• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.112-112
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• 2008

최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

• Journal of the Korean institute of surface engineering
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• v.51 no.1
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• pp.54-61
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• 2018

Plasma Nitriding treatment was performed on STS 204Cu stainless steel samples at a temperature of $400^{\circ}C$ for 15 hours with varying $N_2$ content as 10%, 15% and 25%. Regardless of the content of $N_2$, S-Phase which is a hardened layer of Nitrogen (N) supersaturated phase, was formed in the surface of plasma treated samples. When $N_2$ content was 25%, the thickness of the hardened layer reached up to about $7{\mu}m$ and the surface hardness reached a value of $560Hv_{0.05}$, which is about 2.5 times higher than that of untreated sample (as received $220Hv_{0.05}$). From potentiodynamic polarization test, it was observed that compared to as received sample, the corrosion potential and the corrosion current density of the plasma treated samples were decreased regardless of the $N_2$ content, but the corrosion resistance was not increased much due to the precipitation of $Cr_2N$. On the other hand, pitting potential of the samples treated with 10% and 15% $N_2$ was higher than that of as received sample, however, the samples treated with 25% exhibited a lower pitting potential. Therefore, 10% $N_2$ content was selected as optimum plasma nitriding condition and to further increase both the thickness and surface hardness and the corrosion resistance of the hardened layer, different $CH_4$ content such as 1%, 3% and 5% was introduced into the plasma nitriding atmosphere. With 1% $CH_4$, the thickness of the hardened layer reached up to about $11{\mu}m$ and the surface hardness was measured as about $620Hv_{0.05}$, which is about 2.8 times that of as received sample. And the corrosion resistance of the plasma treated sample by using 1% $CH_4$ was improved significantly due to much higher pitting potential, and lower corrosion current density. When the $CH_4$ content was more than 1%, the thickness and surface hardness of the hardened layer decreased slightly and the corrosion resistance also decreased.

• Journal of the Korean Society of Industry Convergence
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• v.4 no.1
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• pp.61-69
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• 2001

Polycarbonate(PC) membranes for oxygen enrichment from air were prepared by the wet phase inversion method. In order to improve oxygen separation performances of the PC membrane, the effect of the added ethanol(nonsolvent) and $CuCl_2$(metal salt) concentration in the casting solution on morphology, oxygen permeability ami $O_2/N_2$ separation factor of the membrane was studied. In addition, tensile strength and elongation at break of the membrane were investigated. An asymmetric membrane with a dense top layer and a porous sublayer was obtained. The thickness of the dense top layer decreased with increasing amount of nonsolvent additive. Compared with pure PC membrane without additive(metal salt), the oxygen permeability and $O_2/N_2$ separation factor of the $PC/CuCl_2$ membrane are significantly improved. The oxygen permeability and $O_2/N_2$ separation factor is $5.25{\times}10^{-9}cm^3(STP){\cdot}cm/cm^2{\cdot}sec{\cdot}cmHg$ and 4.5, respectively. This improvement might be due to good interaction between metal salt and oxygen.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.97-104
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• 2016

In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the anti-oxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Ag-coated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Ag-coated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.215-220
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• 2001

Amorphous Ti-Si-N films of approximately 200 and 650 thickness were reactively sputtered on Si wafers using a dc magnetron sputtering system at various $N_2$/Ar flow ratios. Their barrier properties between Cu (750 ) and Si were investigated by using sheet resistance measurements, XRD, SEM, RBS, and AES depth profiling focused on the effect of the nitrogen content in Ti-Si-N thin film on the Ti-Si-N barrier properties. As the nitrogen content increases, first the failure temperature tends to increase up to 46 % and then decrease. Barrier failure seems to occur by the diffusion of Cu into the Si substrate to form Cu$_3$Si, since no other X- ray diffraction intensity peak (for example, that for titanium silicide) than Cu and Cu$_3$Si Peaks appears up to 80$0^{\circ}C$. The optimal composition of Ti-Si-N in this study is $Ti_{29}$Si$_{25}$N$_{46}$. The failure temperatures of the $Ti_{29}$Si$_{25}$N$_{465}$ barrier layers 200 and 650 thick are 650 and $700^{\circ}C$, respectively.ely.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.230-233
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• 2004

The stochiometric mix of evaporating materials for the $CuInS_2$ single crystal thin films was prepared from horizontal furnance. Using extrapolation method of X-ray diffraction patterns for the $CuInS_2$ polycrystal, it was found tetragonal structure whose lattice constant $a_0$ and $c_0$ were $5.524\;{\AA}$ and $11.142\;{\AA}$, respectively. To obtain the single crystal thin films, $CuInS_2$ mixed crystal was deposited on throughly etched semi-insulator GaAs(100) substrate by the hot wall epitaxy (HWE) system. The source and substrate temperature were 640 t and 430 t, respectively and the thickness of the single crystal thin films was $2{\mu}m$. Hall effect on this sample was measured by the method of van dot Pauw and studied on carrier density and temperature dependence of mobility. The carrier density and mobility deduced from Hall data are $9.64{\times}10^{22}/m^3,\;2.95{\times}10^{-2}\;m^2/V{\cdot}s$ at 293 K, respectively The optical energy gaps were found to be 1.53 eV at room temperature. From the photocurrent spectrum by illumination of perpendicular light on the c - axis of the thin film, we have found that the values of spin orbit coupling splitting ${\Delta}So$ and the crystal field splitting ${\Delta}Cr$ were 0.0211 eV and 0.0045 eV at 10 K, respectively. From PL peaks measured at 10K, 807.7nm (1.5350ev) mean Ex peak of the free exciton emission, also 810.3nm (1.5301eV) expresses $I_2$ peak of donor-bound exciton emission and 815.6nm (1.5201eV) emerges $I_1$ peak of acceptor-bound exciton emission. In addition, the peak observed at 862.0nm (1.4383eV) was analyzed to be PL peak due to donor-acceptor pair(DAP).

• Korean Journal of Materials Research
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• v.18 no.1
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• pp.45-50
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• 2008

Microstructural evolution and the intermetallic compound (IMC) growth kinetics in an Au stud bump were studied via isothermal aging at 120, 150, and $180^{\circ}C$ for 300hrs. The $AlAu_4$ phase was observed in an Al pad/Au stud interface, and its thickness was kept constant during the aging treatment. AuSn, $AuSn_2,\;and\;AuSn_4$ phases formed at interface between the Au stud and Sn. $AuSn_2,\;AuSn_2/AuSn_4$, and AuSn phases dominantly grew as the aging time increased at $120^{\circ}C,\;150^{\circ}C,\;and\;180^{\circ}C$, respectively, while $(Au,Cu)_6Sn_5/Cu_3Sn$ phases formed at Sn/Cu interface with a negligible growth rate. Kirkendall voids formed at $AlAu_4/Au$, Au/Au-Sn IMC, and $Cu_3Sn/Cu$ interfaces and propagated continuously as the time increased. The apparent activation energy for the overall growth of the Au-Sn IMC was estimated to be 1.04 eV.

• Korean Journal of Materials Research
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• v.33 no.1
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• pp.8-14
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• 2023

In order to broaden the range of application of light weight aluminum alloys, it is necessary to enhance the mechanical properties of the alloys and combine them with other materials, such as cast iron. In this study, the effects of adding small amounts of Cu and Zr to the Al-Si-Mg based alloy on tensile properties and corrosion characteristics were investigated, and the effect of the addition on the interfacial compounds layer with the cast iron was also analyzed. Although the tensile strength of the Al-Si-Mg alloy was not significantly affected by the additions of Cu and Zr, the corrosion resistance in 3.5 %NaCl solution was found to be somewhat lowered in this research. The influence of Cu and Zr addition on the type and thickness of the interfacial compounds layer formed during compound casting with cast iron was not significant, and the main interfacial compounds were identified to be Al₅FeSi and Al₈Fe₂Si phases, as in the case of the Al-Si-Mg alloys.

• Journal of the Korean Magnetics Society
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• v.11 no.5
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• pp.211-216
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• 2001

Top synthetic spin valves wi th structure Ta/NiFe/CoFe/Cu/CoFe(Pl)/Ru/CoFe(P2)/FeMn/Ta on Si (100) substrate with SiO$_2$ of 1500 were prepared by dc magnetron sputtering system. We have changed only the thickness of the free layer and the thickness difference (Pl-P2) in the two ferromagnetic layers separated by Ru, and investigated the effect of magnetic film thickness on the GMR properties and the interlayer coupling field in a spin valve with a synthetic antiferromagnet. As thickness difference of pinned layer was decreased from +25 to -25 , MR ratio was decreased gradually. However, there was a dip zone indicating a big change of MR ratio around Pl = P2, which can be due to the large canting of pinned layers. The modified Neel model was suggested for the top synthetic spin valve to explain the interlayer coupling field according to the thickness change of ferromagnetic layers. The interlayer coupling field was decreased due to the magnetostatic coupling (orange peel coupling) as suggested by model. However, the interlayer coupling field was not explained at the dip zone by the modified Neel model. The deviation of modified Neel model at the dip zone could be due to the largely canting of the pinned layers as well, which depends on different thickness in synthetic antiferromagnetic structure.

• Korean Journal of Poultry Science
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• v.41 no.4
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• pp.241-247
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• 2014

The objective of this experimental was to investigate the effect of dietary Cu-sulfate and Cu-soy proteinate on productive performance and small intestinal microflora. A total 1,000 Hy-Line Brown laying hens (35 weeks old) were randomly allotted to 1 of 5 dietary treatments: Control, Cu-sulfate 50, 100 (50, 100 ppm Cu supplementation as Cu-sulfate) and Cu-SP 50, 100 (50, 100 ppm Cu supplementation as Cu-soy proteinate). Each treatment was replicated 4 times with fifty birds per replication, housed in 2 birds cages. Fifty birds units were arranged according to randomized block design. Feeding trial lasted 5 weeks under 16L : 8D lighting regimen. Hen day egg production was significantly (P<0.05) higher in Cu treated groups than control. Feed intake, broken and shell-less egg production was not significantly influenced by treatment. Eggshell color, eggyolk color, haugh unit, and eggshell thickness were not significantly influenced by treatment. However, eggshell strength was significantly (P<0.05) greater in Cu treated groups than control. Concentration of copper of liver was significantly (P<0.05) greater in Cu treated groups than control. Concentration of zinc and iron of liver were not influenced by treatments. Population of Cl. perfrigens and Lactobacilli in the small intestinal content were significantly (P<0.05) influenced by treatments. Population of Cl. perfrigens decreased and that of Lactobacilli increased in the Cu supplement groups. In conclusion, dietary Cu sulfate and Cu-soy proteinate similarly improves egg production, eggshell strength, and favors intestinal microbial population of laying hens.