• Journal of Surface Science and Engineering
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• v.22 no.1
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• pp.3-9
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• 1989

The intermetallic compount formation, growth rections, and growth kinetices as functions of the aging temperaturess, time, and the condition of substarte have invedtigted in the Sn/Cu and Sn/Ni bimetal couples. The η'-phase (Cu6Sn5) and $\delta$-phase (Ni3Sn4) were only found to grow at 20 and $70^{\circ}C$in the Sn/Cu and Sn/Ni bimetallic coples repectively. Above that temperatures, all other compounds were formed in sequence of high Sn content plase and the metastable Cu41Sn11 was formed at agend $200^{\circ}C$. The ectivation energy for the growth of intermetallic compounds was 14.7Kxal/mole in the Sn/Cu interface and 26.7Kcal/mole in the Sn/Ni interface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.97-97
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• 2014

The properties of thin film solar cells based on electrodeposited $CuIn(Se,S)_2$ were investigated. The proposed solar cell fabrication method involves a single-step $CuInSe_2$ thin film electrodeposition followed by sulfurization in a tube furnace to form a $CuIn(Se,S)_2$ quaternary phase. A sulfurization temperature of $450-550^{\circ}C$ significantly affected the performance of the $CuIn(Se,S)_2$ thin film solar cell in addition to its composition, grain size and bandgap. Sulfur(S) substituted for selenium(Se) at increasing rates with higher sulfurization temperature, which resulted in an increase in overall band gap of the $CuIn(Se,S)_2$ thin film. The highest conversion efficiency of 3.12% under airmass(AM) 1.5 illumination was obtained from the $500^{\circ}C$-sulfurized solar cell. The highest External Quantum Efficiency(EQE) was also observed at the sulfurization temperature of $500^{\circ}C$.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.36-37
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• 2006

This study aims to investigate the usage of nano-scale particles in a micro metal injection molding ($\mu$-MIM) process. Nanoscale particle is effective to improve transcription and surface roughness in small structure. Moreover, the effects of hybrid micro/nano particles, Cu/Cu and SUS/Cu were investigated. Small dumbbell specimens were produced using various feedstocks prepared by changing binder content and fraction of nano-scale Cu particle (0.3 and $0.13{\mu}m$ in particle size). The effects of adding the fraction of nano-scale Cu powder on the melt viscosity of the feedstock, microstructure, density and tensile strength of sintered parts were discussed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.75-76
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• 2007

ZnS:Cu,Cl phosphor was coated by solid-gel reaction with $SiO_2$ outside layer. The effect of $Cu^{2+}$-doping concentration has been investigated on the luminescence characteristics of ZnS:Cu,Cl blue-green phosphors for inorganic electro luminescent device. Also, SiO2 coated layers' effect on luminescence characteristics. Evaluation of luminescence characteristics dependent on the synthesis conditions is important to get high-performance phosphors properties. EL and PL properties such as luminescence intensity and chromaticity of ZnS:Cu,Cl phosphors synthesized with different concentration of activator, $Cu^{2+}$, were analysed separately

• Journal of Surface Science and Engineering
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• v.27 no.1
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• pp.29-35
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• 1994

The effects of coating of 3$\mu\textrm{m}$ thickness on the mechanical property of alumina after heat treatment at 100$0^{\circ}C$ for 30minutes under $10^{-6}$torr vacuum was quantified in terms of modulus of rupture(MOR) using Weibull plot. While the copper coating did not change MOR of alumina due to the nonwetting behavior of Cu on $Al_2O_3$, the reactive titanium metal coating caused a noticeable 29% reduction in averaged MOr strength. This was related with the combined effects of microcracks in coating formed during heat treatment and good bonding character between Ti and $Al_2O_3$. The effect of cosputtering of Ti and Cu, bilayer coatings of Cu/Ti and Ti/Cu were also investigated. It was found that Ti, cosputtered, Cu/ti and Ti/Cu coatings reduced MOR strength of alumina in the order listed. This was correlated with the amount of Ti at coating/alumina inter-face associated with a coated layer or segregation of Ti during heat treatment.

• Journal of Surface Science and Engineering
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• v.30 no.2
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• pp.136-143
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• 1997

The photvoltaic power system has received considerable attention as the petroleumalterative energies to the environmental problems in the wored scale. $CuLnSe_2$is one ofthe most promising materials for the fabrication of large-area modules and low cost photovoltaic devices. Sulfur solute CuInSe2 thin films were prepared by RF sputtering using powder targer which were previously compacted by powder of $Cu_2Se, \;In_2Se_3, \;Cu_2S, \;and\;In_2S_3$ in various ratios. The results induicated that the sulfur ratio, the(112) texture, and the energy band gap were increased by the increase of the S/(S+Se) that was controlled by stoichiometric compound. The energy band gap can be shifted from 1.04eV to 1.50eV by abjusting the S/(S+Se) ratio, which maich it possible to obtain perfect match to the solar spectrum.

• Journal of Surface Science and Engineering
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• v.26 no.6
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• pp.327-333
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• 1993

The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.

• Journal of Surface Science and Engineering
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• v.45 no.5
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• pp.188-192
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• 2012

The hetero junction on dielectrics and ferrite for LTCC was prepared by using NiCuZn ferrite. The shrinkage behaviour of ferrite tapes in combination with a dielectric tape was investigated. The characteristics of NiCuZn ferrite were investigated using XRD (X-ray diffractometer), Dilatometer, FE-SEM (Field emission scanning electron microscope), EDS (Energy dispersive spectrometer). NiCuZn ferrite calcined at $700^{\circ}C$ had a good apparent density and initial permeability of magnetic properties. The shrinkage rate of the NCZF700 ferrite and dielectric material was similar. The multilayer revealed dense, uniform morphologies with excellent interface quality. Diffusion of hetero junction such as dielectric and ferrite was not occuring at $900^{\circ}C$.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.75-78
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• 2005

Using a low-energy Ar+ ion-beam with and without reactive gases, polymers such as chemically stable poly(ether ether ketone) (PTFE) and poly(ether ether ketone) (PEEK) films were modified to have special surface features. The adhesion strength between the polymers and the copper was significantly improved because of both changes in the surface topography and chemical interactions due to polymer surface functionalization (oxidation and amination). The surface modification altered the failure mode from adhesive failure for the unmodified polymer/Cu interface to cohesive failure for the surface-modified polymer/Cu layer interface..

• Journal of Surface Science and Engineering
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• v.38 no.3
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• pp.118-125
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• 2005

Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modification than $O_2$ plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with $O_2$ than $H_2$ plasma. PTFE treated with $120W-O_2$ plasma and $250w-H_2$ plasma, consecutively showed rougher surface than single step $250w-H_2$ plasma treated one and more hydrophilic than single step $120W-O_2$ plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.