• Journal of the Microelectronics and Packaging Society
• /
• 제20권4호
• /
• pp.47-52
• /
• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 한국표면공학회 2016년도 추계학술대회 논문집
• /
• pp.148-148
• /
• 2016

디스플레이 시장이 rigid에서 flexible로 변화하기 시작하면서 유연 투명전극 소재에 대한 수요가 증가하고 있다. 투명전극으로 대표되는 Indium Tin Oxide(ITO)는 고투과 저저항의 장점을 가지지만 유연성이 떨어져 이를 대체 할 투명전극 소재로 Metal mesh, Ag nano-wire, CNT, Graphene, Conductive polymer 등에 대한 응용 연구가 활발히 진행되고 있다. 본 연구에서는 Metal mesh 용 Cu thin film 형성을 위해 플라즈마 표면처리 기술로 플라스틱 기판과 Cu 박막 사이의 밀착력을 향상시키고자 공정 연구를 수행하였다. 고품질의 Cu thin film 제작을 위해 양산용 roll to roll 장비를 이용하였고, 선형이온소스를 적용하여 플라즈마 표면처리를 수행하였다. 이후 마그네트론 스퍼터링을 통해 Ni buffer layer 및 Cu 박막 증착 공정을 in-situ로 진행하였다. 이러한 공정을 통해 제작한 Cu thin film의 밀착력을 평가하기 위해 cross cut test(ASTM D3359)를 수행하였다. 그 결과 플라스틱 기판과 Cu 금속 박막 사이의 밀착력이 0B에서 5B까지 향상된 것을 확인하였고, 플라즈마 표면처리 공정을 통해서 저항 또한 감소되는 결과를 얻을 수 있었다. 본 연구를 통해 polyethylene terephthalate(PET)뿐만 아니라 polyimide(PI) 기판 상에서도 플라즈마 표면처리를 통해 금속 박막의 밀착력이 향상되는 결과를 확인하였으며, flexible copper clad laminate (FCCL) 같은 유연 정보 소자 분야에 응용 가능할 것으로 기대된다.

• Proceedings of the KSME Conference
• /
• 대한기계학회 2008년도 추계학술대회A
• /
• pp.256-259
• /
• 2008

An micro-probe tip must be manufactured using thin film to evaluate integrity of the semiconductor with narrow distance between pads. In this study, fatigue tests were performed for BeCu thin film which is used in micro-probe tip of semiconductor test machine. The thin film was manufactured by electro plating process, and the specimens were fabricated by wire-cut electric discharge method to make hour glass type specimen of $5000{\mu}m$ width, $29200{\mu}m$ length and $30{\mu}m$ thickness. The fatigue test of load control with 10Hz frequency was performed, in ambient environment. The fatigue cycles were tension-tension with mean stress, at stress ratio, R=0.1.

• Proceedings of the KSR Conference
• /
• 한국철도학회 2004년도 추계학술대회 논문집
• /
• pp.704-709
• /
• 2004

The wear behavior and the mechanical property of Cu-$TiB_2$ composites were examined. Cu-$TiB_2$ composites were fabricated by hot extrusion and cold drawing with $TiB_2$ contents(1$\∼$5vol.$\%$) and the size of $TiB_2$ particles(10$\mu$m and 20$\mu$m). The pin-an-disk wear test was carried out under dry sliding wear conditions which loads varied with from 20N to 100N. At the time, counterpart wear material used SM45C. The experimental results showed that the friction coefficient and wear rate decreased with increasing the $TiB_2$ contents and decreasing the size of $TiB_2$ particle. Also, the depth of plastically deformed zone decreased with increasing the $TiB_2$ contents and decreasing the size of $TiB_2$ particle.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• 제60권2호
• /
• pp.349-351
• /
• 2011

The formation of oxide superconducting phase fabrication of superconducting wire materials and fabrication of precise superconducting material were studied for developing superconductor application technique. The $ZrO_2$ addition reduced the particle size $BaZrO_3$ trapped in the matrix after the sintering growth. The added $ZrO_2$ was converted to fine particles of $BaZrO_3$ which is the conventional sintering temperature for YBaCuO, $Y_2Ba_1Cu_1O_5$ and CuO are formed as by products of the reaction between $ZrO_2$ and YBaCuO phase. The formation of highly $BaZrO_3$ particle appears to be responsible for the refinement of $BaZrO_3$ phase after the citric acid sintering process.

• The Journal of Korean Academy of Prosthodontics
• /
• 제27권1호
• /
• pp.49-54
• /
• 1989

The purpose of this study was to investigate the interfacial elemental change when solding the Ni-Co-Cr dental removable partial denture alloy and Fe-Cr-Ni wrought wire alloy with Ag-Cu-Zu Silver solder, by EDXA, EPMA, to investigate the appropriateness of clinical usefullness for repair the fractured clasps of removable partial dentive. The result of this study was as follows: 1. The Ni element of major component of Ticonium penetrate into the silver solder 2. The movement Age element of silver solder into Fe-Cr-Ni wire was not significant, by EDXA and EPMA.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 한국전기전자재료학회 2009년도 하계학술대회 논문집
• /
• pp.440-440
• /
• 2009

Semiconductor nanowires offer exciting possibilities as components of solar cells and have already found applications as active elements in organic, dye-sensitized, quantum-dot sensitized, liquid-junction, and inorganic solid-state devices. Among many semiconductors, silicon is by far the dominant material used for worldwide photovoltaic energy conversion and solar cell manufacture. For silicon wire to be used for solar device, well aligned wire arrays need to be fabricated vertically or horizontally. Macroscopic silicon wire arrays suitable for photovoltaic applications have been commonly grown by the vapor-liquid-solid (VLS) process using metal catalysts such as Au, Ni, Pt, Cu. In the case, the impurity issues inside wire originated from metal catalyst are inevitable, leading to lowering the efficiency of solar cell. To escape from the problem, the wires of purity of wafer are the best for high efficiency of photovoltaic device. The fabrication of wire arrays by the electrochemical etching of silicon wafer with photolithography can solve the contamination of metal catalyst. In this presentation, we introduce silicon wire arrays by electrochemical etching method and then fabrication methods of radial p-n junction wire array solar cell and the various merits compared with conventional silicon solar cells.

• Resources Recycling
• /
• 제17권5호
• /
• pp.60-65
• /
• 2008

A study on the removal of silver(Ag) in copper electrolyte was carried out to produce high purity copper by using various method such as ion exchange resin, activated carbon adsorption, copper cementation with powder and wire, CuS precipitation. Parameters, such as reaction time, reaction temperature, addition amount etc. were investigated to determine the effective condition of silver removal. CuS precipitation and ion exchange using Lewatit TP214 was found to be effective. Especially, silver content in copper electrolyte was reduced from 10 ppm to less than 0.1 ppm by ion exchange with Lewatit TP214.

• Journal of Sensor Science and Technology
• /
• 제13권6호
• /
• pp.405-410
• /
• 2004

Compensation wires for Pt/Pd thermocouple was manufactured using Cu/Ni alloys. Their thermoelectric voltage has been tested from room temperature to about $150^{\circ}C$. Alloys of $Cu_{95.5}Ni_{4.5}$ and $Cu_{89.5}Ni_{10.5}$ introduced only small emf differences to Pt/Pd thermocouples, indicating a real possibility of industrial use. Above $1000^{\circ}C$, the temperature difference was expected to he small as ${\pm}0.5^{\circ}C$, and the difference would be minimized by adjusting the Ni content with a small amount.

• Proceedings of the Korean Magnestics Society Conference
• /
• 한국자기학회 2003년도 somma/kms meeting
• /
• pp.311-311
• /
• 2003