• Journal of the Korea Academia-Industrial cooperation Society
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• 제18권4호
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• pp.608-613
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• 2017

We proposed a pyrometallurgical process to achieve gold alloy with an Au content of more than 80wt% from low grade (<35wt%) gold alloys. We performed the heat treatment at a temperature of $1200^{\circ}C$ for 5 hrs using Au35wt%-Ag5wt%-Cu60wt% gold alloys mixed with 1/2 weighed PbO and CaO flux by varying the ratio of PbO/(PbO+CaO) from 0 to 1. We investigated the change in content of the samples with energy dispersive X-ray spectroscopy (EDS) and time of flight secondary ion mass spectrometry (ToF-SIMS). The EDS results showed that the Au content increased from 35.0wt% in the PbO-only sample to 86.7wt% (in the PbO/(PbO+CaO) 1:1 sample), while the other samples achieved more that 84wt%. In addition, the 2/3 flux ratio sample showed the lowest Ag loss into the flux. In the ToF-SIMS results, the PbO only and CaO only fluxes had Au+ peak intensities of 349 and 37, respectively. Although the CaO-only flux might be more favorable considering the loss of Au into the flux, we concluded that the amount of Au lost into the flux could be ignored. Our results imply that that the pyrometallurgical process using a mixed flux is an effective hydrometallurgical process.

• Journal of the Korean Society for Heat Treatment
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• 제14권2호
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• pp.89-95
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• 2001

The 7175Al alloy is particularly interesting for its high strength and sufficient ductility, fracture toughness and corrosion resistance. Currently vigorous efforts have been made to develop large rockets usable for various purposes in the space. This has created the demand of big size of 7175Al billet which would be applied to heavy forgings. The aim of this study is to investigate the quality level of big billet and the effect of billet size on the mechanical properties of large 7175Al ring roll forgings. The billets range from 370 mm to 720 mm in diameter were homogenized and forged after direct chill casting. The size and volume fraction of second phase particles In ${\Phi}720$ mm billet are larger than those of ${\Phi}370$ mm billet, and its ductility is lower for the condition of homogenization and T6 treatment. The Cu-rich phases formed in interdendritic sites are considered to provide the preferential crack path during cold upsetting. The fracture toughness of ring roll forgings which are made by ${\Phi}370$ mm billet is higher than those of ${\Phi}720$ mm billet.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.417-420
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• 2006

The composition and structure of dendrite phase within $Zr_{76.11}Ti_{4.20}Cu_{4.51}Ni_{3.16}Be_{1.49}Nb_{10.53}$ bulk metallic glass (BMG) were confirmed by using an EPMA, XRD and TEM, respectively. The chief elements of dendrite phase were Zr-Ti-Nb and had a BCC structure. The thermal properties of this BMG have been then subsequently investigated by using a differential scanning calorimeter (DSC). The glass transition and crystallization onset temperatures were determined as $339.7^{\circ}C$ and $375.8^{\circ}C$ for this alloy, respectively. Mechanical properties have also been examined by conducting a series of uniaxial compression tests at various temperatures within supercooled liquid region under the strain rates between $10^{-4}/s$ and $3{\times}10^{-2}/s$. The deformation behavior of BMG composite within supercooled liquid region is similar to one of Vit-1 exhibiting amorphous single phase alloy. The flow stresses of BMG composite, however, are entirely higher than those of Vit-1 because dendrite phases are interfere with moving of atoms.

• Journal of Surface Science and Engineering
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• 제23권1호
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• pp.34-43
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• 1990

Al-Si piston alloys such as AlS10CuMg have been anodized to examine apossibility of forming a hard film aat relatively higher temperatures compard with those in conventional sulfuric acid processes. Three types of electrolytes have been employed in this study ; electrolyte A(15% H2SO4, $0^{\circ}C$), electrolyte B(12% H2SO4, 1% oxalic, $10^{\circ}C$), electrolyte C(tartaric acid 125g/L+oxalic 75g/L+aluminum sulfate 225g/L, $25^{\circ}C$). Hard anodisine process in electrolyte B at a current density of 1.54A/dm2 produced a harder film of VHN 396 at a relatibely low film forming voltage compared with those obtained in other electrolyte at equivalent current density. A liner relationship between hardness and abrasion resistance exists for Al-Si piston alloys. The hardness of anodized film decreasees with increasing silicon content in Al-Si alloys and also with bath temperature. The film hardeness of Na-modified alloy os higher than that of P-modified alloy due to its finer microstructre. The film on the silicon phase in Al-Si alloys is observed to be formed by lateral growth of oxide film nucleated at surroundings.

• Korean Journal of Metals and Materials
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• 제48권10호
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• pp.936-941
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• 2010

Al-Zn based alloys are the most common types of wrought Al alloys. Although Al-Zn alloys have high strength, they cannot be applied to a conventional casting process. In this study, Al-Zn-based alloys applicable to a die casting process were developed successfully. The developed Al-45 wt% Zn-based alloys showed a fine equiaxed grain structure and high strength. A fine equiaxed grain having an average size of $25{\mu}m$ was obtained by the die casting process. The UTS and elongation of the new alloy are 475 MPa and ~3.5%, respectively. In addition, we elucidate the effect of a Zn addition on variations in different mechanical properties and the microstructure characteristics of (Al96.3-xZnxCu3Si0.4Fe0.3) x=20, 30, 40, and 45 wt% alloys fabricated by a die casting process.

• Korean Journal of Materials Research
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• 제3권3호
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• pp.253-260
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• 1993

High strength and fracture toughness of Al-Li-Cu alloy(2090 Al alloy) have been achieved by the improvement of melting and casting, extrusion and heat treatment techniques. To establish the sucessful process for semi-industrial scale ingot(20Kg) the following areas have been investigated: (1) Improvement of melting and casting techniques for ingot by introducing atmospheric modifications, vacuum and rotary degassing, and deslagging. (2) The effect of heat treatment on mechanical properties (3) Mechanical characterization by tensile test, fracture toughness test and fatigue crack propagation test. High mechanical properties were found to be intimately related with ingot soundness. Tensile strength of final products varied from 534MPa to 566MPa in peak aged condition while elongation/ductility ranged from 9.0% to 11.9%. From the fracture toughness test with using compact tensile specimen, plane strain fracture toughness($K_{Ic}$) appeared to be 39MPa${\surd}$m in peak aged condition and 23MPa${\surd}$ m in underaged condition. When load ratios of 0.1, 0.3 and 0.5 were given ${\Delta}K_{th}$ was 6.0MPa${\surd}$ m, 5.3MPa${\surd}$ m and 4.3MPa${\surd}$ m respectively.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Society for Heat Treatment
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• 제7권1호
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• pp.61-71
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• 1994

This study is to investigate the stress distributions, crystal orientations and magnetic properties during die-upsetting according to working temperature of Nd-Fe-B-Cu alloys. The stress distributions in the specimens during compressing process were calculated by a finite element method program(SPID). The calculated stresses were effective stress (${\sigma}_{eff}$), compression stress(${\sigma}_z$), radial direction stress(${\sigma}_r$) rotational direction stress(${\sigma}_e$) and shear stress(${\tau}_{rz}$). The stress distributions of ${\sigma}_z$, obtained by a computer simulation showed that the stress components causing the magnetic alignment during die-upsetting of the cast magnets were very high at the center-part of a specimen, and decreased toward the periphery-part of a specimen. In view of the above results the magnetic properties should be better at the center-part of a specimen than any other parts. But the measured magnetic properties were better at the mid-part. These results should be due to the fact that the specimens were casted. Normally the magnetic properties are affected by the casting process as well as by the stress levels. ${\sigma}_r$, ${\sigma}_e$ are thought to affect the liquid phase flowing and domain patterns, respectively. The influence of ${\tau}_{rz}$ was trivial, ${\sigma}_{eff}$ distributed similar throughout the specimen. The Nd-rich phase appeared at the peripheral of the specimen where the stress level of ${\sigma}_r$, ${\sigma}_z$, was low or the stress level of ${\sigma}_e$ was high. The Nd-rich phase was squeezed out during die-upsetting. This phase had an effect on the crystal orientation and grain growth. The stress distributions of alloy were irregular at the parts of the specimen where the die contacted with specimen.

• Journal of Ocean Engineering and Technology
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• 제15권3호
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• pp.49-57
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• 2001

One of the most important considerations to braze Cu-Al dissimilar materials is control of brittle metallic compound which makes it difficult to obtain a sound brazed joint. Nowdays, several attempts were made to control the metallic compound. But effective method for controlling metallic compound was not established. In this point of view, commercially pure aluminum and copper were used as base metal and Al-Si-X and Zn-Al-X alloy systems were developed as filler metal. Brazing was carried out to find optimum conditions for Cu-Al dissimilar joint. The results obtained in this study were summarized as follows: 1) The joint brazed by Al-Si-X filler metal showed good brazeability and mechanical properties. The tensile strength of the joint brazed over solidus temperature was more than 90% of Al base metal. Especially, the joint brazed at liquidus temperature was fractured in the Al base metal. 2) Fluorides fluxes(a mixture of potassium fluoro-aluminates) were used to improve surface cleanliness of base metal and wettability of Al-Si-X filler metal. It was melted at the temperature about 1$0^{\circ}C$ lower than that of the filler metal, and made appropriate brazing environment. Therefore, it could be a proper selection as flux.