although, the tensile strength of the matrices and composites increased by alloying with Ca or Ce, the maximum elongation was observed at a content of about 1% for the matrices. By alloying with Zn, the tensile strength increased for the matrices and composites, but the elongation of the matrices increased. The pure magnesium and its alloy matrix composites reinforced with 20vol% TiC have the tensile strength of about 400MPa. This value is compared with the tensile strength of SiC whisker reinforced magnesium matrix composites fabricated by liquid infiltration method at the same volume fraction. There fore, the melt strirring method which has the advantages of simple process is considered to be efficient in fabricating magnesium matrix composites.

• Transactions of the Korean hydrogen and new energy society
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• v.5 no.2
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• pp.81-90
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• 1994

The hydrogen fuel tanks having hydrogen storing capacity of about 300g and 1200g are manufactured using $MmNi_{4.7}Al_{0.25}V_{0.05}Fe_{0.001}$ alloy. They are composed of several unit reactor made of Cu-tube(outer diameter = 50.1mm, thickness = 2mm). In order to increase the heat and mass transfer property of the hydride bed, Al-plates are inserted perpendicular to axial direction at intervals of 5mm and three arteries of diameter 8mm are installed symmetrically in each unit reactor. Hydrogen absorption is proceeded about 80% within 30 minute and is completed within 60 minute at the conditions of charging hydrogen pressure of 25atm and temperature of $22^{\circ}C$. On desorbing hydrogen at a constant rate of 30 slm at $20^{\circ}C$, discharging hydrogen pressure is sustained at 3~5atm for 120 minutes. The discharging pressure is increased upto 5~8atm as the increase of the reactor temperature to $30^{\circ}C$. From the experimental results and the brief discussions about the hydrogen absorption and disorption behaviors of the hydrogen storage tank, it is suggested that the behaviors of hydrogen charging and discharging could be controlled by adjusting the operating parameters and the reactor design parameters.

• Journal of the Korean Electrochemical Society
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• v.13 no.4
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• pp.270-276
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• 2010

Nickel-copper foam electrodes with pore gradient micro framework and nano-ramified wall have been prepared by using an electrochemical deposition process. Growth habit of nickel-copper co-deposits was quite different from that of pure nickel deposit. In particular, the ramified structure of the individual particles was getting clear with chloride ion content in the electrolyte. The ratio of nickel to copper in the deposits decreased with the distance away from the substrate and the more chloride ions in the electrolyte led to the more nickel content throughout the deposits. Compositional analysis for the cross section of a ramified branch, together with tactical selective copper etching, proved that the copper content increased with approaching central region of the cross section. Such a composition gradient actually disappeared after heat treatment. It is anticipated that the pore gradient nickel-copper nanostructured foams presented in this work might be a promising option for the high-performance electrode in functional electrochemical devices.

• Journal of the Korean Society for Heat Treatment
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• v.29 no.1
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• pp.1-7
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• 2016

Titanium and its alloys can be usually joined with brazing method. And the alloys should be brazed at low temperature to keep their original microstructure. In this study, the mechanical strength and microstructure of the CP-Ti joint-brazed with $Zr_{54}Ti_{22}Ni_{16}Cu_8$ filler metal having melting temperature of $774{\sim}783^{\circ}C$ were investigated. The tensile strengths of the joint-brazed at $800^{\circ}C$ with $100^{\circ}C/min$ of cooling rate showed more than 400 MPa which was as high as base metal. The $Widmanst{\ddot{a}}tten$ structure consisting of Ti and $Ti_2Ni$ phase was observed in the joint area. However, the tensile strengths of the joint-brazed at $800^{\circ}C$ with $15^{\circ}C/min$ of cooling rate were decreased and the Ti, $(Ti,Zr)_2Ni$ and $Ti_2Ni$ phases were observed at the joint area. It is believed that the $(Ti,Zr)_2Ni$ laves phases could decrease the mechanical strength of the joint and the cooling rate should be controled to get high strength of the titanium joint.

• Journal of Powder Materials
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• v.13 no.4 s.57
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• pp.256-262
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• 2006

The amorphous $Fe_{73}Si_{16}B_7Nb_3Cu_1$ alloy strip was pulverized to get a flake-shaped powder after annealing at $425^{\circ}C$ for 90 min and subsequently ground to obtain finer flake-shaped powder by using a ball mill. The powder was mixed with polyimide-based binder of $0.5{\sim}3wt%$, and then the mixture was cold compacted to make a toroidal powder core. After crystallization treatment for 1 hour at $380{\sim}600^{\circ}C$, the powder was transformed from amorphous to nanocrystalline with the grain size of $10{\sim}15nm$. Soft magnetic characteristics of the powder core was optimized at $550{\sim}600^{\circ}C$ with the insulating binder of 3wt%. As a result, the powder core showed the outstanding magnetic properties in terms of core loss and permeability, which were originated from the optimization of the grain size and distribution of the insulating binder.

• Journal of Powder Materials
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• v.9 no.6
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• pp.381-393
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• 2002

Recent developments in nanocrystalline and nanocomposite rare earth-transition metal magnets are reviewed and emphasis is placed on research work at IFW Dresden. Principal synthesis methods include high energy ball milling, melt spinning, mold casting and hydrogen assisted methods such as reactive milling and hydrogenation-disproportionation-desorption-recombination. These techniques are applied to NdFeB-, PrFeB- and SmCo-type systems with the aim to produce high remanence magnets with high coercivity. Concepts of maximizing the energy density in nanostructured magnets by either inducing a texture via anisotropic HDDR or hot deformation or enhancing the remanence via magnetic exchange coupling are evaluated. With respect to high temperature applications melt spun $Sm(Co_{0.74}Fe_{0.1}Cu_{0.12}Zr_{0.04})_{7.5}$ ribbons were prepared, which showed coercivities of up to 0.53 T at 50$0^{\circ}C$. Partially amorphous $Nd_{60}Fe_xCo_{30-x}Al_{10}(0{\leq}x{\leq}30)$ alloys were prepared by copper mold casting. The effect of transition metal content on the glass-forming ability and the magnetic properties was investigated. The $Nd_{60}Co_{30}Al_{10}$ alloy exhibits an amorphous structure shown by the corresponding diffraction pattern. A small substitution of Co by 2.5 at.% Fe results In the formation of Fe-rich crystallites embedded in the Nd-rich amorphous matrix. The Fe-rich crystallites show hard magnetic behaviour at room temperature with a coercivity value of about 0.4 T, relatively low saturation magnetization and a Curie temperature of 500 K.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.2
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• pp.307-315
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• 2005

We have studied to obtain the SAW filter for the passband was formed on the Langasite substrate and was evaporated by Aluminum-Copper alloy and then we performed computer-simulated by simulator. We can fabricate that the block weighted type IDT as an input transducer of the filter and the withdrawal weighted type IDT as an output transducer of the filter from the results of our computer-simulation. Also, we have performed to obtain the properly design conditions about phase shift of the SAW filter for WCDMA. We have employed that the number of pairs of the input and output IDT are 50 pairs and the thickness and the width of reflector are 5000$\AA$ and 3.6$mu$m, respectively. Frequency response of the fabricated SAW filter has the property that the center frequency is about 190MHz and bandwidth at the 3dB is probably 8.2MHz. And we could obtain that return loss is less then 16dB, ripple characteristics is probably 4dB and triple transit echo is less then 18dB after when we have matched impedance.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.