• Title/Summary/Keyword: Cu-Be alloy

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Microstructure and Transformation Characteristics with Cooling Rate in Cu-Al-Ni Based SMA Ribbons Fabricated by Melt-Spinning (Cu-Al-Ni계 형상기억리본 제조시 냉각속도에 따른 미세조직 및 변태특성)

  • Lee, Y.S.;Jang, W.Y.;Lee, E.G.
    • Journal of the Korean Society for Heat Treatment
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    • v.13 no.4
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    • pp.265-271
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    • 2000
  • The microstructural change and transformation characteristics with cooling rate i.e. wheel speed were investigated in 82.8wt%Cu-12.8wt%Al-4.3wt%Ni SMA ribbons fabricated by melt-spinning. The thickness and width of ribbon were decreased with increasing wheel speed, while the uniformity of it was improved. At same wheel speed, the grain size of the contact surface of ribbon was smaller than that of free surface. The mean grain size was decreased with increasing wheel speed, resulted in obtaining grains with $3{\mu}m$ in mean diameter in the wheel speed of 30 m/s. However, micro-voids and cracks at grain boundary could be observed at higher wheel speed. $M_s$ and $A_s$ temperatures were decreased, and $M_s{\sim}M_f$ and $A_s{\sim}A_f$ temperature ranges were broadened with increasing wheel speed. All the ribbons were retained the ordered $D0_3$ due to rapid cooling, the volume fraction of it was increased with increasing wheel speed.

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Corrosion Products and Desalting Treatments of Copper and Copper Alloy (Bronze) (동(Cu) 및 동합금(Bronze)의 부식생성물과 탈염처리)

  • Kim, Sang-Beoum;Kim, Hyun-Cheol;Park, Hyung-Ho
    • Korean Journal of Materials Research
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    • v.20 no.2
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    • pp.82-89
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    • 2010
  • Benzotriazole (B.T.A) which has been mainly used for the stabilization processing method of excavated copper and bronze artifacts is vaporized within 2~3 years after the usage because it is unstable at the acid conditions and cannot protect the surface of artifacts. In this study, NaOH method which has been used for the steel artifacts was applied as a stabilization process for the method of copper and bronze artifacts to gush chlorine ion out. For the reproduction of excavated samples, copper and bronze plates were dipped in 0.1M HCl for 26 hrs to form CuCl, rusted at $70^{\circ}C$ with RH 75% for the formation of corrosion products, and desalted in 0.1 M NaOH solution. The concentration of chlorine ion was measured by using ionchromatography. During the desalting process, a large quantity of chlorine ions was gushed out in early period and corrosion products were not additionally generated through the re-corrosion experiment. This NaOH desalting process was found to be a method of stabilization process for copper and bronze artifacts from the formation of Tenorite (CuO) during desalting as a protection layer for corrosion.

Investigation of Corrosion Characteristics with Zn, PTFE Hybrid Coating for SS400 in Sea Water (Zn, PTFE 복합 코팅에 의한 SS400 강의 해수 부식 특성 변화 연구)

  • Han, Min Su;Prak, Jae Cheul;Jang, Seok Ki;Kim, Seong Jong
    • Corrosion Science and Technology
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    • v.10 no.6
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    • pp.205-211
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    • 2011
  • The severe corrosion environment makes the steel product lifecycle short while Cu-alloys with anti-corrosion characteristic used in sea water are too expensive. This study shows that the Cu-alloy(Cu-37.25% Zn-0.67%Al) used in sea water environment can be superseded by SS400 with various coating process, evaluating electrochemical characteristics. Three coating processes were applied to SS400 such as PTFE + Zn coaing, Zn + PTFE coating and only Zn electrogalvanizing coaing. Various electrochemical experiments such as open circuit potential measurments, potentiodynamic polarization tests and analyses of Tafel constants. Mechanical properties were also measured by tensile test and hardness tests. As a result, Zn + PTFE coating for SS400 steel presented the excellent anti-corrosion characteristic in sea water.

High Strength Nanostructured Metastable Alloys

  • Eckert, Jurgen;Bartusch, Birgit;Schurack, Frank;He, Guo;Schultz, Ludwig
    • Journal of Powder Materials
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    • v.9 no.6
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    • pp.394-408
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    • 2002
  • Nanostructured high strength metastable Al-, Mg- and Ti-based alloys containing different amorphous, quasicrystalline and nanocrystalline phases are synthesized by non-equilibrium processing techniques. Such alloys can be prepared by quenching from the melt or by powder metallurgy techniques. This paper focuses on one hand on mechanically alloyed and ball milled powders containing different volume fractions of amorphous or nano-(quasi)crystalline phases, consolidated bulk specimens and, on the other hand. on cast specimens containing different constituent phases with different length-scale. As one example. $Mg_{55}Y_{15}Cu_{30}$- based metallic glass matrix composites are produced by mechanical alloying of elemental powder mixtures containing up to 30 vol.% $Y_2O_3$ particles. The comparison with the particle-free metallic glass reveals that the nanosized second phase oxide particles do not significantly affect the glass-forming ability upon mechanical alloying despite some limited particle dissolution. A supercooled liquid region with an extension of about 50 K can be maintained in the presence of the oxides. The distinct viscosity decrease in the supercooled liquid regime allows to consolidate the powders into bulk samples by uniaxial hot pressing. The $Y_2O_3$ additions increase the mechanical strength of the composites compared to the $Mg_{55}Y_{15}Cu_{30}$ metallic glass. The second example deals with Al-Mn-Ce and Al-Cu-Fe composites with quasicrystalline particles as reinforcements, which are prepared by quenching from the melt and by powder metallurgy. $Al_{98-x}Mn_xCe_2$ (x =5,6,7) melt-spun ribbons containing a major quasicrystalline phase coexisting with an Al-matrix on a nanometer scale are pulverized by ball milling. The powders are consolidated by hot extrusion. Grain growth during consolidation causes the formation of a micrometer-scale microstructure. Mechanical alloying of $Al_{63}Cu_{25}Fe_{12}$ leads to single-phase quasicrystalline powders. which are blended with different volume fractions of pure Al-powder and hot extruded forming $Al_{100-x}$$(Al_{0.63}Cu_{0.25}Fe_{0.12})_x$ (x = 40,50,60,80) micrometer-scale composites. Compression test data reveal a high yield strength of ${\sigma}_y{\geq}$700 MPa and a ductility of ${\varepsilon}_{pl}{\geq}$5% for than the Al-Mn-Ce bulk samples. The strength level of the Al-Cu-Fe alloys is ${\sigma}_y{\leq}$550 MPa significantly lower. By the addition of different amounts of aluminum, the mechanical properties can be tuned to a wide range. Finally, a bulk metallic glass-forming Ti-Cu-Ni-Sn alloy with in situ formed composite microstructure prepared by both centrifugal and injection casting presents more than 6% plastic strain under compressive stress at room temperature. The in situ formed composite contains dendritic hcp Ti solid solution precipitates and a few $Ti_3Sn,\;{\beta}$-(Cu, Sn) grains dispersed in a glassy matrix. The composite micro- structure can avoid the development of the highly localized shear bands typical for the room temperature defor-mation of monolithic glasses. Instead, widely developed shear bands with evident protuberance are observed. resulting in significant yielding and homogeneous plastic deformation over the entire sample.

A Study on the Stress Relief Cracking of HSLA-100 and HY-100 steels (HSLA-100강 및 HY-100강의 응력제거처리 균열에 관한 연구)

  • 박태원;심인옥;김영우;강정윤
    • Journal of Welding and Joining
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    • v.14 no.3
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    • pp.48-57
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    • 1996
  • A study was made to examine the characteristics of base metal and stress relief cracking(SRC) of heat affected zone(HAZ) for HY-100 and Cu-bearing HSLA-100 steels. The Gleeble thermal/mechanical simulator was used to simulate the SRC/HAZ. The details of mechanical properties of base plate and SRC tested specimens were studied by impact test, optical microscopy and scanning electron microscopy. The specimens were aged at $650^{\circ}C$ for HSLA-100 steel and at $660^{\circ}C$ for HY-100 steel and thermal cycled from $1350^{\circ}C$ to $25^{\circ}C$ with a cooling time of $\Delta$t_${800^{circ}C/500^{circ}C}$=21sec. corresponds to the heat input of 30kJ/cm. The thermal cycled specimens were stressed to a predetermined level of 248~600MPa and then reheated to the stress relief temperatures of $570~620^{\circ}C$. The time to failure$(t_f)$ at a given stress level was used as a measure of SRC susceptibility. The strength, elongation and impact toughness of base plate were greater in HSLA-100 steel than in HY-100 steel. The time to failure was decreased with increasing temperature and/or stress. HSLA-100 steel was more susceptible to stress relief cracking than HY-100 steel under same conditions. It is thought to be resulted from the precipitation of $\varepsilon$-Cu phase by dynamic self diffusion of solute atoms. By the precipitation of $\varepsilon$-Cu phase, the differential strengthening of grain interior relative to grain boundary may be greater in the Cu-bearing HSLA-100 steel than in HY-100 steel. Therefore, greater strain concentration at grain boundary of HSLA-100 steel results in the increased SRC susceptibility. The activation energies for SRC of HSLA-100 steel are 103.9kcal/mal for 387MPa and 87.6kcal/mol for 437MPa and that of HY-100 steel is 129.2kcal/mol for 437MPa.

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Fabrication, Microstructure and Adhesion Properties of BCuP-5 Filler Metal/Ag Plate Clad Material by Using High Velocity Oxygen Fuel Thermal Spray Process (고속 화염 용사 공정을 이용한 스위칭 소자용 BCuP-5 filler 금속/Ag 기판 클래드 소재의 제조, 미세조직 및 접합 특성)

  • Joo, Yeun A;Cho, Yong-Hoon;Park, Jae-Sung;Lee, Kee-Ahn
    • Journal of Powder Materials
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    • v.29 no.3
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    • pp.226-232
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    • 2022
  • In this study, a new manufacturing process for a multilayer-clad electrical contact material is suggested. A thin and dense BCuP-5 (Cu-15Ag-5P filler metal) coating layer is fabricated on a Ag plate using a high-velocity oxygen-fuel (HVOF) process. Subsequently, the microstructure and bonding properties of the HVOF BCuP-5 coating layer are evaluated. The thickness of the HVOF BCuP-5 coating layer is determined as 34.8 ㎛, and the surface fluctuation is measured as approximately 3.2 ㎛. The microstructure of the coating layer is composed of Cu, Ag, and Cu-Ag-Cu3P ternary eutectic phases, similar to the initial BCuP-5 powder feedstock. The average hardness of the coating layer is 154.6 HV, which is confirmed to be higher than that of the conventional BCuP-5 alloy. The pull-off strength of the Ag/BCup-5 layer is determined as 21.6 MPa. Thus, the possibility of manufacturing a multilayer-clad electrical contact material using the HVOF process is also discussed.

Annealing Cycle Dependence of MR Properties for Free Layer in $Ni_{25}Mn_{75}-Spin$ Valve Films ($Ni_{25}Mn_{75}-Spin$ Valve 박막 자유층의 열처리 순환수에 따른 자기저항 특성)

  • 이낭이;이주현;이가영;김미양;이장로;이상석;황도근
    • Journal of the Korean Magnetics Society
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    • v.10 no.2
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    • pp.62-66
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    • 2000
  • Annealing cycle number and nonmagnetic layer thickness dependences of interlayer coupling field ( $H_{inf}$ ) and coercivity ( $H_{cf}$ ) of free magnetic layer on NiMn alloy-spin valve films (SVF) were investigated. The SVF is Glass (7059)/N $i_{81}$F $e_{l9}$(70 $\AA$)/Co(10 $\AA$)/Cu(t $\AA$)/Co(15 $\AA$)N $i_{81}$$Fe_{19}$(35 $\AA$)/N $i_{25}$M $n_{75}$(250 $\AA$)Ta(50 $\AA$) films, it were fabricated using the dc sputtering method at different pinning layer thickness and nonmagnetic spacer thickness (Cu thickness; 30 $\AA$, 35 $\AA$, 40 $\AA$) of NiMn alloy with 25 at.%. Ni In case that Cu thickness of SVF is 35 $\AA$ and peak exchange coupling field ( $H_{ex}$) was 620 Oe, while coercivity $H_{c}$ = 280 Oe and MR ratio showed 2.5%. As for $H_{inf}$ and $H_{cf}$ , every SVF increased up to the stabilized values with the increase of annealing cycle number 15, which were $H_{inf}$ of 120 Oe and $H_{cf}$ of 75 Oe. The increase of $H_{cf}$ with the annealing cycle number seems to be caused by the effective reduction of Cu layer thickness due to the increase of interfacial mixing of Cu layer and Co layer. In addition, the $H_{inf}$ and $H_{cf}$ dependences of free NiFe layer by the interfacial mixing effect were appeared the different aspects when Cu layer becomes more thinner and thicker than Cu layer thickness of 35 $\AA$, respectively.ively....

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Influence of Coating Agent and Particle Size on the Soft Magnetic Properties of Fe Based Nano Crystalline Alloy Powder Core (철기(Fe Based) 나노결정질 합금 분말코어의 코팅제 및 입도가 연자기적 특성에 미치는 영향)

  • Jang, S.J.;Choi, Y.J.;Kim, S.W.;Jeon, B.S.;Lee, T.H.;Song, C.B.;Namkung, J.
    • Journal of the Korean Magnetics Society
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    • v.25 no.3
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    • pp.67-73
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    • 2015
  • This is a basic research for improving soft magnetic property of Fe based nano crystalline alloy powder core. The main study is done around characteristics of permeability, core loss, and DC bias depending on amount of insulation coating agent and particle size. First, $Fe_{73.5}Si_{13.5}B_9Nb_3Cu_1$ amorphous alloy ribbon was fabricated by using the planar flow casting (PFC) device. Then, heat treatment and ball milling were done to obtain alloy powder. The amount of polyether imide (PEI) added to it was varied by 0.5, 1.0, 2.0, 2.5 wt% to have compression molding into $16ton/cm^2$. After going through crystalline heat treatment, the made toroidal nano crystalline powder core ($OD12.7mm^*ID7.62mm^*H4.75mm$) had smaller permeability as amount of insulation coating agent decreases. However, it was found out that core loss and DC bias characteristics have been improved. The reason for this results were expected to be because green density of power core decreases as amorphous alloy powder particles become smaller as amount of alloy powder insulation coating agent increases, it was determined that 1 wt% of insulation coating agent is appropriate. Also, for powder core made based on alloy powder size with amount of insulation coating agent fixed at 1 wt%, effective permeability and core loss were outstanding as particle size became bigger. However, characteristics of DC bias became worse as applied DC field increases. This is expected to be due to insulation effect, residual pores, or molding density of powder core resulting from thickness of coating on surface of alloy powder.

Junction of Porous SiC Semiconductor and Ag Alloy (다공질 SiC 반도체와 Ag계 합금의 접합)

  • Pai, Chul-Hoon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.3
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    • pp.576-583
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    • 2018
  • Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

A Study on the properties of aluminum nitride films on the Al7075 deposited by pulsed DC reactive magnetron sputtering

  • Kim, Jung-hyo;Cha, Byung-Chul;Lee, Keun-Hak;Park, Won-Wook
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.11a
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    • pp.179-180
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    • 2012
  • Aluminum alloys are widely known as non-ferrous metal with light weight and high strength. Consequently, these materials take center stage in the aircraft and automobile industry. The Al7075 aluminum alloy is based on the Al-Zn-Mg-Cu and one of the strongest wrought aluminum alloys. Aluminum nitride has ten times higher thermal conductivity($319W/m{\cdot}K$) than Al2O3 and also has outstanding electric insulation($1{\times}1014{\Omega}{\cdot}cm$). Furthermore, it has high mechanical property (430 MPa) even though its co-efficient of thermal expansion is less than alumina For these reasons, it has great possibilities to be used for not only the field which needs high strength lightweight but also electronic material field because of its suitability to be applied to the insulator film of PCB or wafer of ceramic with high heat conduction. This paper investigates the mechanical properties and corrosion behavior of aluminum alloy Al7075 deposited with aluminum nitride thin films To improve the surface properties of Al7075 with respect to hardness, and resistance to corrosion, aluminum nitride thin films have been deposited by pulsed DC reactive magnetron sputtering. The pulsed DC power provides arc-free deposition of insulating films.

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