• Korean Journal of Environmental Agriculture
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• v.9 no.2
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• pp.113-119
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• 1990

The germination and growth of radish and chiness cabbage in soils treated with Cr, Ni, Cd, Cu, and Zn at 20, 50, 100 and 200 ppm were determined. The germination of radish and chiness cabbage in soils was greatly affected by addition of Ni and Cr at 200 ppm, but almost not at all by treatment with Cd, Cu, and Zn even 200 ppm. The injury to the growth of crops was generally the highest with Cr, followed by Ni, Cd, Cu, and Zn, and more with chiness cabbage with radish. Serious crop injury appeared at 20 ppm of Cr, 50 ppm of Ni, Cd and Cu, and 200 ppm of Zn on radish, and at 20 ppm of Cr, Ni, Cd and Cu, and 200ppm of Zn of chiness cabbage. However, crop inhibition decreased greatly with addition of compost and lime.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• Journal of the Korean Society for Heat Treatment
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• v.37 no.4
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• pp.172-181
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• 2024

In this study, the effect of addition of Ti and Co elements on microstructural evolution and characteristics of vacuum-casted Cu-25%Cr electrical contact material was investigated. The coarse and insoluble Cr phases with an average size of 300 ㎛ in commercial Cu-25%Cr alloy were reduced to tens of micrometers in vacuum casted Cu-25%Cr-X(X=Ti, Co) alloy, which can be interpreted as result controlling coarsening and the work-frame structure of the insoluble Cr phase by the formation of intermetallic compounds such as Cr₂Ti or Cr_0.5Co_1.5Ti around the Cr phase As a result, the electrical properties such as weight loss and fusion resistance against the repeated arc generation of the electrical contact material as well as the mechanical properties were greatly improved.

• Proceedings of the KAIS Fall Conference
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• 2011.05b
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• pp.683-686
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• 2011

The effect of welding material such as welding wires and materials for contact tip on the contact tip wear was investigated. Two types welding wires such as solid and flux cored wire and a variety of contact tips made of Cu-P, Cu-Cr(0.25%), Cu-Cr(1%) and Cu-Cr-Zr were employed for the comparison of wear resistance. It was found that the wear resistance of contact tips materials was Cu-Cr-Zr, Cu-Cr(1%), Cu-Cr(0.25%), Cu-P in order while the solid wire had a better wear resistance than flux cored wire.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

• Journal of the Korean institute of surface engineering
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• v.27 no.5
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• pp.261-272
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• 1994

Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

• Journal of the Korean institute of surface engineering
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• v.29 no.3
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• Journal of the Korean Society for Marine Environment & Energy
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• v.19 no.3
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• pp.203-210
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• 2016

In this study, nine heavy metals were analyzed in seaweeds collected from market and laver culture farm of Korea and a food safety assessment were also carried out for these heavy metals. The level of heavy metal concentrations in seaweeds was in the following order: Fe>As>Zn>Cu>Cd>Pb>Cr>Ni>Hg. Except for zinc and cadmium, seven heavy metals were significantly higher in cultured laver than in processed laver. Significant correlation was observed Cr-Fe in cultured laver and Cu-Zn, Cd-Cu, Cd-Zn and Pb-Ni in processed laver and Cu-Cr, Cu-Zn, Cd-Cr and Ni-Fe in sea tangle and Zn-Fe, Cr-Fe, Cr-Zn, Cd-Ni, Cu-Cd and Cu-Pb in processed sea mustard. Considering differences in heavy metal concentration between processed laver and cultured laver and in correlation among heavy metals, removal efficiency of heavy metals may be attributed to seaweed treatment process. The average weekly intakes of Cu, Cd, Zn, Fe and Hg via seaweeds consumption were about 0.1~7.6% of PTWI (Provisional Tolerable Weekly Intakes). Therefore, it was found that heavy metals in the seaweeds were very safe for consumption.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.142-142
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• 2011

Epitaxial $CuCrO_2$ thin films have been grown on single crystal substrate of c-plane $Al_2O_3$, $SrTiO_3$, YSZ and Quarts by laser ablation of a $CuCrO_2$ target using 266nm radiation from a Nd:YAG laser. X-ray measurements indicate that the $CuCrO_2$ grows epitaxially on all substrate, with its orientation dependent on the kinds of substrates. Most of the layer were polycrystalline with (001), (015) and random as the dominant surface orientation on c-plane YSZ, $SrTiO_3$ and quarts substrate, respectively. (001) orientated $CuCrO_2$ grows on C-plane $Al_2O_3$ and YSZ substrate, (015) orientated $CuCrO_2$ films are found on c-plane $SrTiO_3$ substrate and random orientated $CuCrO_2$ films grows on quarts substrate. These data are compared with the in-plane orientation and the mismatch of the $CuCrO_2$ and each substrate lattices in an attempt to relate the preferred orientation to the plane of the sapphire on which it is grown. Further characterization show that the grain size of the films increases for a substrate temperature increase, whereas the electrical properties of $CuCrO_2$ thin films depend upon their crystalline orientation.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.28-31
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• 2011

Transformation behavior and shape memory characteristics of Ti-(45-x)Ni-5Cu-xCr (x=0.5-2.0) alloys have been investigated by means of electrical resistivity measurements, differential scanning calorimetry, X-ray diffraction and thermal cycling tests under constant load. Two-stage B2-B19-B19' transformation occurred in Ti-(45-x)Ni-5Cu-xCr alloys. The B2-B19 transformation was separated clearly from the B19-B19' transformation in Ti-44.0Ni-5Cu-1.0Cr and Ti-43.5Ni-5Cu-1.5Cr alloys. A temperature range where the B19 martensite exists was expanded with increasing Cr content because decreasing rate of Ms (85 K / % Cr) was larger than that of Ms' (17 K / % Cr). Ti-(45-x)Ni-5Cu-xCr alloys were deformed in plastic manner with a fracture strain of 68% ~ 43% depending on Cr content. Substitution of Cr for Ni improves the critical stress for slip deformation in a Ti-45Ni-5Cu alloy due to solid solution hardening.