• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.33-37
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• 2008

A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the $Cu/Cu_3Sn$ interface of the solder joint during thermal aging at $150^{\circ}C$. The in-situ AES analysis of fractured joints revealed S segregation on the void surface. Only Cu, Sn, and S peaks were detected at the fractured $Cu/Cu_3Sn$ interfaces, and the S peak decreased rapidly with AES depth profiling. The segregation of S at the $Cu/Cu_3Sn$ interface lowered interface energy and thereby reduced the free energy barrier for the Kirkendall void nucleation. The drop impact test revealed that the electrodeposited Cu film with SPS degraded drastically with aging time. Fracture occurred at the $Cu/Cu_3Sn$ interface where a lot of voids existed. Therefore, voids occupied at the $Cu/Cu_3Sn$ interface are shown to seriously degrade drop reliability of solder joints.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.4
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1436-1440
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• 2007

Beryllium copper has been known to be an important material for the various fields of industry because it can be used for mechanical and electrical/electronic components that are subjected to elevated temperatures (up to $400^{\circ}C$ for short times). Blade type tip for probing the cells of liquid crystal display(LCD) was fabricated using beryllium copper foil. The dry film resist was employed as a mask for patterning of the blade type tip. The beryllium copper foil was etched using hydrochloric acidic iron-chloride solution. The concentration, temperature, and composition ratio of hydrochloric acidic iron-chloride solution affect the etching characteristics of beryllium copper foil. Nickel with the thickness of $3{\mu}m$ was electroplated on the patterned copper beryllium foil for enhancing its hardness, followed by electroplating gold for increasing its electrical conductivity. Finally, the dry film resist on the bridge was removed and half of the nickel was etched to complete the blade type tip.

• Journal of Powder Materials
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• v.24 no.5
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• pp.370-376
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• 2017

In this study we manufacture a Ni-Cr-B-Si +WC/12Co composite coating layer on a Cu base material using a laser cladding (LC) process, and investigate the microstructural and mechanical properties of the LC coating and Ni electroplating layers (reference material). The initial powder used for the LC coating layer is a powder feedstock with an average particle size of $125{\mu}m$. To identify the microstructural and mechanical properties, OM, SEM, XRD, room and high temperature hardness, and wear tests are implemented. Microstructural observation of the initial powder and LC coating layer confirm the layer is composed mainly of ${\gamma}-Ni$ phases and WC and $Cr_{23}C_6$ carbides. The measured hardness of the LC coating and Ni electroplating layers are 653 and 154 Hv, respectively. The hardness measurement from room up to high temperatures of $700^{\circ}C$ result in a hardness decrease as the temperature increases, but the hardness of the LC coating layer is higher for all temperature conditions. Room temperature wear results show that the wear loss of the LC coating layer is 1/12 of the wear level of the Ni electroplating layer. The measured bond strength is also greater in the LC coating than the Ni electroplating.

• Journal of Welding and Joining
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• v.10 no.3
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• pp.26-39
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• 1992

Diffusion bonding of Mo was performed by using the metallic coating of Cu and Cr on the surface to be bonded. Joint characteristics of Mo with or without coating layer were compared in metallurgical and fractograpical aspects. The results showed that the diffusion bonding with coating layer, especially with Cu coating, increased the bending strength of joint. Variation of heating cycle(elevation of temperature for a moment) did not affect significantly the mechanical properties of joint. Fractographical analysis showed that the fracture of joint bonded with Cr coating occurred at the coating layer, while that with Cu coating occurred at the base metal.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.372-376
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• 1999

The deposited Cu film on the ferrite magnet was more deposited comparing with that on the plastic magnet. The Cu film became thicker on the S pole comparing with that on the N pole in the both of magnets. The thickness and texture coefficient of deposited copper film affected with direction of line of magnetic force. The difference of pole had little or no effect to the texture coefficient of deposited nickel film. The reaction rate on ferrite magnet and S pole was faster comparing with that on plastic magnet and N pole.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.2-91.2
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• 2010

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. The better performance of Ni/Cu contacts is attributed to the reduced series resistance due to better contact conductivity of Ni with Si and subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading combined with the lower resistance of a metal silicide contact and improved conductivity of plated deposit. This improves the FF as the series resistance is deduced. This is very much required in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. This paper using selective emitter structure technique, fabricated Ni/Cu plating metallization cell with a cell efficiency of 17.19%.

• Korean Journal of Materials Research
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• v.26 no.12
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• pp.714-720
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• 2016

We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of as-deposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37 %, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.

• Journal of the Korean Vacuum Society
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• v.13 no.2
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• pp.72-78
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• 2004

Cu seed layers deposited by magnetron sputtering onto tantalum nitride barrier films were treated with ECR plasma and then the copper films were electroplated and rapid thermal annealed in an argon or nitrogen atmosphere at various temperatures ranging from 200 to $500^{\circ}C$. Changes in the microstructure and physical properties of the copper films electroplated on the hydrogen ECR plasma cleaned copper seed layers were investigated using X-ray diffraction (XRD), electron back-scattered diffraction (EBSD), and atomic force microscopy (AFM) analyses. It was found that the copper film undergoes complete recrystallization during annealing at a temperature higher than $400^{\circ}C$. The resistivity of the Cu film tends to decrease and the degree of (111) preferred orientation tends to increase as the annealing temperature increases. Theoptimum annealing condition for obtaining the film with the lowest resistivity, the smoothest surface and the highest degree of the (111) preferred orientation is rapid thermal annealing in a nitrogen atmosphere at $400^{\circ}C$ for 120 s. The resistivity and the surface roughness of the electroplated copper film annealed under this condition are 1.98 $\mu$O-cm and 17.77 nm, respectively.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.154-154
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• 2016

다공성 수지상 구리분말은 그 구조적 특성으로 인해 다양한 촉매 분야에 사용되어왔으며, 본 연구에서는 전해도 금욕의 종류에 따라 수지상 구리의 표면적 특성에 대해 연구하였다. 도금욕의 종류($CuSO_4$, $CuCl_2$, $Cu_2P_2O_7$), 인가 전위, 도금시간(1, 5, 10, 30min)에 따른 수지상 형상을 비교하였다. SEM 이미지 분석 결과 황산구리와 염화구리 도금용액에서는 plate-like dendrite 형상이 관찰되었으며, 피로인산구리 도금용액에서는 needle-like dendrite 형상이 관찰되었다. 정전위 실험결과 도금용액별 한계전류밀도에서 음(-)의 방향으로 100mV 낮은 지점의 인가 전위 및 도금시간 10분에서 3가지 용액 모두 가장 미세한 수지상 입자가 관찰되었다. 도금용액별 겉보기 밀도 및 BET 비표면적을 측정해본 결과 미세한 수지상일수록 겉보기밀도는 낮게 비표면적은 크게 측정되었다. 가장 낮은 겉보기 밀도와 가장 높은 BET 비표면적을 가지는 용액은 염화구리 도금용액이었으며 그 값은 $0.951g/cm^3$, $1.8052m^2/g$이었다.