• Corrosion Science and Technology
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• 제17권4호
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• pp.176-182
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• 2018

Corrosion of the Cu alloy with 10wt% Ni in stagnant seawater with residual free chlorine was investigated. Despite that fact that Cu alloys are widely used for seawater applications due to their stubborn resistance to chloride attack, not much is known as to how the residual free chlorine in seawater affects corrosion of Cu and its alloys. In this work, immersion tests were conducted in the presence of different levels of chlorine for 90-10 Cu-Ni samples, one of the most frequently used Cu alloys for seawater application, mostly in shipbuilding. The results revealed no evidence for accelerated corrosion of the Cu-Ni alloy even in the presence of 5 ppm residual chlorine in seawater, signifying that the Cu-Ni alloy can be more tolerant to residual chlorine that has been commonly cited by the shipbuilding industry. However, comparison of polarization behavior of the alloy samples in the presence of different electrolytes with different concentrations of residual chlorine suggests that higher concentration of chlorine could increase the corrosion rate of the Cu-Ni alloy. Furthermore, it is suggested that microorganisms in the seawater could increase the corrosion rate of the Cu-Ni alloy by encouraging exfoliation of the corrosion product off the metal surface.

• Applied Microscopy
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• 제45권1호
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• pp.9-15
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• 2015

In the present study, microstructural evolution in CuCrFeNi, CuCrFeNiMn, and CuCrFeNiMnAl alloys has been investigated. The as-cast CuCrFeNi alloy consists of a single fcc phase with the lattice parameter of 0.358 nm, while the as-cast CuCrFeNiMn alloy consists of (bcc+fcc1+fcc2) phases with lattice parameters of 0.287 nm, 0.366 nm, and 0.361 nm. The heat treatment of the cast CuCrFeNiMn alloy results in the different type of microstructure depending on the heat treatment temperature. At $900^{\circ}C$ a new thermodynamically stable phase appears instead of the bcc solid solution phase, while at $1,000^{\circ}C$, the heat treated microstructure is almost same as that in the as-cast state. The addition of Al in CuCrFeNiMn alloy changes the constituent phases from (fcc1+fcc2+bcc) to (bcc1+bcc2).

• 한국분말재료학회지
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• 제19권4호
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• pp.317-321
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• 2012

In this study, Cu-5Ni-10Sn(wt%) spinodal alloy was manufactured by gas atomization spray forming, and the microstructural features and mechanical properties of Cu-5Ni-10Sn alloy have been investigated during homogenization, cold working and age-hardening. The spray formed Cu-5Ni-10Sn alloy consisted of an equiaxed microstructure with a mixture of solid solution ${\alpha}$-(CuNiSn) grains and lamellar-structure grains. Homogenization at $800^{\circ}C$ and subsequent rapid quenching formed a uniform solid solution ${\alpha}$-(CuNiSn) phase. Direct aging at $350^{\circ}C$ from the homogenized Cu-5Ni-10Sn alloy promoted the precipitation of finely distributed ${\gamma}$' or ${\gamma}-(Cu,Ni)_3Sn$ phase throughout the matrix, resulting in a significant increase in microhardness and tensile strength. Cold working prior to aging was effective in strengthening Cu-5Ni-10Sn alloy, which gave rise to a maximum tensile strength of 1165 MPa. Subsequent aging treatment slightly reduced the tensile strength to 1000-1100 MPa due to annealing effects.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• 열처리공학회지
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• 제7권4호
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• pp.253-261
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• 1994

Transformation behavior and superelastic behavior of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, X-ray diffraction, tensile test and transmission electron microscopy. Two types of heat treatment are given to the specimens: i) Solutions treatment. ii) thermo-mechanical treatment. The transformation sequence in solution treated Ti-Ni-Cu Alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\rightleftarrows}B19^{\prime}$ and it proceeds in two stages by addition of 10at.%Cu, i. e, $B2{\rightleftarrows}B19{\rightleftarrows}B19^{\prime}$. Also, it has been found that Ti-30Ni-20Cu alloy transformed in one stage : $B2{\rightleftarrows}B19$. The thermo-mechanically treated Ti-47Ni-3Cu alloy transformed in two stages: B2${\rightleftarrows}$rhomboheral phase${\rightleftarrows}B19^{\prime}$, while transformation sequence in Ti-45Ni-5Cu and Ti-40Ni-10Cu alloy transformed as same as solution treated specimens. The critical stress for inducing slip deformation in solution treated and thermo-mechanically treated Ti-40Ni-10Cu alloy is about 90MPa and 320Mpa respectively.

• 대한치과기공학회지
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• 제23권1호
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• pp.9-19
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• 2001

Microstructure and phase transformation of Ti-Ni-Cu alloy powders produced by using attrition milling method were studied. Mixed powders of Ti-(50-X)Ni-XCu ($X=0{\sim}20$ at%) in composition range were mechanically alloyed for maximum 20 hours by using SUS 1/4" ball in argon atmosphere. Ball to powder ratio was 50: 1 and impeller speed was 350rpm. Mechanically alloyed with attrition millimg method. powder was heat treated at the temperature up to $850^{\circ}C$ for 1 hour in the $10^{-6}$ torr vacuum. Ti-Ni-Cu alloy powders have been fabricated by attrition milling method. and then phase transformation behaviours and microstructual properties of the alloy powders were investigated to assist in improving the the high damping capacity of Ti-Ni-Cu shape memory alloy powders. The results obtained are as follows: 1. After heat treating of fully mechanically alloyed powder at $850^{\circ}C$ for 1hour. most of the B2 and B 19' phases was formed and $TiNi_3$ were coexisted. 2. The B 19' martensite were formed in Ti-Ni-Cu alloy powders whose Cu-content is less than 5a/o. where as the B19 martensite in those whose Cu-content is more than 10at%. 3. The powders of as-milled Ti-Ni-Cu alloys whose Cu-contents is less than 5at% are amorphous. whereas those of as-milled Ti-Ni-Cu alloys whose Cu-content is more than 10at% are crystalline. This means that Cu addition tends to suppress amorphization of Ti-Ni alloy powders.

• 한국주조공학회지
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• 제22권6호
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• pp.304-308
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• 2002

The new Cu-Zr-Ti-Ni-Pd amorphous alloy system has been introduced and manufactured using melt-spinning and Cu-mold die casting methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties of the alloys were examined. The reduced glass transition temperature(Trg = Tg/Tm) and the supercooled liquid region(${\Delta}$Tx = Tx-Tg) of $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ alloy were 0.620 and 57 K respectively. $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ amorphous alloy was produced in the rod shape with 2mm diameter using the Cu-mold die casting. The hardness value of the amorphous bulk alloy was 432 DPN.

• 마이크로전자및패키징학회지
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• 제9권1호
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• pp.21-28
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• 2002

Sn-Cu-Ni계 솔더 합금에 소량의 Bi와 In을 첨가하여 새로운 무연솔더 합금 개발을 진행하였다. Sn-0.7%(Cu+Ni)에 2~5% Bi. 2~10% In을 첨가하여 각각의 열적, 전기적, 기계적 특성을 평가하였다. 솔더합금의 융점은 200~$222^{\circ}C$, 응고온도범위는 20~$37^{\circ}C$로 중.고온계 솔더로서 적용이 가능하다. 실험 조성별 솔더 합금중 실용적, 경제적인 면을 고려하여 Sn-0.7%(Cu+Ni)-3.5%Bi-2%In이 최적의 합금 조성으로 판단된다. 이 합금은 융점이 $220^{\circ}C$정도이며 응고범위는 $25^{\circ}C$, 강도 면에서는 타 합금에 비해 상당히 우수한 값을 나타내었으며 연신율은 비교적 낮은 값을 나타내었다. 다른 기계적, 전기적 특성은 타 솔더 합금과 유사하거나 우수한 편이었으며 젖음특성도 양호하였다.

• 한국분말재료학회지
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• 제11권5호
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• pp.376-382
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• 2004

Nanoscale Cu-Ni alloy nanopowders have been produced by a pulsed wire evaporation method in an inert gas. The effect of Cu-Ni alloy nanopowders as additives to motor oil on the tribological properties was studied at room temperature. The worn surfaces were characterized by Scanning Electron Microscopy (SEM) and Energy-Dispersive X-ray Spectroscopy (EDS). Cu-Ni alloy nanopowders as additives lowered coefficient of friction and wear rate. It was found that a copper containing layer on the worn surface was formed, and deposited layers of the metal cladding acted as lubricant on the worn surface, reducing the friction coefficient. It was clearly demonstrated that Cu-Ni alloy nanopowders as additives are able to restore the worn surface and to preserve the friction surfaces from wear.

• 한국전기전자재료학회논문지
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• 제30권6호
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• pp.376-380
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• 2017

In this paper, we prepared a metal alloy resistor with stable thermal electro motive force (thermal EMF) as well as a low temperature coefficient of resistance (TCR) by adjusting the manganese proportion from 3 to 12 wt% in the Cu-Mn-Ni alloy. Composition of the fabricated metal alloy was investigated using energy dispersive X-ray (EDX) analysis. The TCR of each sample was measured as 44.56, 40.54, 35.60, and 31.56 ppm for Cu-3Mn-2Ni, Cu-5Mn-2Ni, Cu-10Mn-2Ni, and Cu-12Mn-2Ni, respectively. All the resistor samples were available for the F grade (${\pm}1%$ of the allowable error of resistance) high-precision resistor. All the samples satisfied the baseline of high thermal EMF (under 3 mV at $60^{\circ}C$); however, Cu-3Mn-2Ni and Cu-5Mn-2Ni satisfied the baseline of low thermal EMF (under 0.3 mV at $25^{\circ}C$). We were thus able to design and fabricate the metal alloy resistor of Cu-3Mn-2Ni and Cu-5Mn-2Ni to have low TCR and stable thermal EMF at the same time.