• 한국표면공학회지
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• 제26권3호
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• pp.149-157
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• 1993

In the study of TAB(Tape Automated Bonding)technologies, Cu-Cr sputtered seed layer has been used to improve the adhesion between Polyimide and Cu film and electrical properties. But the Cu electrodeposit on Cu-Cr film had poor adhesion or powder-like form due to the surface Cr oxides on the Cu-Cr film. By means of activating the Cu-Cr film with the oxalic acid and phosphoric acid, the Cu film with the improved adhesion could be coated on the Cu-Cr sputtered film in CuSO4 solution. The etching rate was compared with increasing the Cr content of the sputtered Cu-Cr film, and anodic polarization curve in FeCl3 solution was investigated. With increasing the Cr content, the etching rate was reduced. The clean etching cross section could be obtained with increasing the concentration of FeCl3 solution. But above the 13 w/o Cr content, Cu-Cr sputtered film could not bed etched cleanly only with FeCl3 solution and additives were needed.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1995년도 춘계연구발표회 논문개요집
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• pp.86-87
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• 1995

• Journal of Animal Science and Technology
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• 제50권3호
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• pp.355-362
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• 2008

Cr 및 Cu의 형태별 병용급여가 육성돈의 육성성적, 영양소 소화율, 분내 광물질 배출량에 미치는 영향을 비교 분석한 결과는 다음과 같다.1.유기태 또는 무기태 형태의 Cr과 Cu를 병용급여한 결과 육성돈의 일당증체량은 CrMet과 CuMet을 첨가한 구에서 높게(p<0.05) 나타나고 사료요구율도 낮았다(p<0.05). 반면에 CrMet과 CuSO4를 병용 첨가한 구에서는 사료섭취량은 낮고(p<0.05) 일당증체량도 낮게(p<0.05) 나타났다.2.영양소 소화율은 CrMet과 CuMet을 병용 첨가한 구에서 영양소 소화율이 높게(p<0.05) 나타났으나, CrMet과 CuSO4를 병용 첨가한 구에서는 낮게(p<0.05) 나타났다. CrCl3 첨가구에서는 CuMet 또는 CuSO4를 병용 첨가하더라도 영양소 소화율에는 유의적인(p>0.05) 차이를 보이지 않았다. 3.광물질 Cu, Zn, Cr의 각각의 분으로의 배출율은 CrMet과 CuMet을 병용 첨가한 구에서 낮았으며(p<0.05), CrCl3와 CuSO4를 병용 첨가한 구에서 높게(p<0.05) 나타났다.이상의 결과를 집약하여 보면 유기태 형태의 병용 첨가구가 무기태 형태 병용 첨가구보다 일당증체량이 높고 사료요구율이 개선되었고, 영양소 소화율도 높게 나타났다. 또한 유기태 형태로 급여한 병용 첨가구가 무기태 형태로 병용 첨가한 구보다 Cu, Zn, Cr의 분으로의 배출율이 낮게 나타났다. 따라서 본 시험에서는 유기태 또는 무기태 Cr과 Cu의 병용첨가는 성장률이나 영양소 소화율에서 교호 및 길항작용 효과가 있는 것으로 판단된다. 또한 유기태 형태의 광물질로 무기태 형태를 대체 급여시 토양에 과다 축적될 경우 환경오염을 일으킬 수 있는 광물질의 배설량을 감소시킬 수 있음을 보여주었다.

• Applied Microscopy
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• 제45권1호
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• pp.9-15
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• 2015

In the present study, microstructural evolution in CuCrFeNi, CuCrFeNiMn, and CuCrFeNiMnAl alloys has been investigated. The as-cast CuCrFeNi alloy consists of a single fcc phase with the lattice parameter of 0.358 nm, while the as-cast CuCrFeNiMn alloy consists of (bcc+fcc1+fcc2) phases with lattice parameters of 0.287 nm, 0.366 nm, and 0.361 nm. The heat treatment of the cast CuCrFeNiMn alloy results in the different type of microstructure depending on the heat treatment temperature. At $900^{\circ}C$ a new thermodynamically stable phase appears instead of the bcc solid solution phase, while at $1,000^{\circ}C$, the heat treated microstructure is almost same as that in the as-cast state. The addition of Al in CuCrFeNiMn alloy changes the constituent phases from (fcc1+fcc2+bcc) to (bcc1+bcc2).

• 한국표면공학회지
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• 제27권5호
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• pp.273-284
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• 1994

Thermal behavior of Cu-Cr thin alloy films has been investigated by SEM, AES, and TEM. Cu-Cr alloy films containing 3wt% Cr, 8wt% Cr have been sputter-deposited onto polyimide substrates and heat treated at $400^{\circ}C$ for 2hrs in the various atmosphere. Before heat treatment, Cu and Cr content in the film are uniform through the thickness and oxygen content in the film is negligible. Redistribution of Cr, Cu, and O in the film due to heat treatment depends on the Cr content and heat treatment atmoshpere. There kinds of thermal behavior are ascribed to the formation of surface and interface oxides as well as internal oxidation. Hillocks are observed on the surface of Cu-Cr alloy films which have been heat treated in N2. The hillocks are composed of large grainss of Cu.

• 한국분말재료학회지
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• 제7권4호
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• pp.218-227
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• 2000

It is well known that the Cu-Cr alloys are very difficult to be made by conventional sintering methods. This difficulty originates both from limited solubility of Cr in the Cu matrix and from limited sintering temperature due to high vapor pressures of Cr and Cu components at the high temperature. Densification of Cu-50%Cr Powder compacts by conventional Powder metallurgy Process has been studied. Three kinds of sintering methods were tested in order to obtain high-density sintered compacts. Completely densified Cu-Cr compacts could be obtained neither by solid state sintering method nor by liquid phase sintering method. Both low degree of shrinkage and evolution of large pores in the Cu matrix during the solid state sintering are attributed to the anchoring effect of large Cr particles, which inhibits homogeneous densification of Cu matrix and induces pore generation in the Cu matrix. In addition, the effect of undiffusible gas coming from the reduction of Cu-oxide and Cr-oxide was observed during liquid phase sintering. A two-step sintering method, solid state sintering followed by liquid phase sintering, was proved to have beneficial effect on the fabrication of high-dendsity Cu-Cr sintered compacts. The sintered compacts have properties similar to those of commercial products.

• 열처리공학회지
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• 제15권1호
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• pp.21-24
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• 2002

The electrode materials for welding machine in automobile industry such as Cu-Cr, Cu-Zr and Cu-$Al_2O_3$ require the high electrical conductivity and the proper hardness. Therefore the effects of solution heat treatment and aging treatment on the electrical conductivity and hardness of Cu-0.8wt%Cr and Cu-1.2wt%Cr alloys have been investigated. Cu-0.8wt%Cr alloy showed the higher electrical conductivity and hardness than Cu-1.2wt%Cr alloy and both alloys showed the better electrical conductivity at $930^{\circ}C$ among 930, 980 and $1030^{\circ}C$ solution heat treatment temperatures. The electrical conductivity and hardness in both alloys were not affected by aging treatment but remarkably affected by solution heat treatment temperature. The final drawing process reduced electrical conductivity and increased hardness more in Cu-1.2wt%Cr alloy.

• 한국자기학회지
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• 제3권4호
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• pp.314-319
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• 1993

Co-12at%Cr-2at%Ta/Cr-X 자성박막의 자기적성질과 미세구조에 미치는 첨가원소 X(X=Si, Mo, Cu, Gd)의 영향에 대해 조사하였다. Cr-X 하지층 및 CoCrTa 자성층의 두께는 각각 $1000~2000\AA$과 $200~800\AA$이었으며, 기판온도는 $100~200^{\circ}C$로 변화시켰다. Cr-X 하지층은 순수한 Cr 하지층에 비하여 보자력이 100 Oe~200 Oe 이상 증가하였다. Cu는 Gd, Mo, Si보다 높은 보자력 을 나타내는 Cr-X 하지층의 첨가원소 였으며 CoCrTa/Cr-Cu 자성박막은 하지층두께 $1500\AA$과 자성층두께 $600\AA$에서 높은 보자력을 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.1065-1068
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• 2001

Effects of compacting pressure on the electrical and sintering characteristics of Cu25Cr contact material have been investigated. Cu25Cr contact materials were prepared by solid and liquid-phase sintering methods varying compacting pressure. Influence of compacting pressure on electrical characteristics were investigated in the cylindrical stainless-steel vessel using L-C resonant circuit. The physical and electrical properties of solid-phase sintered Cu25Cr material were found to be improved by increased compacting pressure. On the other hand, it was found that compacting pressure had little influence in case of liquid-phase sintered Cu25Cr material. After conditioning, contact resistance of Cu25Cr material was decreased regardless of compacting pressure. With increased compacting pressure, interrupting ability was shown to be increased.

• 한국전기전자재료학회논문지
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• 제13권8호
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• pp.704-710
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• 2000

Metal electrode materials for plasma display panel should have low electrical resistivity in order to maintain stable gas discharge and have fast response time. They should also hae good film uniformity adhesion and thermal stability. In this study Cr/Cu/Cr metal electrode structure is formed by DC magnetron sputtering. Cr and Cu films were deposited on ITO coated glasses with various DC power density and main pressures as the major parameters. After metal electrodes were formed a heat treatment was followed at 55$0^{\circ}C$ for 20 min in a vacuum furnace. The intrinsic stress of the sputtered Cr film passed a tensile stress maximum decreased and then became compressive with further increasing DC power density. Also with increasing the main pressure stress turned from compression to tension. After heat the treatment the electrical resistivity of the sputtered Cu film of 2${\mu}{\textrm}{m}$ in thickness prepared at 1 motor with the applied power density of 3.70 W/cm$^2$was 2.68 $\mu$$\Omega$.cm With increasing the main pressure the DC magnetron sputtered Cu film became more open structure. The heat treatment decreased the surface roughness of the sputtered Cr/Cu/Cr metal electrodes.