• 제목/요약/키워드: Cu loading

검색결과 134건 처리시간 0.029초

초미세립 Cu의 소성변형거동에 미치는 결정립 형상의 영향 (Effects of Grain Morphology on Plastic Flow of Ultrafine Grained OFHC Cu)

  • 박이주;김형원;이종수;박경태
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 춘계학술대회 논문집
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    • pp.263-265
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    • 2009
  • In this study, ultrafine grained (UFG) oxygen free high conductivity copper (OFHC Cu) having two different grain morphologies, one the severely elongated and the other the equiaxed, was prepared by equal channel angular pressing (ECAP) with routes A and $B_c$, respectively. The results of quasi-static tensile tests at $10^{-1}\;s^{-1}$ and $1\;s^{-1}$ and dynamic compression tests at $10^3\;s^{-1}$ order revealed that the equiaxed UFG Cu exhibited higher strength and less ductility compared to the elongated one. The difference of the plastic flow characteristics between the two were rationalized by considering their dislocation mean free length based on the orientation relationship between the possible slip planes and the loading direction.

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반복하중을 받는 구리 나노 와이어의 기계적 거동 (Mechanical Behavior of Cu Nanowire under Cyclic Loading)

  • 이상진;조맹효
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1784-1787
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    • 2008
  • Molecular dynamics (MD) simulations are used to analyze behavior of copper nanowires under cyclic loading. The embedded atom method (EAM) potential is employed to represent atomic interaction. Cyclic load is applied in two ways (Forward Tension / Reverse Compression and Forward Compression / Reverse Tension). The results show that dislocations are piled up as a result of plastic deformation during alternate tensile and compressive loading. After cyclic loading with a change of direction, yield stress decreases in consequence of the effect by the dislocation pileups. On the other hand, under FC/RT cyclic load, phase transformation represent associated with mechanical twinning. And copper nanowire can return to almost former undeformed condition during tensile loading at 300K.

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화염급냉 표면처리된 Cu-9Al-4.5Ni-4.5Fe 합금의 $\beta$' 마르텐사이트 형성에 의한 케비테이션 침식 저항성 향상에 관한 연구 (Improvement of the Resistance to Cavitation Erosion by the Formation of $\beta$' Martensite in Flame-Quenched Cu-9Al-4.5Ni-4.5Fe Alloys)

  • 홍성모;이민구;김광호;김경호;김흥회;홍순익
    • 한국표면공학회지
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    • 제37권4호
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    • pp.234-241
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    • 2004
  • Cavitation erosion properties of the Cu-9Al-4.5Ni-4.5Fe alloys (Al-bronze) surface-modified by flame quenching process have been investigated. After flame quenching at above $T_{\beta}$, the surfaces of Al-bronze with $\alpha$ + $\textsc{k}$ structure have been changed into the $\alpha$ + $\beta$' martensite phases by the eutectoid reaction of $\alpha$ + $\textsc{k}$\longrightarrow$\beta$ followed by the martensite transformation of $\beta$\longrightarrow$\beta$'. As a result of cavitation test, the measured incubation time and erosion rate of the $\alpha$ + $\beta$' alloy was 1.2 times higher and 1.5 times lower, respectively, compared to those of the conventional $\alpha$ + $\textsc{k}$ alloys, showing a remarkable increase of cavitation resistance with the formation of $\beta$' martensite. This is attributed to a preferential erosion of the $\textsc{k}$ precipitates that show the lowest resistance among the $\alpha$, $\textsc{k}$, $\beta$' phases under cavitation loading.ases under cavitation loading.

Adhesion Change of AZO/PET Film by ZrCu Insertion Layer

  • Ko, Sang-Won;Jung, Jong-Gook;Park, Kyeong-Soon;Lim, Sil-Mook
    • 한국표면공학회지
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    • 제49권3호
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    • pp.252-259
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    • 2016
  • In order to form an aluminum-doped zinc oxide (AZO) transparent electrode film on a polyethylene terephthalate (PET) substrate used for a flexible display substrate, the AZO transparent electrode was produced at low temperature without substrate heating. Even though the produced electrode showed characteristic optical transmittance of 90 % (at 550 nm) and sheet resistance within $100{\Omega}/sq$, cracks occurred 10 minutes after loading applied 2 mm radius of curvature, and the sheet resistance increased linearly. An insertion layer of ZrCu was formed between the AZO film and the PET substrate to suppress the generation of cracks on the AZO film. It was verified that the crack was not generated 30 minutes after the loading of 2 mm radius of curvature, and no increase in sheet resistance was recorded. There was also not cracks in the dynamic bending test of 4 mm radius, but surface resistance was slightly increased. As a result, the ZrCu insertion film improved the interfacial adhesion between the substrate and AZO film layer without increasing sheet resistance and decreasing transmittance.

Chemical Indices of Soil Quality: Effects of Heavy Metal Additions

  • Yang, Jae-E.;Choi, Moon-Heon;Lee, Wi-Young;Kim, Jeong-Je;Jung, Yeong-Sang
    • Applied Biological Chemistry
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    • 제41권8호
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    • pp.587-594
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    • 1998
  • The objective of this research was to characterize effects of Cu or Cd additions on chemistry of soil quality indices, such as pH, EC, cation distribution and buffering capacity. Metals were added at rates ranging from 0 to 400 mg $kg^{-1}$ of soil. Soil solution was sequentially extracted from saturated pastes using vacuum. Concentrations of Cu or Cd remaining in soil solutions were very low as compared to those added to the soils, warranting that most of the added metals were recovered as nonavailable fractions. Adsorption of the added metals released cations into soil solution causing increases of ionic strength of soil solution. At metal additions of $200{\sim}400\;mg\;kg^{-1}$, EC of soil solution increased to as much as $2{\sim}4\;m^{-1}$; salinity levels considered high enough to cause detrimental effects on plant production. More divalent cations than monovalent cations were exchanged by Cu or Cd adsorption. The nutrient buffering capacity of soils was decreased due to the metal adsorption and release of cations. pH of soil solution decreased linearly with increasing metal loading rates, with a decrement of up to 1.3 units at 400 mg Cu $kg^{-1}$ addition. Influences of Cu on each of these soil quality parameters were consistently greater than those of Cd. These effects were of a detrimental nature and large enough in most cases to significantly impact soil productivity. It is clear that new protocols are needed for evaluating potential effects of heavy metal loading of soils.

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Applicability of Cu-Al-Mn shape memory alloy bars to retrofitting of historical masonry constructions

  • Shrestha, Kshitij C.;Araki, Yoshikazu;Nagae, Takuya;Omori, Toshihiro;Sutou, Yuji;Kainuma, Ryosuke;Ishida, Kiyohito
    • Earthquakes and Structures
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    • 제2권3호
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    • pp.233-256
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    • 2011
  • This paper investigates the applicability of newly developed Cu-Al-Mn shape memory alloy (SMA) bars to retrofitting of historical masonry constructions by performing quasi-static tests of half-scale brick walls subjected to cyclic out-of-plane flexure. Problems associated with conventional steel reinforcing bars lie in pinching, or degradation of stiffness and strength under cyclic loading, and in their inability to restrain residual deformations in structures during and after intense earthquakes. This paper attempts to resolve the problems by applying newly developed Cu-Al-Mn SMA bars, characterized by large recovery strain, low material cost, and high machinability, as partial replacements for steel bars. Three types of brick wall specimens, unreinforced, steel reinforced, and SMA reinforced specimens are prepared. The specimens are subjected to quasi-static cyclic loading up to rotation angle enough to cause yielding of reinforcing bars. Corresponding nonlinear finite element models are developed to simulate the experimental observations. It was found from the experimental and numerical results that both the steel reinforced and SMA reinforced specimens showed substantial increment in strength and ductility as compared to the unreinforced specimen. The steel reinforced specimen showed pinching and significant residual elongation in reinforcing bars while the SMA reinforced specimen did not. Both the experimental and numerical observations demonstrate the superiority of Cu-Al-Mn SMA bars to conventional steel reinforcing bars in retrofitting historical masonry constructions.

특정용제 Target 형 활성금속첨착 활성탄소섬유의 개발 (Development of Metal Loaded Activated Carbon Fiber for Eliminating Targeted VOCs Originated from Solvent)

  • 최강용;김광수;김태원;전민기;박해경
    • 대한환경공학회지
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    • 제35권1호
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    • pp.31-37
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    • 2013
  • 기존 흡착제들보다 우수한 흡착성능을 확보하고, 특히 특정한 용제에 대한 흡착성능을 극대화하기 위하여 $1,100m^2/g$의 비표면적을 갖는 활성탄소섬유를 기본흡착제로 적용하였고, 여기에 활성금속을 첨착시켜 흡착성능과 선택성을 제고하고자 하였다. 활성금속은 screening 연구를 수행하여 최종적으로 Cu, Cr을 선정하였으며, 활성금속첨착 활성탄소섬유의 제조변수는 제조온도, 제조시간, 활성금속의 종류이었다. 물성측정 및 흡착반응실험을 통하여 금속을 $100^{\circ}C$에서 5시간 동안 첨착하였을 경우 acetone gas 흡착성능이 가장 높게 나타났으며, 기존 활성탄소섬유보다 2배 이상의 높은 흡착성능을 확인하였다. 한편, 활성금속첨착 활성탄소섬유의 확산 및 흡착에 필요한 최소 접촉시간은 최소한 0.5초 이상은 유지해야 함을 확인할 수 있었다.

박막 적층 구조 및 필링 속도가 스크린 프린팅 Ag/Polyimide 사이의 필 강도에 미치는 영향 (Effects of Film Stack Structure and Peeling Rate on the Peel Strength of Screen-printed Ag/Polyimide)

  • 이현철;배병현;손기락;김가희;박영배
    • 마이크로전자및패키징학회지
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    • 제29권2호
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    • pp.59-64
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    • 2022
  • 연성인쇄회로기판에 사용되는 스크린 프린팅(screen-printing, SP) Ag/폴리이미드(polyimide, PI) 구조의 필 테스트 시 필링 속도 및 박막 적층 구조가 필 강도에 미치는 영향을 분석하기 위해, PI/SP-Ag, PI/SP-Ag/전해도금 Cu, 전해도금 Cu/SP-Ag/PI의 3가지 적층 구조에 대해 필링 속도에 따른 90° 필 테스트를 수행하였다. PI 박막을 필링하는 2가지 구조에서는 필링 속도에 상관없이 필 강도가 거의 일정하게 유지된 반면, Cu/Ag 금속 박막 필링 구조에서는 필링 속도가 증가할수록 필 강도가 크게 증가하는 경향을 보였다. 이는 필링 속도에 따른 90° 굽힘 소재의 소성변형에너지 차이에 기인한 것으로 판단된다. 인장속도에 따른 인장 시험 결과, 변형 속도 증가에 따른 Cu/Ag 금속 박막의 유동응력 및 인성 증가가 Cu/Ag/PI 구조에서의 필링 속도에 따른 금속 박막의 90° 굽힘 소성변형에너지 및 필 강도 증가의 주 원인으로 판단된다. 반면, 점탄성 소재인 PI의 경우 변형 속도에 따른 기계적물성 차이가 금속에 비해 상대적으로 작아서, PI/Ag 및 PI/Ag/Cu 구조에서는 필링 속도에 따른 PI의 90° 굽힘 소성변형에너지 및 필 강도 변화가 상대적으로 적은 것으로 판단된다.

TiO2 광-촉매 반응에 의한 Cu(II)-EDTA의 산화(I) - TiO2 량과 pH의 영향 - (Oxidation of Cu(II)-EDTA by TiO2 Photo-Catalysis(I) - The Effects of TiO2 Loading & Initial pH of Solution -)

  • 정흥호;박은희;노재성;성기웅;조영현
    • 공업화학
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    • 제10권1호
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    • pp.154-159
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    • 1999
  • 수중 금속이온 착화용 공업세정제를 비롯하여 산업적으로 다양한 용도로 폭넓게 사용되고 있는 EDTA (ethylenediaminetetraacetic acid)는 수처리시 금속이온들을 제거할 경우에 방해요인으로 작용하므로, EDTA를 우선적으로 분해하여 착화결합을 끊어야 금속이온들의 제거가 용이해진다. 본 연구에서는, $TiO_2$ (Degussa P-25)를 사용하여 1.79 mM의 초기 Cu(II)-EDTA 수용액 농도와 $20^{\circ}C$의 호기성 분위기 하에서, 촉매의 양과 초기의 수용액 pH가 Cu(II)-EDTA 착물의 산화에 미치는 영향을 고찰하였다. $TiO_2$량이 2.0 g/L일 경우에 EDTA, Cu와 TOC 감소율이 최대로 나타났고, DETA의 촉매표면 흡착은 $TiO_2$ 표면전하에 의해 영향을 받으며 광-촉매 반응에 의한 EDTA의 분해는 광-조사전의 촉매표면 흡착에 의존하는 것으로 보였다.

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