• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1379-1381
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• 1998

Powder electroluminescent device (PELD) structured conventionally dielectric and phosphor layer, between electrode and their layer fabricated by screen printing splaying or spin coating method. To promote performance of PELDs, we approached the experiments for different structure and thickness variation of PELD. Thickness variation($30{\mu}m{\sim}130{\mu}m$) was taken. To investigate electrical and optical properties of PELDs, EL spectrum, transferred charge density using Sawyer-Tower's circuit brightness was measured. Variation of structure in PELDs was as follows: WK-1 (ITO/BaTiO3/ZnS:Cu/Silver paste), WK-2 (ITO/BaTiO3/ZnS:Cu/BaTiO3/ZnS:Silver paste), WK-3 (ITO/BaTiO3/ZnS:Cu/BaTiO3/Silver paste), WK-4(ITO/BaTiO3+ZnS:Cu/Silver paste) As a result, structure of the highest brightness appeared WK-4 possessed 60 ${\mu}m$ thickness. The brightness was 2719 cd/$m^2$ at 100V, 400Hz.

• Bulletin of the Korean Chemical Society
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• 제31권10호
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• pp.2949-2954
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• 2010

Ionic liquid-functionalized ordered mesoporous silica SBA-15 modified carbon paste electrode (CISPE) was fabricated and its electrochemical performance was investigated by cyclic voltammetry, electrochemical impedance spectra. The electrochemical behavior of $Cd^{2+}$, $Pb^{2+}$, $Cu^{2+}$ and $Hg^{2+}$ at CISPE was studied by differential pulse anodic stripping voltammetry (DPASV). Compared with carbon paste electrode, the stripping peak currents had a significant increase at CISPE. Under the optimized conditions, the detection limits were $8.0{\times}10^{-8}\;M$ ($Cd^{2+}$), $4.0{\times}10^{-8}\;M$ ($Pb^{2+}$), $6.0{\times}10^{-8}\;M$ ($Cu^{2+}$), $1.0{\times}10^{-8}\;M$ ($Hg^{2+}$), respectively. Furthermore, the present method was applied to the determination of $Cd^{2+}$, $Pb^{2+}$, $Cu^{2+}$ and $Hg^{2+}$ in water samples and people hair sample.

• 한국분말재료학회지
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• 제24권5호
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• pp.395-399
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• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• 한국전기전자재료학회논문지
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• 제17권6호
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• 한국환경과학회지
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• 제21권11호
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• pp.1333-1338
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• 2012

In order to measure the minute amount of Cu(II) in our environment, cyclic voltammetry (CV) and square-wave stripping voltammetry (SWSV) were performed for a trace copper assay using bismuth immobilized on a carbon nanotube paste electrode. An analytical working range of 30 to $240{\mu}g/L$ Cu(II) was obtained for CV and SWSV. The SWSV precision obtained was 0.47 % (n = 15) RSD in $30.0{\mu}g/L$ Cu(II). The detection limit obtained was 3.1 ng/L Cu(II) using SWSV, while the CV yielded the nano-range detection limit through the pre-concentration step. By using this research method, Cu(II) value could be determined in the urine of human sample and in the brain of fish sample. This research can be effectively applied to other cases of measuring minute amount of Cu(II) in living organisms.

• Bulletin of the Korean Chemical Society
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• 제35권10호
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• pp.3025-3029
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• 2014

To realize copper-based electrode materials for printed electronics applications, it is necessary to improve the adhesion strength between conductive lines and the substrate. Here, we report the preparation of Cu pastes using (3-glycidoxypropyl) trimethoxysilane (GPTMS) prepolymer as an adhesion promoter (AP). The Cu pastes were screen-printed on glass and polyimide (PI) substrates and sintered at high temperatures (> $250^{\circ}C$) under a formic acid/$N_2$ environment. According to the adhesion strengths and electrical conductivities of the sintered Cu films, the optimized Cu paste was composed of 1.0 wt % GPTMS prepolymer, 83.6 wt % Cu powder and 15.4 wt % vehicle. After sintering at $400^{\circ}C$ on a glass substrate and $275^{\circ}C$ on a PI substrate, the Cu films showed the sheet resistances of $10.0m{\Omega}/sq$. and $5.2m{\Omega}/sq$., respectively. Furthermore, the sintered Cu films exhibit excellent adhesion properties according to the results of the ASTM-D3359 standard test.

• Journal of Welding and Joining
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• 제31권6호
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• pp.65-70
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• 2013

In joining Alumina to copper plate by Mo-Mn metallizing process, the effects of the composition of metallizing paste on the bonding strength were investigated. The bonding strength increased with increasing Mn amount in the paste up to 20% but followed by the decrease with addition of Mn. The maximum bonding strength reached 50MPa at 20%Mn when heated to $1550^{\circ}C$ for 60minute. The addition of Si to the metallizing powder increased the bonding strength of the joint by enhancing the mechanical bonding between the Alumina and the metallizing layer due to the decrease of layer viscosity with the addition of $SiO_2$. It is thought that MnO reacted with $Al_2O_3$ to yield $MnAl_2O_4$ spinel, forming a joint.

• 한국전기전자재료학회논문지
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• 제23권4호
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.442-446
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• 1999

Melting behavior and bridge phenomenon of solder paste, which is essential for surface mount technology in packaging, were investigated. solder paste of Sn-37%Pb was printed on Sn-coated Cu-pattern of PCB, and heated over melting point. Melting behavior of the paste was observed using CCD-camera. In order to modelize the melting and agglomeration phenomena of the paste, two solder balls of 0.76mm diameter were used. As experimental results, the paste start to melt from the margin of the printed shape. The hight of the melted paste decreased from 270 $\mu$m to 200 $\mu$m firstly, and finally recovered to 250 $\mu$m. During the melting procedure, pores were evolved from the molten paste. Bridge Phenomenon of the molten Paste depends upon the pitch of the pattern.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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• pp.271-274
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• 1999

We are investigating epitaxially grown YBa$_2Cu_3O_x$(123) on MgO single crystal by partial melting process for high power application. After fabricating of BaCuO$_2$(011), Y$_2BaCuO_5$(211) powder, we made YBa$_2Cu_3O_x$(123) Paste with just mixing of (211), (011) and CuO(001) powders. Screen printing method was used to coat YBa$_2Cu_3O_x$(123) paste on MgO single crystal. To reduce the reaction in low temperature, rapid heating was conducted at partial melting temperature. The film was analysed with the difference of cooling-rate, thickness, reaction temperature by XRD, SEM, in-plane alignment, out-of-plane alignment, temperature-resistivity characteristics.