• Journal of the Korean Chemical Society
• /
• v.40 no.5
• /
• pp.341-346
• /
• 1996

Electrochemical determination of iodide was carried out by stripping voltammetry with a $(Cin)Cu(NO_3)_2$ modified-carbon paste electrode. Iodide was coordinated onto the electrode surface containing $(Cin)Cu(NO_3)_2$ via ion exchange. The oxidation peak potential of incorporated iodide was ＋0.72 V. The optimum analytical conditions for the determination of iodide were investigated using linear sweep voltammetry. Optimum conditions for the electrochemical determination of iodide were as follows: i) A predeposition solution was 0.1 M $KNO_3.$ ii) The deposition time was 10 min. iii) The composition of the electrode was 40% (w/w). The detection limit for iodide was $1.0{\times}10^{-6}M$ and the relative standard deviation was ${\pm}5.5%\;in\;2.0{\times}10^{-5}M$(four repetitions). The interference effect of other anions were also investigated. $Cl^-,\;Br^-,\;C_2O_4^{2-},\;and\;ClO_4^-$ ions do not interfere for the determination of iodide. When $SCN^-$ was added to the deposition solution, the oxidation peak current of iodide ion was decreased roughly 32%.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.2
• /
• pp.55-59
• /
• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Bulletin of the Korean Chemical Society
• /
• v.35 no.7
• /
• pp.1985-1988
• /
• 2014

$Cu_2ZnSnSe_4$ (CZTSe) thin films were synthesized on transparent conducting oxide glass substrates via a simple, non-toxic, and low-cost process using a precursor solution paste. A three-step heating process (oxidation, sulfurization, and selenization) was employed to synthesize a CZTSe thin film as an absorber layer for use in thin-film solar cells. In particular, we focused on the effects of sulfurization conditions on CZTSe film formation. We found that sulfurization at $400^{\circ}C$ involves the formation of secondary phases such as $CuSe_2$ and $Cu_2SnSe_3$, but they gradually disappeared when the temperature was increased. The formed CZTSe thin films showed homogenous and good crystallinity with grain sizes of approximately 600 nm. A solar cell device was tentatively fabricated and showed a power conversion efficiency of 2.2% on an active area of 0.44 $cm^2$ with an open circuit voltage of 365 mV, a short current density of 20.6 $mA/cm^2$, and a fill factor of 28.7%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.192-193
• /
• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.6
• /
• pp.538-544
• /
• 2000

The laser patterning of sputter-deposited CoNdZr/Cu/CoNbZr multi-layered films had been tried using Nd:YAG laser. However generally it is very difficult to remove metal films because of their high reflectance of the laser on the surfaces. As a counterproposal for this problem authors for the first time tried to deposit energy-absorbing layers on the metal films and then irradiated the laser on the surfaces of energy-absorbing layers. Here the energy-absorbing layers consisted of laser energy-absorbing fine powders and binding polymers. Three kinds of powders for the energy-absorbing layers had been used to see the difference in the pattern formation with the degree of laser energy absorption. They were electrically conductive silver powders insulating BaTiO$_3$powder and semiconducting carbon powder. Remarkable difference in width of the formed pattern and the roughness of pattern edge were observed with the characteristic of the powder for the energy-absorbing layer. The pattern width using carbon paste was about three times larger than that using BaTiO$_3$paste. It was observed that the energy-absorbing layer with carbon was the most effective on this micro-patterning.

• Proceedings of the KWS Conference
• /
• 2010.05a
• /
• pp.77-77
• /
• 2010

본 연구에서는 Sn-3.0Ag-0.5Cu (SAC305) 무연솔더의 최적 인쇄성을 위한 PCB 및 마스크설계, 스크린프린팅 공정변수의 최적값을 실험계획법을 통해 평가하였다. 사용된 칩은 가로 0.4mm 세로 0.2mm의 0402 MLCC칩이며, 사용된 시험보드는 OSP 표면처리된 PCB이었다. 인쇄성을 판단하기 위한 공정인자는 금속마스크 두께, 마스크홀 크기, 패드크기 및 모양, 인쇄각도, 인쇄속도, 판분리속도이었다. ANOVA분석을 통해 주인자를 파악하였으며, 인쇄성에 영향을 미치는 주인자는 마스크두께와 인쇄각도임이 확인되었다. 그 후 중심 합성법을 이용하여 인쇄성 최적 조건을 확인하였다. 결과로 나타난 등고선/표면도를 통해, 마스크두께가 작을 때에는 인쇄각도가 작아야 높은 인쇄성을 갖으며, 또한 마스크 두께가 클 경우에는 인쇄각도가 커야 높은 인쇄성을 가짐을 알 수 있었다. 추가실험을 통해서 인쇄성 표면도의 정확도를 확인하였으며, 실험값은 표면도에서 표시된 인쇄성값과 비슷함을 알 수 있었다. 또한, 인쇄성이 낮은 영역과 높은 영역에서 접합강도값을 측정하였으며, 인쇄성이 좋은 영역에서 접합강도도 높음을 알 수 있었다.

• Journal of the Korean Magnetics Society
• /
• v.13 no.3
• /
• pp.109-114
• /
• 2003

The purpose of this study Is to investigate the effect of $V_2$O$_{5}$ addition on the microstructures and magnetic properties of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt％ $V_2O_{5}$-doped NiCuZn ferrite pastes. With increasing the $V_2O_{5}$ content, the exaggerated grain growth of ferrite layers was developed due to the promotion of Ag diffusion and Cu segregation into the grain boundaries oi ferrites, which affected significantly the magnetic properties of the chip inductors. After sintering at $900^{\circ}C$, the inductance at 10 MHZ of the 0.5 wt％ $V_2O_{5}$-doped chip inductor was 3.7 ${\mu}$H less than 4.2 ${\mu}$H of the 0.3 wt% $V_2O_{5}$-doped one, which was thought to be caused by the residual stress at the ferrite layers increased with the promotion of Ag diffusion and Cu segregation. The quality factor of the 0.5 wt% $V_2O_{5}$-doped chip inductor decreased with increasing the sintering temperature, which was considered to be caused by the electrical resistivity of the ferrite layer decreased with the promotion of Ag/cu segregation at the grain boundaries and the growth of the mean grain size of ferrite due to exaggerated grain growth of ferrite layers.

• Korean Journal of Fisheries and Aquatic Sciences
• /
• v.18 no.3
• /
• pp.195-205
• /
• 1985

As a part of investigation to use the Anatrctic krill, Euphausia superba, more effectively as a food source, processing conditions, utilizations and storage stability of krill paste (intermediate product of krill) were examined and also chemical compositions of krill paste were analyzed. Frozen raw krill was chopped, agitated with $25\%$ of water to the minced krill and then centrifuged to separate the liquid fraction from the residue. This liquid fraction was heated at $98^{\circ}C$ for 20 min. to coagulate the proteins of krill, and it was filtered to separate the protein fraction. Krill paste was prepared with grinding the protein fraction, adding $0.2\%$ of polyphosphate and $0.3\%$ of sodium erythorbate to the krill paste for enhancing of functional properties and quality stability. The krill paste was packed in a carton box, and then stored at $-30^{\circ}C$. Chemical compositions of krill paste were as follows : moisture $78\%$, crude protein $12.9\%$, crude lipid $5.9\%$, and the contents of hazardous elements of krill paste as Hg 0.001 ppm, Cd 1.15 ppm, Zn 9.1 ppm, Pb 0.63 ppm and Cu 11.38ppm were safe for food. The amino acid compositions of krill paste showed relatively high amount of taurine, glutamic acid, aspartic acid, leucine, lysine and arginine, which occupied $55\%$ of total amino acid and also taurine, lysine, glycine, arginine and proline were occupied $65\%$ of total free amino acid. Fatty acid compositions of krill paste consist of $32.4\%$ of saturated fatty acid, $29.6\%$ of monoenoic acid and $38.0\%$ of polyenoic acid, and major fatty acids of product were eicosapentaenoic acid ($17.8\%$), oleic acid ($16.9\%$), palmitic acid ($15.3\%$), myristic acid ($8.7\%$) and docosahexaenoic acid ($8.4\%$). In case of procssing of fish sausage as one of experiment for krill paste use, Alaska pollack fish meat paste could be substituted with the krill paste up to $30\%$ without any significant defect in taste and texture of fish sausage, and the color of fish sausage could be maintained by the color of krill paste. Judging from the results of chemical and microbial experiments during frozen storage, the quality of krill paste could be preserved in good condition for 100 days at $-39^{\circ}C$.

• Proceedings of the KWS Conference
• /
• 2009.11a
• /
• pp.76-76
• /
• 2009

눈부신 전자산업의 발달로 대부분의 전자제품이 다기능/경박단소화 되고 있어, 고밀도 실장 기술인 양면 표면실장과 고집적 패키징 기술인 패키지 적층 공정의 적용이 점차 확대되고 있다. 따라서 양면 표면실장 및 패키지 적층 공정에 사용되는 저온 접합용 무연 솔더 즉, $183^{\circ}C$(Sn-37Pb 공정 솔더 융점) 이하의 융점을 가지는 저온 무연 솔더에 대한 관심이 높아지고 있다. 한편, 미세피치 적용 분야에 있어 ACF/P를 이용한 COG 접속 분야 외에도 최근 저온 접합용 무연 솔더를 이용한 접속 분야가 각광을 받고 있다. 따라서, 접속피치 미세화에 대응하기 위해 스크린 인쇄성을 향상시킬 수 있는 저온 무연 솔더 paste 제조 및 공정 기술의 개발이 필요한 실정이다. 현재 대표적인 저온 무연 솔더 조성은 Sn-Bi계($138^{\circ}C$ 융점)와 Sn-In계($120^{\circ}C$ 융점)이다. 하지만, 이들 조성의 신뢰성 등에 있어 개선의 여지가 있으므로 이를 해결하기 위한 무연솔더 조성의 개발이 필요하다. 이와 같은 관점에서, 본 연구는 $137^{\circ}C$의 융점을 갖는 Sn-57.6Ag-0.4Ag 저온 무연 솔더 paste를 $217^{\circ}C$의 융점을 갖는 Sn-3.0Ag-0.5Cu 솔더 paste와 비교하여 인쇄성, reflow 특성, void inspection, 미세조직 관찰 및 underfill 적용 등의 실험을 실시하였다.

• Journal of the Korean Ceramic Society
• /
• v.46 no.2
• /
• pp.175-180
• /
• 2009

Multilayer ceramic capacitors (MLCCs) have continually been made smaller in size and larger in capacity in resent years. However, the end termination electrode is still thick in many MLCCs. In this study, we used small grain glass frit to embody thin film and highly densification in the end termination by improve sintering driving force with well-dispersion and rising surface energy. Pastes were fabricated using size changed glass frit, such as 0.1 ${\mu}m$, 0.5 ${\mu}m$, 1.0 ${\mu}m$, 4.0 ${\mu}m$. Fabricated pastes were applied 05A475KQ5 chip and fired various sintering temperatures to analyze sintering behavior of pastes. Consequently, small glass frit used pastes have many merits than larger, such as well-dispersion, improve cornercoverage and surface roughness, possibility of low temperature sintering. However, we confirmed that small glass frit used pastes have narrow sintering window by rapid completion of sintering densification.