• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.125-131
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• 2002

This paper was studied on the effect of temperature on corrosion of absorption refrigeration systems using $LiBr-H_2O$ working fluids. In the fresh water and 62 % lithium bromide solution at $70^{\circ}C$, polarization test of SS 400, Cu(C1220T-OL) and Al-Ni bronze was carried out. And polarization behavior, polarization resistance characteristics, corrosion rate(mmpy) and corrosion sensitivity of materials forming absorption refrigeration systems was considered. The main results are as following: (1) As the experimental temperature increase, the change of corrosion rate of Al-Ni bronze become duller than SS 400 and Cu in 62% lithium bromide solution. (2) According as corrosion environment is changed from fresh water to 62% lithium bromide solution, potential change of Cu and Al-Ni bronze become less noble than SS 400. (3) The corrosion sensitivity of Al-Ni bronze was duller than that of Cu and SS 400 in 62% LiBr solution.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1993.11a
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• pp.52-53
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• 1993

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1994.04c
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• pp.16-17
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• 1994

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.328-335
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• 2001

In this work, we made the precision thin film resistors of NiCr alloy (74wt%Ni-f18wt%Cr-4wt%Al-4wt%Cu) using DC/RF magnetron sputtering method and studied the sheet resistance and TCR(Temperature Coefficient of Resistance) etc... of the Ni-Cr-Al-Cu alloy thin film according to the change by annealing treatment to 400$\^{C}$ in air and nitrogen atmosphere and the change(power, pressure, substrate temperature) of sputtering process.

• Journal of Energy Engineering
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• v.8 no.2
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• pp.256-264
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• 1999

The performance of the Pt-B/cordierite catalysts (2 wt%) Pt, 70 wt% Alumina, 28 wt%) Ceria and Zirconia, B: base metal) loaded with 6∼12 wt% Mn, Cu, V, Co, Cr and Ba, respectively was studied for partial oxidation of methane reaction and compared with that of Ni loaded catalyst. As a results, it was found that Ba, Co, Cr as well as Ni loaded catalysts showed higher activity for methane partial oxidation of methane than the Mn, Cu and V loaded catalyst. But it was known that catalysts having good activity for methane showed the good activity for coke formation, too. A XRD analysis of the catalyst before and after the reaction using 5 wt% Ni/Al$_2$O$_3$) showed that there were three Ni phases. In these results, it was found that methane oxidation reaction occulted at the front of the catalyst bed consisted of NiAl$_2$O$_4$and NiO and reforming reaction occurred at the rear part of the catalyst bed consisted of reduced Ni.

• Journal of Powder Materials
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• v.11 no.3
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• pp.193-201
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• 2004

1960년 Au-Si계 합금에서 처음으로 비정질상이 급속 응고법에 의해 보고된 이래/sup 1)/ 지난 40년 간 많은 합금계에서 비정질상이 보고되어졌다. 대표적으로 Fe-, Ni-, Co기 합금 등 많은 합금계에서 비정질상이 보고되었으나, 비정질상의 형성을 위해서는 약 105 K/s이상의 높은 냉각속도를 필요로 하였다. 1980년대 수백 K/s의 낮은 냉각속도 하에서도 비정질상이 형성될 수 있는 다원계 합금(multi-component alloy)이 Mg-Ln-(Ni, Cu, Zn), Ln-Al-TM 합금에서 보고되어 졌으나 많은 관심을 받지 못하다가 1993년 Zr-Ti-Ni-Cu-Be 합금에서 수 ㎝ 크기의 비정질합금 제조가 보고되면서 전 세계적으로 많은 관심을 받게 되었다. Zr-Ti-Ni-Cu-Be계 벌크 비정질 합금이 보고된 후 Zr-(Nb,Pd)-Al-TM, Pd-Cu-Ni-P, Fe-Co-Zr-Mo-W-B, Ti-Zr-Ni-Cu-Sn등 여러 합금계에서 벌크 비정질 합금이 보고되었다. (중략)

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.60-64
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• 2023

In this study, the electrical contact resistance characteristics between graphene and metals, which is one of important factors for the performance of graphene-based devices, were compared. High-quality graphene was synthesized by chemical vapor deposition (CVD) method, and Al, Cu, Ni, and Ti as electrode materials were deposited on the graphene surface with equal thickness of 50 nm. The contact resistances of graphene transferred to SiO₂/Si substrates and metals were measured by the transfer length method (TLM), and the average contact resistances of Al, Cu, Ni, and Ti were found to be 345 Ω, 553 Ω, 110 Ω, and 174 Ω, respectively. It was found that Ni and Ti, which form chemical bonds with graphene, have relatively lower contact resistances compared to Al and Cu, which have physical adsorption properties. The results of this study on the electrical properties between graphene and metals are expected to contribute to the realization of high-performance graphene-based devices including electronics, optoelectronic devices, and sensors by forming low contact resistance with electrodes.

• Korean Journal of Materials Research
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• v.10 no.8
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• pp.569-574
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• 2000

To improve the ductility of $Al_3Hf$ and $Al_3Ta$ intermetallic compounds, which are the potential temperature structural materials, the mechanical alloying behaviour and the effect of ternary additions on the $Ll_2$ phase formation were investigated. During the mechanical alloying by the SPEX mill, the $Ll_2$ $Al_3Hf$ intermetallic compound was formed after 6 hours of milling in AL-25%Hf system. In AL-25%Ta system, however, only the $D0_{22}$ $Al_3Ta$ intermetallic compound was formed until 30 hours of milling and the $Ll_2$ phase was not observed. In AL-12.5%M-25%Ta(M=Cu, Zn, Mn, Fe, Ni) systems, the additions of Cu and Zn had no effect on the $D0_{22}$ structure of the binary $Al_3Hf$ and the additions of Mn, Fe and Ni produced the amorphous phase. Therefore it was considered that these ternary additions could not overcome the energy difference between $Ll_2$ and $D0_{22}$ structures in the $Al_3Hf$ intermetallic compound. In AL-12.5%M-25%Hf(M=Cu, Zn, Mn, Fe, Ni)systems, the additions of Cu and Zn did not affect the $Ll_2$ structure of the binary $Al_3Hf$ but the additions of oMn, Fe and Ni produced the amorphous phase as they did in AL-12.5%M-25%Ta systems. Therefore, it was considered that the Ni, Mn and Fe additions promote the formation of amorphous phase in $Al_3X$ intermetallic compounds.

• Journal of the Korean Magnetics Society
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• v.18 no.1
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• pp.43-47
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• 2008

[ $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ ] nano-glass has been prepared by sol-gel method. The mean particle size was 60.3 nm with narrow size distribution. The nano-galss has been used as a sintering aid for the densification of the NiZnCu ferrites. The ferrite was sintered with nano-glass sintering aids at $840{\sim}900^{\circ}C$, 2 h and the initial permeability, quality factor, density, and saturation magnetization were also measured. The initial permeability of 0.5 wt% nano-glass added toroidal sample for NiZnCu ferrites sintered at $900^{\circ}C$ was 193.3 at 1 MHz. The initial permeability and saturation magnetization were increased with increasing annealing temperature. As a result, $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ nano-glass systems were found to be useful as sintering aids for multilayer chip inductors.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.99-102
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• 2003

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.