Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Inkjet Printing Using Cu Nano Powder Ink Coated with 1-Octanethiol in Dry Method

건식법으로 1-Octanethiol 코팅한 Cu 나노 분말 잉크의 잉크젯 인쇄 기술 적용

  • Her, Jae-Hak (Division of Metallurgy and Material Engineering, Hanyang Univ.) ;
  • Park, Shin-Young (Division of Metallurgy and Material Engineering, Hanyang Univ.) ;
  • Haque, Mominul Md. (Division of Metallurgy and Material Engineering, Hanyang Univ.) ;
  • Lee, Caroline Sun-Yong (Division of Metallurgy and Material Engineering, Hanyang Univ.)
  • 허재학 (한양대학교 금속재료공학과) ;
  • 박신영 (한양대학교 금속재료공학과) ;
  • ;
  • 이선영 (한양대학교 금속재료공학과)
  • Received : 2011.05.20
  • Accepted : 2011.06.15
  • Published : 2011.08.28
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Abstract

Inkjet printing was successfully done using Cu nano powder ink after these Cu nano powders were dry-coated with 1-octanethiol for oxidation prevention. 1-octanethiol, which is Self-Assembled Multi-layers (SAMs), was coated approximately 10-nm thick on the surface of Cu nano powders. 1-Octanol, which has the same chain length as that for 1-octanethiol, was used as a solvent to make the ink for inkjet printing. As a result, the fabricated ink was dispersed for about 4 weeks, and after printing and heat treatment at $350^{\circ}C$ for 4 hours, the resistivity for the printed pattern was measured to be $1.15{\times}10^{-5}{\Omega}{\cdot}cm$.

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References

  1. J. Bharathan and Y. Yang: Appl. Phys. Lett., 72 (1998) 2660. https://doi.org/10.1063/1.121090
  2. T. Kawase, S. Moriya, C. J. Newsome and T. Shimoda: Japan. J. Appl. Phys., 44 (2005) 3649. https://doi.org/10.1143/JJAP.44.3649
  3. T. R. Hebner, C. C. Wu, D. Marcy, M. H. Lu and J. C. Sturm: Appl. Phys. Lett., 72 (1998) 519.
  4. E. Tekin, P. J. Smith, S. Hoeppener, A. M. J. van den Berg. A. S. Susha, A. L. Rogach, J. Feldmann and U. S. Schubert: Adv. Funct. Mater., 17 (2007) 23. https://doi.org/10.1002/adfm.200600587
  5. R. A. Street, W. S. Wong, S. E. Ready, M. L. Chabinyc, A. C. Arias, S. Limb, A. Salleo and R. Lujan: Mater. Today, 9 (2006) 32.
  6. M. R. Seong, J. Kwon, G. Y. Lee, D. K. Kim, Y. S. Kim and C. S. Lee: Applied Surface Science, 256 (2010) 2332. https://doi.org/10.1016/j.apsusc.2009.10.062
  7. J. H, Kwon, S. Y. Park, T. H. Lee, J.-M. Yang and C. S. Lee: Applied Surface Science, 257 (2011) 5115. https://doi.org/10.1016/j.apsusc.2011.01.035
  8. R. E. Hummel: in Electronic Properties of Materials, Springer, New York, NY (2000).
  9. R. Desikan, S. Armel, H. M. Meyer III and T. Thundat: Nanotech., 18 (2007) 424028. https://doi.org/10.1088/0957-4484/18/42/424028
  10. D. A. Hutt and C. Liu: Appl. Surf. Sci., 252 (2005) 400. https://doi.org/10.1016/j.apsusc.2005.01.019