• 한국분말재료학회지
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• 제15권3호
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• pp.234-238
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• 2008

Al-Cu alloy nano powders have been produced by the electrical explosion of Cu-plated Al wire. The porous nano particles were prepared by leaching for Al-Cu alloy nano powders in 40wt% NaOH aqueous solution. The surface area of leached powder for 5 hours was 4 times larger than that of original alloy nano powder. It is demonstrated that porous nano particles could be obtained by selective leaching of alloy nano powder. It is expected that porous Cu nano powders can be applied for catalyst of SRM (steam reforming methanol).

• 한국분말재료학회지
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• 제13권3호
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• pp.187-191
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• 2006

Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and $CuAl_2$ were the major phases. As the Cu layer becomes thicker, Al diminished while $Al_4Cu_9$ phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

• 한국분말재료학회지
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• 제9권2호
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• pp.124-132
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• 2002

Nano Cu powders, synthesized by Pulsed Wire Evaporation (PWE) method, have been compacted by Magnetic Pulsed Cojpaction(MPC) method. The microstructure and mechanical properties were analyzed. The optimal condition for proper mechanical properties with nanostructure was found. Both pure nano Cu powders and passivated nano Cu powders were compacted, and the effect of passivated layer on the mechanical properties was investigated. The compacts by MPC, which had ultra-fine and uniform nanostructure, showed higher density of 95% of theoretical density than that of static compaction. The pur and passivated Cu compacted at $300^{\circ}C$ exhibited maximum hardnesses of 248 and 260 Hv, respectively. The wear resistance of those compacts corresponded to the hardness.

• 한국입자에어로졸학회지
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• 제6권1호
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• pp.37-46
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• 2010

Cu nano-colloid was prepared by wire electric explosion process under de-mineralized water and anhydrous ethanol. To control the properties of Cu nano-colloid, experimental conditions such as diameter of Cu wire and applied voltage were changed. The optimal Cu nano-colloid was prepared when the 0.1mm diameter of Cu wire with the applied voltage of 2000 V was used. The shape of Cu particles in colloid was spherical and the XRD result revealed that the phase of Cu particles was cubic phase. About 20nm Cu nanoparticles with high crystallinity were successfully prepared using wire explosion process under anhydrous ethanol and they showed more than 100 hours dispersion stability.

• 한국재료학회지
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• 제30권2호
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• 한국분말재료학회지
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• 제18권6호
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• pp.546-551
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• 2011

Ag spot-coated Cu nanopowders were synthesized by a hydrothermal-attachment method (HA) using oleic acid capped Ag hydrosol. Cu nano powders were synthesized by pulsed wire exploding method using 0.4 mm in diameter of Cu wire (purity 99.9%). Synthesized Cu nano powders are seen with comparatively spherical shape having range in 50 nm to 150 nm in diameter. The oleic acid capped Ag hydrosol was synthesized by the precipitation-redispersion method. Oleic acid capped Ag nano particles showed the narrow size distribution and their particle size were less than 20 nm in diameter. In the case of nano Ag-spot coated Cu powders, nanosized Ag particles were adhered in the copper surface by HAA method. The components of C, O and Ag were distributed on the surface of copper powder.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.36-37
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• 2006

This study aims to investigate the usage of nano-scale particles in a micro metal injection molding ($\mu$-MIM) process. Nanoscale particle is effective to improve transcription and surface roughness in small structure. Moreover, the effects of hybrid micro/nano particles, Cu/Cu and SUS/Cu were investigated. Small dumbbell specimens were produced using various feedstocks prepared by changing binder content and fraction of nano-scale Cu particle (0.3 and $0.13{\mu}m$ in particle size). The effects of adding the fraction of nano-scale Cu powder on the melt viscosity of the feedstock, microstructure, density and tensile strength of sintered parts were discussed.

• 한국분말재료학회지
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• 제11권3호
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• pp.210-216
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• 2004

The possibility to decrease agglomeration of Cu nano powders and their separation during pulsed wire evaporation (PWE) process was investigated by controlling the working gas system, i.e., the design of the gas path, the type and pressure of the atmospheric gas. As a result, it was possible to choose the optimal design of the gas path providing large specific surface area and high degree of separation of the synthesized Cu nano powders. It was also shown that an Ar+10∼50$N_2$ mixture can be used in production of Cu nano powders, which do not react with nitrogen.

• 소성∙가공
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• 제16권3호
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• pp.210-214
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• 2007

Manufacturing bulk nanostructured materials with least grain growth from initial powders is challenging because of the bottle neck of bottom-up methods using the conventional powder metallurgy via compaction and sintering. In the study, densification behavior of nano Cu powders during pressureless sintering was investigated using an in-situ optical dilatometer technique. The initial heating and steady temperature stages during the sintering of nano Cu powder compacts were observed. At the initial heating stage, the powder compact has many porosities and full densification needs high temperature and/or high pressure sintering. In the experimental analysis, changes in geometry and density were measured and discussed for optimal consolidation and densification by the in-situ optical dilatometer.

• 한국분말재료학회지
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• 제18권4호
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• pp.322-326
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• 2011

Inkjet printing was successfully done using Cu nano powder ink after these Cu nano powders were dry-coated with 1-octanethiol for oxidation prevention. 1-octanethiol, which is Self-Assembled Multi-layers (SAMs), was coated approximately 10-nm thick on the surface of Cu nano powders. 1-Octanol, which has the same chain length as that for 1-octanethiol, was used as a solvent to make the ink for inkjet printing. As a result, the fabricated ink was dispersed for about 4 weeks, and after printing and heat treatment at $350^{\circ}C$ for 4 hours, the resistivity for the printed pattern was measured to be $1.15{\times}10^{-5}{\Omega}{\cdot}cm$.