• 청정기술
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• 제27권1호
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• pp.69-78
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• 2021

팜유(palm oil)와 캐슈넛 껍질액(cashew nut shell liquid, CNSL)과 같은 식물유는 한국에서 수송용 바이오-디젤 혹은 발전용 바이오-중유의 주요 원료로서 사용되고 있다. 그러나, 이들은 탄화수소의 이중결합에 의한 높은 불포화도와 더불어 카르복실산에 기인한 높은 산소의 함량으로 인하여 연료유로서의 적용 범위에 한계가 있다. 이러한 관점에서, 본 연구는 팜유와 CNSL이 1/1 v/v%으로 이루어진 혼합 바이오오일에 포함된 불포화탄화수소를 포화시키고 산소 성분을 제거하기 위한 수소화처리 반응을 단일금속촉매(Ni과 Cu)와 이원금속촉매(Ni-Zn, Ni-Fe, Ni-Cu Ni-Co, Ni-Pd와 Ni-Pt) 들을 적용하여 완화된 반응조건(온도 250 ~ 400 ℃, 압력 5 ~ 80 bar와 LHSV 1 h-1) 하에서 수행하였다. Ni 활성성분에 대한 귀금속과 전이금속의 첨가는 수소화반응(HYD)과 탈산소반응(HDO)의 두 반응에 대한 활성을 증가시키는 시너지 효과를 보였다. 가장 활성이 뛰어난 유망한 촉매는 Ni-Cu/��-Al2O3으로서 Ni/Cu의 원소비가 9/1 ~ 1/4의 넓은 범위에서 HYD반응과 HDO반응에 대한 전환율이 각각 90 ~ 93%와 95 ~ 99%을 보였다. 이와 같이 Ni/Cu의 원소 비율이 넓은 범위에서 일정한 촉매반응활성을 보임에 따라 전형적인 구조비민감성 반응임을 알 수 있다. 그리고, 수소화처리 반응에 의해 정제된 혼합 바이오오일은 원료 혼합 바이오오일에 비해 요오드가, 산가 및 동점도가 크게 낮아졌으며, 고위발열량은 약 10% 증가되었다.

• 한국재료학회지
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• 제9권10호
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• pp.962-969
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• 1999

Ag-Cu-Ti 삽입금속을 이용하여 제조된 AlN/Cu와 AlN/W 활성금속브레이징 접합체의 잔류응력을 유한요소법으로 탄성 및 탄소성 해석을 행하여 그 결과를 접합강도 측정 결과와 파단 거동 관찰 결과와 비교, 분석하였다. 최대 잔류 주응력의 크기는 AlN/W 접합체보다 모재간 열팽창계수 차이가 큰 AlN/Cu 접합체에서 더 크게 나타났으며, 접합계면에 인접한 AlN 세라믹스 자유표면에 인장 성분의 응력집중이 확인되었다. 모재와 삽입금속의 탄소성 변형을 모두 고려할 경우, AlN/Cu 접합체의 경우 연질의 삽입금속에 의해 최대 잔류 주응력이 감소하여 소성변형에 의한 응력완화 효과가 있음을 확인하였으나, 100$\mu\textrm{m}$ 이상으로 삽입금속 두께를 증가시키더라도 잔류 주응력의 크기는 더 이상 크게 감소하지 않았다. 측정된 최대 접합강도는 AlN/Cu와 AlN/W 접합체에서 각각 52 MPa와 108 MPa이었으며, 파단 형태는 AlN/Cu 접합체는 AlN 자유표면으로부터 AlN 내부로 큰 각도를 이루면 진행되는 돔형의 파단이, AlN/W 접합체에서는 접합계면의 삽입금속층을 따라 AlN 측에서 파단이 일어나는 형태를 보였다.

• 청정기술
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• 제13권4호
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• pp.287-292
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• 2007

상용 알루미나($Al_2O_3$)에 담지된 $M/Al_2O_3$ (M = Mn, Fe, Co, Ni, Cu) 촉매를 함침법에 의해 제조하였으며, 이를 에탄을 자열개질반응에 의한 수소제조에 적용하였다. 각각의 촉매는 고유한 금속상을 가지는 것으로 나타났으며, 생성물의 분포는 활성금속의 종류에 크게 의존하였다. 제조된 촉매 중에서, $M/Al_2O_3$ 및 Co/$Co/Al_2O_3$는 에탄을 자열개질반응에서 매우 우수한 촉매활성을 보였다. 그러나 두 촉매상에서의 반응메커니즘은 서로 다른 것으로 나타났다. $Ni/Al_2O_3$ 촉매는 $500^{\circ}C$의 반응온도에서 100%의 에탄올 전환율을 보였으나, 수소 선택도에서는 시간에 따라 급격한 저하현상을 나타내었다. 한편 $Co/Al_2O_3$ 촉매는 수소 선택도 면에서 우수한 활성을 보였으나, 에탄올 전환율이 저조하여 수소 수율에는 큰 변화가 나타나지 않았다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• 열처리공학회지
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• 제13권3호
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• pp.177-182
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• 2000

The effects of betatizing and aging temperatures on the martensitic transformation characteristics in an Cu-13.4wt%Al-4.2wt%Ni single crystal have been studied. Microstructures show that the specimen betatized above $800^{\circ}C$ has only ${{\beta}_1}^{\prime}$ martensite while the specimen betatized of below $700^{\circ}C$ has two phases i.e., ${{\beta}_1}^{\prime}+{\gamma}_2$ When betatizing temperature increase from $600^{\circ}C$ upto $900^{\circ}C$, Ms and As temperatures decrease due to the dissolution of which ${\gamma}_2$ phase depletes Al content in the matrix thereafter makes the both Ms and As temperatures significantly increased. Ms and As temperatures of the specimen aged at $200^{\circ}C$ are relatively stable but those of the specimen aged at $300^{\circ}C$ are shifted rapidly with aging time, especially within the first 30min.

• 한국분말재료학회지
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• 제1권2호
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• pp.145-152
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• 1994

Atomizing mode and powder characteristics of CuA1Ni base shape memory alloy in rotating disk atomization were investigated in accordance with disk materials and additional elements. Produced powders were classified into two types of spherical and flake shape. In the case of CuAlNiBTi and CuAlNiZr alloy, high yield rate and fine powder were obtained. This tendency was same when we used oxide coated disks. We concluded that this results were steno from the wetting characteristics change between molten metal and disk surface. Especially, due to the reactive properties of Ti and Zr with ceramic disk, the change of atomizing appearance and powder characteristics were noticeable.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.193-200
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• 2007

Micro forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Al5083 superplastic alloy with very small grains has a great advantage in achieving micro deformation under low stress due to its relatively low strength at a specific high temperature range. Micro forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, the micro formability of Al5083 superplastic alloy and bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$, was investigated with the specially designed micro vibration forming system using pyramid-shape, V-shape and U-shape micro die pattern. With these dies, micro vibration forming was conducted by varying the applied load, time. Micro formability was estimated by comparing the hight of formed shape using non-contact surface profiler system. The vibration load effect to metal flow in the micro die and improve the micro formability of Al5083 superplastic alloy and $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.725-728
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• 2001

We have fabricated thin films using the DC/RF magnetron sputtering of 74wt%Ni-l8wt%Cr-4wt%Al-4wt%Cu alloy target and studied the effect of the process parameters on the electrical properties for low TCR(Temperature Coefficient of Resistance) films. In sputtering process, pressure, power and substrate temperature, are varied as controllable parameter. The films are annealed to 400$^{\circ}C$ in air and nitrogen atmosphere. The sheet resistance, TCR of the films increases with increasing annealing temperature. It abruptly increased as annealing temperature increased over 300$^{\circ}C$ in air atmosphere. From XRD, it is found that these results are due to the existence of NiO on film surface formed by annealing. As a results of them, TCR can be controlled by variation of sputter process parameter and annealing of thin film.

• Bulletin of the Korean Chemical Society
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• 제13권2호
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• pp.113-116
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• 1992

The electrical conductivity of the complexes of $Co^{2+}$, $Ni^{2+}$ and $Cu^{2+}$ with o-aminobenzoic acid hydrazide was measured between 300 and 500 K. It was observed that the conductivity is dependent upon both the cations and anions of the reacted salts. The prepared complexes exhibit typical semiconducting behaviour.

• 한국표면공학회지
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• 제29권4호
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• pp.278-285
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• 1996

The structure of coating layer formed by hot dip Al-Cu alloy coating on Monel 1400 metal was studied. The coating layer consists of alloyed layer adjacent to the Monel 400 substrate and Al-Cu alloy. It was found that the hardness of coating increased with dipping time and heat treatment associated with the diffusion and the formation of intermetallic compound at the interface. However the thickness of coating layer was decreased at high dipping temperature due to tile higher viscosity of liquid coating alloy. Diffusion heat treatment at $600^{\circ}C$ after coating resulted in the disappearence of adhered Al(Cu) and $CuAl_2$ phases, and then they transformed into the new phases of CuAl and Al7Cu4Ni at coating layer.