• Title/Summary/Keyword: Cu circuit

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Performance Comparison of CuPc, Tetracene, Pentacene-based Photovoltaic Cells with PIN Structures

  • Hwang, Jong-Won;Kang, Yong-Su;Park, Seong-Hui;Lee, Hye-Hyun;Jo, Young-Ran;Choe, Young-Son
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.311-312
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    • 2010
  • The fabricated photovoltaic cells based on PIN heterojunctions, in this study, have a structure of ITO/poly(3, 4-ethylenedioxythiophene)-poly(styrenesulfonate)(PEDOT:PSS)/donor/donor:C60(10nm)/C60(35nm)/2, 9-dimethyl-4, 7-diphenyl-1, 10-phenanthroline(8nm)/Al(100nm). The thicknesses of an active layer(donor:C60), an electron transport layer(C60), and hole/exciton blocking layer(BCP) were fixed in the organic photovoltaic cells. We investigated the performance characteristics of the PIN organic photovoltaic cells with copper phthalocyanine(CuPc), tetracene and pentacene as a hole transport layer. Discussion on the photovoltaic cells with CuPc, tetracene and pentacene as a hole transport layer is focussed on the dependency of the power conversion efficiency on the deposition rate and thickness of hole transport layer. The device performance characteristics are elucidated from open-circuit-voltage(Voc), short-circuit-current(Jsc), fill factor(FF), and power conversion efficiency($\eta$). As the deposition rate of donor is reduced, the power conversion efficiency is enhanced by increased short-circuit-current(Jsc). The CuPc-based PIN photovoltaic cell has the limited dependency of power conversion efficiency on the thickness of hole transport layer because of relatively short exciton diffusion length. The photovoltaic cell using tetracene as a hole transport layer, which has relatively long diffusion length, has low efficiency. The maximum power conversion efficiencies of CuPc, tetracene, and pentacene-based photovoltaic cells with optimized deposition rate and thickness of hole transport layer have been achieved to 1.63%, 1.33% and 2.15%, respectively. The photovoltaic cell using pentacene as a hole transport layer showed the highest efficiency because of dramatically enhanced Jsc due to long diffusion length and strong thickness dependence.

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Photovoltaic Effects in CuPc/C60 and ZnPc/C60 Depending on the Organic Layer Thickness

  • Ahn, Joon-Ho;Lee, Joon-Ung;Lee, Won-Jae
    • Transactions on Electrical and Electronic Materials
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    • v.6 no.3
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    • pp.115-118
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    • 2005
  • Organic photovoltaic properties were studied in $CuPc/C_{60}$ and $ZnPc/C_{60}$ heterojunction structure by varying the organic layer thicknesses. Current density-voltage characteristics of organic photovoltaic cells were measured using Keithley 236 source-measure unit and a 500 W xenon lamp (ORIEL 66021) for a light source. From the analyses of current-voltage characteristics such as short-circuit current density, open-circuit voltage and power conversion efficiency, optimum thickness of the organic layer were obtained.

Flower like Buffer Layer to Improve Efficiency of Submicron-Thick CuIn1-xGaxSe2 Solar Cells

  • Park, Nae-Man;Cho, Dae-Hyung;Lee, Kyu-Seok
    • ETRI Journal
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    • v.37 no.6
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    • pp.1129-1134
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    • 2015
  • In this article, a study of a flower like nanostructured CdS buffer layer for improving the performance of a submicron-thick $CuIn_{1-x}Ga_xSe_2$ (CIGS) solar cell (SC) is presented. Both its synthesis and properties are discussed in detail. The surface reflectance of the device is dramatically decreased. SCs with flower like nanostructured CdS buffer layers enhance short-circuit current density, fill factor, and open-circuit voltage. These enhancements contribute to an increase in power conversion efficiency of about 55% on average compared to SCs that don't have a flower like nanostructured CdS buffer layer, despite them both having the same CIGS light absorbing layer.

A Study on Initial Strength of Sn-Pb Solder Joint (Sn-Pb 솔더 접합부의 초기 강도에 관한 연구)

  • 신영의;정승부
    • Journal of Welding and Joining
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    • v.14 no.3
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    • pp.86-92
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    • 1996
  • This paper presents the investigations on the initial strength and its variation of Sn-Pb solder joint using different lead frames, such as are 42 alloy lead and Cu alloy lead. As the result of the lack of initial strength at solder joints, whose pitch is from 0.3 to 0.4mm, short circuit often occured at the solder joint by thermal shock or external impact. Therefore, in this paper investigations were performed on the initial strength and its variation of Sn-Pb solder joint as well as fractured mode with using different lead frames.

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Melting and Refining of Cu Powder Scraped from Waste PCB with Fe2O3 (Fe2O3 첨가에 의한 폐PCB로부터 긁어낸 Cu분말의 용융 및 정제)

  • Heo, Su-Bin;Sohn, Ho-Sang
    • Resources Recycling
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    • v.26 no.4
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    • pp.95-100
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    • 2017
  • In this study, $Fe_2O_3$ was added as a flux to decrease melting temperature and refine during melting of Cu powder from scraped surface of the waste PCB (printed circuit board). The effect of $Fe_2O_3$ ratio to Cu powder and temperature on the recovery of Cu and content of impurities were investigated. It was found that the recovery of Cu was increased with increasing addition ratio of $Fe_2O_3$ and reaction temperature. The contents of O, Si and Fe in Cu phase were also decreased with increasing addition ratio of $Fe_2O_3$ and temperature. The formation of fayalite ($2FeO{\cdot}SiO_2$) and iron oxides phases in the slag was confirmed by XRD analysis after reaction with $Fe_2O_3$. Therefore, it was considered that the decrease of melting temperature and viscosity of slag by formation of fayalite slag contributed remarkably to the Cu recovery.

A study on the effects of compacting pressure on the electrical & sintering characteristics of Cu25Cr contact material (Cu25Cr 접점재료의 성형압력에 따른 소결 및 전기적 특성에 관한 연구)

  • 연영명;박홍태;오일성;이경행
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.1065-1068
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    • 2001
  • Effects of compacting pressure on the electrical and sintering characteristics of Cu25Cr contact material have been investigated. Cu25Cr contact materials were prepared by solid and liquid-phase sintering methods varying compacting pressure. Influence of compacting pressure on electrical characteristics were investigated in the cylindrical stainless-steel vessel using L-C resonant circuit. The physical and electrical properties of solid-phase sintered Cu25Cr material were found to be improved by increased compacting pressure. On the other hand, it was found that compacting pressure had little influence in case of liquid-phase sintered Cu25Cr material. After conditioning, contact resistance of Cu25Cr material was decreased regardless of compacting pressure. With increased compacting pressure, interrupting ability was shown to be increased.

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Photoelectric Properties of PbTe/CuPc Bilayer Thin Films (PbTe/CuPc 이층박막의 광전 특성)

  • Lee, Hea-Yeon;Kang, Young-Soo;Park, Jong-Man;Lee, Jong-Kyu;Jeong, Jung-Hyun
    • Journal of Sensor Science and Technology
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    • v.7 no.1
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    • pp.67-72
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    • 1998
  • The crystallized CuPc and PbTe films are formed by thermal evaporation and pulsed ArF excimer laser ablation. Structural and electrical properties of thin film is observed by XRD and current-voltage(I-V) curves. From XRD analysis, both PbTe and CuPc thin films show a-axis oriented structure. For the measurement of photovoltaic effect, the transverse current-voltage curve of CuPc/Si, PbTe/Si and PbTe/CuPc/Si junctions have been analyzed in the dark and under illumination. The PbTe/CuPc/Si junction exthibits a strong photovoltaic characteristics with short circuit current($J_{sc}$) of $25.46\;mA/cm^{2}$ and open-circuit voltage($V_{oc}$) of 170 mV. Quantum efficiency and power conversion efficiency are calculated to be 15.4% and $3.46{\times}10^{-2}$, respectively. Based on the results of QE and ${\eta}$, the photocurrent process of PbTe/CuPc/Si junction can be explained as following three effective steps; photocarrier generation in the CuPc layer, carrier separation at PbTe/CuPc interface, and finally a transportation of electrons through the PbTe layer.

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Investigation of New Ionized Cluster Beam Source (새로운 이온화된 클라스터 빔원의 제작과 특성 조사)

  • ;;;;S.G.Kondrnine;E.A. Krallkina
    • Journal of the Korean Vacuum Society
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    • v.5 no.3
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    • pp.251-257
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    • 1996
  • The present paper represents the results of development and first experimental tests of a new ionized cluster beam (ICB) source. The novelty of ICB source lies in the fact that the crucible and ionization parts are spaced in one cylindrical shell but are not divided in an electric circuit. The ICB source adapts permanent magnets to increase the ionization efficiency. The maximum obtained $Cu^+$ ion current denisity is $1.5{\mu}A/\textrm{cm}^2$, therewith the ionization rate amounts 3% under deposition rate is 0.2$\AA$/s and the acceleration voltage is 4 kV, the $Cu^+$ ion beam uniformity is better than 95%.

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Fabrication and Characteristics of $n-CdS_{0.69}Se_{0.31}/p-Cu_{2-x}S_{0.69}Se_{0.31}$ Heterojunction Solar Cell ($n-CdS_{0.69}Se_{0.31}/p-Cu_{2-x}S_{0.69}Se_{0.31}$ Heterojunction 태양전지의 제작과 특성)

  • Baek, Seung-Nam;Hong, Kwang-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.04b
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    • pp.51-55
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    • 2004
  • $CdS_{0.69}Se_{0.31}$ single crystal grown by sublimation method. Hall effect measurement were carried out by the Van der Pauw method. The measurement values under the temperature were found to be carrier density $n=1.95{\times}10^{23}m^{-3}$, Hall coeffcient $RH=3.21{\times}10^{-5}m^3/c$, conductivity ${\sigma}=362.41{\Omega}^{-1}m^{-1}$, and Hall mobility ${\mu}=1.16{\times}10^{-2}m^2/v.s.$ Heterojunction solar cells of $n-CdS_{0.69}Se_{0.31}/p-Cu_{2-x}S_{0.69}Se_{0.31}$ were fabricated by the substitution reaction. The open-circuit voltage, short-circuit currint density, fill factor and power conversion efficiency of $n-CdS_{0.69}Se_{0.31}/p-Cu_{2-x}S_{0.69}Se_{0.31}$ heterojunction solar cell under $80mW/cm^2$ illumination were found to be 0.41V, $19.5mA/cm^2$, 0.75 and 9.99%, respectivity.

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Optimal pressure and temperature for Cu-Cu direct bonding in three-dimensional packaging of stacked integrated circuits

  • Seunghyun Yum;June Won Hyun
    • Journal of the Korean institute of surface engineering
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    • v.56 no.3
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    • pp.180-184
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    • 2023
  • Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm2. Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.