• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.216-216
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• 2009

$(Ni_{1-x-y}Zn_xCu_y)Fe_2O_4(x=0.45,\;0{\leq}y{\leq}0.3)$ was synthesized by conventional ceramic processing, and the sintering behavior and the magnetic properties of which were studied as functions of CuO content and sintering temperature. Both the densification and the grain growth rates were significantly enhanced with the increase of CuO content, while abnormal grain growth occurred when the samples of $y{\geq}0.2$ were sintered above $950^{\circ}C$. Saturation magnetization and coercive field were mainly influenced by the densification and grain growth of the specimens, respectively.

• Journal of the Korean Ceramic Society
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• v.26 no.6
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• pp.747-754
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• 1989

The effects of CuO and SiO2 on the sintered density, grain growth and magnetic properties of Sr-ferrite were investigated. The sintered density of Sr-ferrite is increased with increasing the amount of CuO or SiO2 addition. The grain of Sr-ferrite grow uniformly with the addition of CuO, so remanence increases and coercivity decreases. The addition of SiO2 increase coercivity but does not affect remanence prominently. The sintering temperature above 125$0^{\circ}C$ and SiO2 addition above 0.8wt% causes abnormal grain growth in Sr-ferrite. When CuO and SiO2 are added simultaneouly, remanence does not decrease but coercivity shows low value.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.165-168
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• 2002

본 연구에서는 칩인덕터 코어 소재로 사용되는 (NiCuZn)-ferrite를 습식합성법을 이용하여 나노크기의 초미세 분말을 합성하였으며, 합성된 (ZiCuZn)-ferrite 의 제조공정 및 전파기적 특성에 관하여 고찰하였다. 조성은 (N $i_{0.4-x}$C $u_{x}$Z $n_{0.6}$)$_{1+w}$ (F $e_2$ $O_4$)$_{1-w}$에서 x의 값을 0.05~0.25 범위로 변화시켰으며, w 값은 0.03으로 고정하였다. 소결은 8$50^{\circ}C$에서 9$50^{\circ}C$의 범위에서 진행하였다. 나노크기의(NiCuZn)-ferrite를 사용함으로서 시약급 원료로 제조된 것보다 소결온도를 낮출 수 있었고, 밀도가 높은 페라이트 소결체를 얻을 수 있었다. 또한 초투자율, 품질계수 등 전자기적 특성이 우수하게 나타났다. 그 밖에 습식합성법으로 합성한 (NiCuZn)-ferrite 의 결정성, 미세구조 등을 XRD, SEM 을 이용하여 고찰하였다.하였다.다.

• Journal of the Korean institute of surface engineering
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• v.45 no.5
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• pp.188-192
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• 2012

The hetero junction on dielectrics and ferrite for LTCC was prepared by using NiCuZn ferrite. The shrinkage behaviour of ferrite tapes in combination with a dielectric tape was investigated. The characteristics of NiCuZn ferrite were investigated using XRD (X-ray diffractometer), Dilatometer, FE-SEM (Field emission scanning electron microscope), EDS (Energy dispersive spectrometer). NiCuZn ferrite calcined at $700^{\circ}C$ had a good apparent density and initial permeability of magnetic properties. The shrinkage rate of the NCZF700 ferrite and dielectric material was similar. The multilayer revealed dense, uniform morphologies with excellent interface quality. Diffusion of hetero junction such as dielectric and ferrite was not occuring at $900^{\circ}C$.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.

• Journal of the Korean Ceramic Society
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• v.34 no.10
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• pp.1074-1082
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• 1997

Microstructure and permeability as a function of sintering temperature and composition were studied on the Ni$\delta$Cu0.4-$\delta$Zn0.6Fe2O4 ($\delta$=0, 0.1, 0.2, 0.3, 0.4) which was prepared by Cu2+ substitution for Ni2+ in Ni.0.4Zn0.6Fe2O4, then followed by 8 wt% CuO and 1wt% Bi2O3 as sintering aids. It was found that NiCuZn ferrite in which Cu2+ is substituted for Ni2+ is more effective in reduction of sintering temperature than Ni.0.4Zn0.6Fe2O4, containing CuO as a sintering aid. The specimen $\delta$=0.2 sintered at 90$0^{\circ}C$ for 2hr exhibited the highest initial permeability value ($\mu$o=280 at 1Mhz), but the real permeability decreased at the frequency under 10 MHz. EPMA analysis showed that Ni$\delta$Cu0.4-$\delta$Zn0.6Fe2O4 ($\delta$=0.4), sintered at 95$0^{\circ}C$ for 2hrs consisted of three phase regions of Ni.0.3Cu0.1Zn0.6Fe2O4 region, Cu and Bi liquid existed at the 3-point boundary, although the stabilization energy of Ni2+ is higher than that of Cu2+ in B site.

• Resources Recycling
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• v.7 no.4
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• pp.35-42
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• 1998

Surface mount technology is the biggest theme in the area of deιIronic component. To miniatunze an electronic component, s such as ferrite chip inductor, the cer뼈lic wet process for green-sheet lamination and/or screen printing method through a s solvent medium system is widely used. The preparation and characterization of NiCuZn Ferrite (NCZF) shurry and the green s sheet using the water mixed binder system has been studied. The 21 vol% of NCZF slurry was prepared by a ball milling. The p polyacrylic vinyl copolymer (Mw; 60,000) was used as a binder. Th$\xi$ mixture of distilled water, isopropyl alcohol (IPA) and 2l butoxy ethanol was used as a dispersion medium. The water content of medium varied from about 40% to 80%. As the results. Thc disp$\xi$rston stability of the NCZF slurry was attributed to the free polymer rather than the electrostatic force of the particle. T The viscosity of the NCZF slurry was greatly depended on the ratio of water content in the medium.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.9
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• pp.1507-1519
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• 1997

This paper aims to clarify the effects of grinding conditions on bending strength in surface grinding of various ferrites with the resin bond diamond wheel. The main conclusions obtained were as follows. At a constant material removal rate, the strength improves with increased wheel depth of cut and decreased workpiece speed. It is desirable to grind at higher peripheral wheel speed and under the critical workpiece speed presented in this paper. Grinding the ferrite of higher brittleness, the wheel depth of cut limited to hold 50% of their inherent strength becomes lower. The effect of various grinding conditions on bending strength becomes more larger in the order of Sr, Mn-Zn and Cu-Ni-Zn. When using the diamond grain of the lower toughness, the bending strength becomes higher, and the wheel wear occurs faster. Considering both bending strength and wheel wear rate, the best concentration of wheel is 100. The ground surfaces exhibit that the fracture process during grinding becomes more brittle in the order of Sr, Mn-Zn and Cu-Ni-Zn.

• Journal of the Korean Magnetics Society
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• v.24 no.2
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• pp.46-50
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• 2014

The crystallographic properties and cationic distribution of $M_{0.2}Fe_{2.8}O_4$ (M =Mn, Ni, Cu) and $Fe_3O_4$ thin films prepared by sol-gel method have been investigated by X-ray diffraction (XRD) and conversion electron M$\ddot{o}$ssbauer spectroscopy (CEMS). The ionic valence, preferred site, and hyperfine field of Fe ions of the ferrites could be obtained by analyzing the CEMS spectra. The $M_{0.2}Fe_{2.8}O_4$ films were found to maintain cubic spinel structure as in $Fe_3O_4$ with the lattice constant slightly decreased for Ni substitution and increased for Mn and Cu substitution from that of $Fe_3O_4$. Analyses on the CEMS data indicate that $Mn^{2+}$ and $Ni^{2+}$ ions substitute octahedral $Fe^{2+}$ sites mostly, while $Cu^{2+}$ ions substitute both the octahedral and tetrahedral sites. The observed intensity ratio $A_B/A_A$ of the CEMS subspectra of the samples exhibited difference from the theoretical value. It is interpreted as due to the effect of the M substitution for A and B on the Debye temperature of the site. The relative line-broadening of the B-site CEMS subspectra can be explained by the dispersion of magnetic hyperfine fields due to random distribution of M cations in the B sites.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.109-113
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• 2002

본 연구에서는 공침법에 의한 초미세분말을 이용하여 제조된 (NiCuZn)-ferrite와 건식법을 이용하여 제조된 (NiCuZn)-ferrite의 저온소결 특성 및 전자기적 특성을 상호 비교 분석하였다. 조성은 (N $i_{0.4-x}$C $u_{x}$Z $n_{0.6}$)$_{1+w}$(F $e_2$ $O_4$/)$_{1-w}$에서 x의 값을 0.2, w의 값은 0.03으로 고정하였고, 소결은 공침법으로 합성된 분말의 경우 초기열처리과정을 거쳐 최종적으로 90$0^{\circ}C$에서, 건식법의 경우 11$50^{\circ}C$의 온도에서 진행하였다. 그 결과, 공침법으로 제조된 (NiCuZn)-ferrite는 건식법으로 제조된 (NiCuZn)-ferrite보다 20$0^{\circ}C$이상 낮은 소결온도에서 높은 소결밀도 값을 가졌으며, 품질계수 등 칩 인덕터에서 중요한 요소인 전자기적 특성이 우수하게 나타났다. 또한, 공침법으로 합성된 페라이트는 분말의 초기열처리온도에 따라 최종소결 특성이 크게 변하였다. 그밖에 공침법과 건식법으로 합성한 (NiCuZn)-ferrite의 결정성, 미세구조들을 XRD, SEM, TEM을 이용하여 비교 고찰하였다.하였다.다.