• 한국표면공학회지
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• 제24권4호
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• pp.187-195
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• 1991

Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion strengths of Ni-P and Ni deposit were higher than that of Cu deposit, because of higher initial nucleation rates than the latter. The electroless-plated Ni-P and Ni underlayer improved the adhesion strength of the Cu deposit. In could be attributed to the enhanced adhesion between the substrate and those underlayers as well as the satisfactory adhesion between Cu deposits and those underlayers. Heat treatment was also conducted in order to enhance the adhesion strength of Cu layer. The strength was enhanced by about 19% when the treatment was conducted at $150^{\circ}C$ for 2 hours. The enhancement was attributed to relief of internal stress and release of hydrogen.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.185-185
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• 2013

Cu2O 는 산화물 반도체중 자연적으로 p-type 특성을 가지고 있으며 n-type 의 ZnO 와의 p-n 접합을 형성하고 자외선 센서로서의 특성을 보여주었다. 나노구조물의 자외선 센서의 제작과 졸-겔법으로 p-type Cu2O를 형성하고 열처리과정을 통하여 안정한 Cu2O 박막제작이 가능하다는 것을 보여주었다.

• 한국표면공학회지
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• 제28권1호
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• pp.3-13
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• 1995

Electroless Ni and Cu platings were conducted on $B_4C$ and SiC. In the electroless Ni plating, the deposition rate on $B_4C$ was higher than on SiC. However, the electroless Cu deposition occured with high deposition rate regardless of the carbide substrates used in this study. Uniformity of the deposits was better in the electroless Cu deposition than in the electroless Ni deposition. In the topographies of the electroless depositions, Ni deposits have grown as colony, whereas Cu deposits have grown as fine individual grains.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2009년도 춘계학술대회 논문집
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• pp.142-142
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• 2009

전자 소자 배선 재료로 이용되는 Cu의 확산 방지막으로서 170nm 두께의 전해 Ni-Re-P 합금 피막이 Cu substrate 위에 제조되었으며 피막특성 및 확산 거동을 연구하였다. 도금 피막내의 P와 Re의 조성분석은 WDXRF로 분석하였으며, 각 함량은 6wt.%와 10wt.%였다. DSC와 XRD는 Ni-Re-P 피막의 결정화 온도가 Ni-P 피막보다 높다는 것을 보여줬다. 이 결과는 Ni-Re-P 피막의 열적 안정성이 Ni-P피막보다 더 우수하다는 것을 나타낸다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.215-215
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• 2015

Ag-Cu 공정 합금을 이용한 스테인리스 강의 brazing 거동에 미치는 산소의 영향을 조사하고 최적 brazing 조건을 도출하기 위하여 304L 스테인리스 강에 대한 다양한 산소농도의 Ag-Cu 공정 합금의 젖음성을 실험적으로 측정하였다. 0.02~0.07wt%의 범위에 해당하는 산소를 함유하였을 때 양호한 젖음 특성을 나타내었고, sandwich brazing 테스트를 통하여 유사한 조건에서 건전한 접합면을 얻을 수 있었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2008년도 추계학술대회 초록집
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• pp.99-100
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• 2008

전기도금 방법은 많은 장점(낮은 증착온도, 두께 조절용이, 낮은 제조비용, 빠른 증착속도, 복잡한 형상의 물체 증착 가능 등)을 가지고 있으며 현재 FPCB의 소재인 FCCL을 제조 하는데 핵심 공정으로 많이 사용되고 있다. Sulfate 및 Pyrophosphate 용액으로부터 Cu 박막/후막을 제조 하였으며 공정 변수가 최종 도금된 Cu 박막/후막에 미치는 영향을 고찰하였다.

• 한국표면공학회지
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• 제42권5호
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• pp.232-239
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• 2009

This study presented the effect of membrane thickness on hydrogen permeability. Microvoids on the surface of the membrane should not exist for the exact values of hydrogen permeability. Pd-Cu-Ni hydrogen alloy membranes were fabricated by Ni powder sintering, substrate plasma pretreatment, sputtering and Cu reflow process. And this leaded to void-free surface and dense film of Pd-Cu-Ni hydrogen alloy membrane. Hydrogen permeation test showed that hydrogen permeability increased from 2.7 to $15.2ml/cm^2{\cdot}min{\cdot}atm^{0.5}$ as membrane thickness decreased from 12 to $4{\mu}m$. This represented the similar trend as a hydrogen permeability of pure palladium membrane based on solution-diffusion mechanism.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.401-401
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• 2016

Although vertically aligned one-dimensional (1D) structure has been considered as efficient forms for photoelectrode, development of efficient 1D nanostructured photocathode are still required. In this sense, we recently demonstrated a simple fabrication route for CuInS2 (CIS) nanorod arrays from aqueous solution by template-assisted growth-and-transfer method and their feasibility as a photoelectrode for water splitting. In this study, we further evaluated the photoelectrochemical properties surface-modified CIS nanorod arrays. Surface modification with CdS and ZnS was performed by successive ion layer adsorption and reaction (SILAR) method, which is well known as suitable technique for conformal coating throughout nanoporous structure. With surface modification of CdS and ZnS, both photoelectrochemical performance and stability of CuInS2 nanorod arrays were improved by shifting of the flat-band potential, which was analyzed both onset potential and Mott-schottky plot.

• 분석과학
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• 제8권4호
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• pp.529-534
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• 1995

The metal ion selective resins were prepared by surface template polymerization using monooleyl phosphoric acid (1), oleyl methyl phosphoric acid (2) or oleyl ethyl phosphoric acid (3) as an amphiphilic host surfactant. The $Cu^{2+}$-imprinted resins prepared in the presence of $Cu^{2+}$ adsorbed $Cu^{2+}$ much more effectively than did their reference resins. On the other hand, the $Cu^{2+}$-imprinted resins showed much less binding ability to $Zn^{2+}$. The template-dependent selectivity should be ascribed to a favorable placement of the surface-anchored metallophilic groups for multidentate coordination to specific metal ion.

• 한국표면공학회지
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• 제51권1호
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• pp.21-26
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• 2018

The $Cu_2(btc)_3$ metal-organic frameworks (MOF) coated anodic aluminum oxide (AAO) membrane was successfully prepared by layer-by-layer technique using hand spray method. It was confirmed that the $Cu_2(btc)_3$ layer, which has the pore sized in 2-3 nm, on surface of AAO exhibited the polycrystalline thin film structure by XRD analysis. More than 100 repetitive spray cycles were required to obtain more robust and thick MOFs on AAO and it was possible to uniformly coat both the top and bottom surfaces of the AAO. It should be noted that the MOFs also could be coated on surface of pores resulting in reduce the size of pore from 52 nm to 32 nm.