• Journal of Powder Materials
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• v.6 no.4
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• pp.270-276
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• 1999

Ti-Ni-Cu alloy powders were fabricated by ball milling, and the properties of these powders were characterized. Mixed 50Ti-(50-x)Ni-xCu powders of 5 to 10at.%Cu composition were milled for 100 hours using SUS 1/4" balls in argon atmosphere. Ball to powder ratio was 20:1 and rotating speed was 100 rpm. Tensile strength, microstructure and phase transformation of ball milled Ti-(50-x)Ni-xCu powders were studied. After 100 hours milling, Ti, Ni and Cu elements were alloyed completely and an amorphous phase was formed. Amorphous phase was crystallized to martensite(B 19') and austenite(B2) after heat treatment for 1 hour at $850^{\circ}C$. As the Cu contents were increased, tensile strength of extruded 6061Al/TiNiCu was decreased, and B19'martensite phases In the TiNi particles were the causes of high tensile stress of extruded 6061Al/TiNiCu.NiCu.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.193-200
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• 2007

Micro forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Al5083 superplastic alloy with very small grains has a great advantage in achieving micro deformation under low stress due to its relatively low strength at a specific high temperature range. Micro forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, the micro formability of Al5083 superplastic alloy and bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$, was investigated with the specially designed micro vibration forming system using pyramid-shape, V-shape and U-shape micro die pattern. With these dies, micro vibration forming was conducted by varying the applied load, time. Micro formability was estimated by comparing the hight of formed shape using non-contact surface profiler system. The vibration load effect to metal flow in the micro die and improve the micro formability of Al5083 superplastic alloy and $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG).

• Journal of the Korean institute of surface engineering
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• v.29 no.4
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• pp.278-285
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• 1996

The structure of coating layer formed by hot dip Al-Cu alloy coating on Monel 1400 metal was studied. The coating layer consists of alloyed layer adjacent to the Monel 400 substrate and Al-Cu alloy. It was found that the hardness of coating increased with dipping time and heat treatment associated with the diffusion and the formation of intermetallic compound at the interface. However the thickness of coating layer was decreased at high dipping temperature due to tile higher viscosity of liquid coating alloy. Diffusion heat treatment at $600^{\circ}C$ after coating resulted in the disappearence of adhered Al(Cu) and $CuAl_2$ phases, and then they transformed into the new phases of CuAl and Al7Cu4Ni at coating layer.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1993.11a
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• pp.52-53
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• 1993

• Journal of Powder Materials
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• v.1 no.2
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• pp.145-152
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• 1994

Atomizing mode and powder characteristics of CuA1Ni base shape memory alloy in rotating disk atomization were investigated in accordance with disk materials and additional elements. Produced powders were classified into two types of spherical and flake shape. In the case of CuAlNiBTi and CuAlNiZr alloy, high yield rate and fine powder were obtained. This tendency was same when we used oxide coated disks. We concluded that this results were steno from the wetting characteristics change between molten metal and disk surface. Especially, due to the reactive properties of Ti and Zr with ceramic disk, the change of atomizing appearance and powder characteristics were noticeable.

• Journal of the Korean institute of surface engineering
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• v.24 no.2
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• pp.103-113
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• 1991

Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30$0^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50$0^{\circ}C$, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.

• Journal of Electrochemical Science and Technology
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• v.10 no.1
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• pp.82-88
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• 2019

Here, we report on nanocrystalline Si-Al-M (M = Fe, Cu, Ni, Zr) alloys for use as an anode for lithium-ion batteries, which were fabricated via a melt-spinning method. Based on the XRD and TEM analyses, it was found that the Si-Al-M alloys consist of nanocrystalline Si grains surrounded by an amorphous matrix phase. Among the Si-Al-M alloys with different metal composition, Ni-incorporated Si-Al-M alloy electrode retained the high discharge capacity of 2492 mAh/g and exhibited improved cyclability. The superior $Li^+$ storage performance of Si-Al-M alloy with Ni component is mainly responsible for the incorporated Ni, which induces the formation of ductile and conductive inactive matrix with crystalline Al phase, in addition to the grain size reduction of active Si phase.

• Journal of the Korean Society for Heat Treatment
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• v.16 no.2
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• pp.90-96
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• 2003

The effect of betatizing temperature on microstructure and transformation characteristics in a Cu-AI-Ni based pseudoelastic alloy fabricated by heated mold continuous casting by using metallography, XRD and calorimetry. The microstructure of cast rod betatized at $600^{\circ}C$ revealed a ${\beta}_1$ parent phase and a ${\gamma}_2$ phase precipitated along the casting direction. When the cast rod was betatized at the elevated temperature above $600^{\circ}C$, the ${\gamma}_2$ phase is completely dissolved into the matrix so that the volume fraction of the ${\gamma}_2$ phase was decreased. The parent phase was stabilized by betatizing at $600^{\circ}C$. However, the ${\beta}_1$ parent phase was transformed to both ${{\beta}_1}^{\prime}$ and ${{\gamma}_1}^{\prime}$ martensites with increasing betatizing temperatures above $600^{\circ}C$, while $M_s$ and $A_s$ temperatures were decreased. The stress-strain curves for compression test were not same with betatizing temperature; the stress-strain curves of the specimen betatized at $600^{\circ}C$ and $700^{\circ}C$ were linear but those of the specimen betatized at $800^{\circ}C$ and $900^{\circ}C$ were not linear.

• 연구논문집
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• s.22
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• pp.127-139
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• 1992

The mechnial properties such as fracture strength, ductility and fatigue strength of Cu shape memory alloy are lower than those of Ti-Ni SMA, because of their high elastic anisotropy and large grain size. And in order to improve the mechanical property of Cu SMA, some techniques such as casting method by addition of refining element, powder metallurgy and rapid solidification process have been studied on the refinement of the grain size of Cu SMA. This study was carried out to refine the grain size of CuAlNi SMA by applying the melt spinning method. According to this study, the conclusions are as follows; - grain size of the melt-spun ribbon was about $1\mum$ - there was not change in grain size, although increasing of hot pressing temperature -grain size of the hot-extruded specimen was about $30-40\mum$, it is more refiner than that of castings