• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1704-1706
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• 1999

$YBa_2Cu_3O_x$ superconducting thick film was fabricated by surface diffusion process of $Y_2BaCUO_5$ and the mixed compound of $(3BaCuO_2+2CuO)$ expected to be liquid phase above the peritectic temperature of YBa2Cu30x. For the surface diffusion. 3BaCu02+2CuO mixed with binder material was patterned on $Y_2BaCuO_5$ substrate by the screen printing method. The characteristic of current limit on thick film fabricated was measured. The thick film limited the current from $2.8213mA_{rms}$ to $4.2034mA_{rms}$ with $500{\Omega}$ load resistance, and from $4.1831mA{rms}$ to $4.2150mA_{rms}$ with $10{\Omega}$ load resistance.

• Journal of Environmental Science International
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• v.27 no.5
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• pp.299-308
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• 2018

The adsorption characteristics of Cu ions were studied using the zeolite Na-A synthesized from Jeju volcanic rocks. The effects of various operating parameters such as initial concentration of Cu ions, contact time, solution pH, and solution temperature were investigated in batch experiments. The adsorption of Cu ions by Na-A zeolite was fitted well by pseudo-second-order kinetics and the Langmuir isotherm model. The maximum adsorption capacity determined using the Langmuir isotherm model was 152.95 mg/g. In addition, the adsorption of Cu ions by zeolite Na-A was primarily controlled by particle diffusion model in comparison with the film diffusion model. As the temperature increased from 303 K to 323 K, ${\Delta}G^o$ decreased from -2.22 kJ/mol to -3.41 kJ/mol, indicating that the adsorption of Cu ions by Na-A zeolite is spontaneous process.

• Journal of Environmental Science International
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• v.25 no.11
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• pp.1485-1491
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• 2016

PSf/D2EHPA/CNT beads were prepared by immobilizing di-(2-ethylhexyl)-phosphoric acid (D2EHPA) and carbon nanotubes (CNT) on polysulfone (PSf) and used to remove Cu(II) from aqueous solutions. Optimum pH was in the range of 4 to 6. The removal kinetic of Cu(II) by the prepared PSf/D2EHPA/CNT beads was mainly governed by internal diffusion, and the diffusion coefficient of Cu(II) by PSf/D2EHPA/CNT beads was found to be $2.19{\times}10^{-4}{\sim}2.64{\times}10^{-4}cm^2/s$. The Langmuir isotherm model predicted the experimented data well. The maximum removal capacity of Cu(II) obtained from this isotherm was 7.32 mg/g. Calculated thermodynamic parameters such as ${\Delta}G^o$, ${\Delta}H^o$ and ${\Delta}S^o$ showed that the adsorption of Cu(II) ions onto PSf/D2EHPA/CNT beads was feasible, spontaneous and endothermic at 293-323 K.

• Journal of Korea Foundry Society
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• v.13 no.1
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• pp.42-49
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• 1993

Conventional manufacturing process for cast iron-babbitt metal composite is complicate and bimetallic bonding by centrifugal casting is also difficult because their melting point is largely different and nonmetallic inclusion exists on outer shell. This study is aiming to simplify multistage process by adding Cu-powder as insert metals during cast iron solidification. The variables on fabrication of composite pipe are mold rotating speed and inner surface temperature of outer metal. The optimum temperature range for fusion bonding between cast iron and Cu-layer was $1100^{\circ}C-1140^{\circ}C$ in case of mold rotating speed was 700rpm. When the inner surface of Cu-layer was at $900^{\circ}C$, the value of interfacial hardness between Cu-layer and babbitt metal were higher than Cu-matrix by forming diffusion layer, interfacial products between Cu-layer and babbitt metal are proved to be $Cu_6Sn_5({\eta})$by XRD.

• Transactions of Materials Processing
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• v.6 no.2
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• pp.136-144
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• 1997

(Ag-10%Ni)/Cu clad metals for electric contact switch were fabricated by cold-roll bonding process. 2 or 3 passes of cold-rolling was carried out for each process to investigate the effect of the rolling passes on the bonding property. The effect of the annealing temperature of copper before the cold-roll bonding on the bond strength was also studied. The specimen bonded with copper annealed below 30$0^{\circ}C$ before roll bonding showed good bond strength. This is because high stored energy in copper promoted the short range diffusion and the grain refinement of copper by the static recrystallization increased the degree of the interfacial coherency. The maximum peel strength of clad metals bonded with Cu annealed below 30$0^{\circ}C$ was 120N.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.98-98
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• 1999

• Journal of the Korean Magnetics Society
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• v.8 no.2
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• pp.79-85
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• 1998

The $[Ni_{80}Fe_{20}/Cu/Co/Cu]$ multilayers were grown by evaporation technique, and according to magnetic exchange coupling relation, magnetoresistance ratio and magnetization curve were studied by Co inserting $Ni_{80}Fe_{20}/Cu$ interface. Insertion of Co layer to the antiferromagnetically coupled system, i. e $t_{Cu} = 25\;{\AA}$, decrese the MR ratio contrary to previous reports. However the insertion to the ferromagneticalyl coupled $(t_{Cu} = 27\;{\AA})$ and the noncoupled $(t_{Cu} = 47\;{\AA})$ systems increase the ratio to 3.5 % and 6 % respectively. The results imply that the insertion change the magnetic exchange coupling state as well as the spin dependent scattering of conduction electrons. Besides, insertion of Co layer between Cu and $Ni_{80}Fe_{20}$ layer enhaces thermal stability to the 300 $^{\circ}C$, which indicates that insertion of Co has a role of the effective diffusion barrier.

• Korean Journal of Materials Research
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• v.8 no.3
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• pp.206-213
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• 1998

Cu, Ni, and Mo were ion-diffused into the pure steel powder in the aqueous solution of $(CuNO_3)_2$, $Ni(NO_3)_2)_2$, and $(NH_4)_6Mo_7O_{24}$, to form partial diffusion bond prealloyed steel powder. The mechanical properties, and compacting and sintering characteristics were investigated as a function of Cu. Ni and Mo contents. The results of the this research, it was found that the smallest change of size was observed, and the good degree of hardness and tensile strength was observed when 1.50wt%Cu, 1.75wt%Ni and 0.50wt%Mo was added each other. The powder metallurgy characteristics of partial diffusion bond prealloyed steel powder containing 1.50wt% of Cu, 1.75wt% of Ni and 0.5wt% of Mo were compared to those of distalloy $AB\textregistered$ which was manufactured in Hogani Corporation of Sweden. Partial diffusion bond prealloyed steel powder of this study had good degree of hardness and density, and its dimensional stability was same to that of pure steel powder. Under the same sintering density and temperature, the tensile strength of the ion powder from this research was $15~20Kg/\textrm{mm}^2$ larger than that of distalloy AB'. also the hardness was larger in the magnitude of Hv20-30. When the powder metallurgy heat-treated, hardness and tensile strength were substantially increased.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.86-87
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• 1992