• Title/Summary/Keyword: Cu and Sn

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Microstructure and Tensile Strength Property of Arc Brazed DP steel using Cu-Sn Insert Metal (Cu-Sn 삽입금속을 이용한 DP강의 아크 브레이징 접합부의 미세조직과 인장특성)

  • Cho, Wook-Je;Cho, Young-Ho;Yun, Jung-Gil;Kang, Chung-Yun
    • Journal of Welding and Joining
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    • v.31 no.1
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    • pp.58-64
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    • 2013

  • The following results were obtained, microstructures and tensile properties in arc brazed joints of DP(dual phase) steel using Cu-5.3wt%Sn insert metal was investigated as function of brazing current. 1) The Fusion Zone was composed of ${\alpha}Fe+{\gamma}Cu$ and Cu23Sn2. The reason for the formation of these solid solutions. Despite, Fe & Cu were impossible to solid solution at room temperature. It's melting & reaction to something of insert metal & Base Metal (DP Steel) by Arc. Brazing Process has faster cooling rate then Cast Process, Supersaturated solid solution at room temperature. 2) The increase Hardness of Fusion Zone was directly proportional to the rise of welding current. Because, ${\alpha}Fe+{\gamma}Cu$ phase (higher hardness than the Cu23Sn2.(104.1Hv < 271.9Hv)) Volume fraction was Growth, due to increasing the amount of base metal melting by High current. 3) The results of tensile shear test by Brazing, All specimens happen to fracture in Fusion Zone. On the other hand, when Brazing Current increasing tend to rise tensile load. but it was very small, about 26-30% of the base metal. 4) The result of fracture analysis, The crack initiate at Triple Point for meet to Upper B.M/Under B.M/Fusion Zone. This Crack propagated to Fusion zone. So ruptured by tensile strength. The Reason to in the fusion zone fracture, Fusion zone by Brazing of hardness (strength) was very lower then the base metal (DP steel). In addition the Fusion Zone's thickness in triple point was thin than the base metal's thickness in triple point.

  • https://doi.org/10.5781/KWJS.2013.31.1.58 인용 PDF KSCI

Effect of under-bump-metallization structure on electromigration of Sn-Ag solder joints

  • Chen, Hsiao-Yun;Ku, Min-Feng;Chen, Chih
    • Advances in materials Research
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    • v.1 no.1
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    • pp.83-92
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    • 2012

  • The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

  • https://doi.org/10.12989/amr.2012.1.1.083 인용 KSCI

A Study of Analytical Method for Trace Metal Ions in Whole Blood and Urine by Inductively Coupled Plasma-Mass Spectrometry using Solid-Liquid Extraction Technique (유도결합 플라스마-질량분석법과 고체-액체 추출법을 이용한 혈액 및 소변중 미량금속의 분석에 관한 연구)

  • Lee, Won;Hur, Young-Hoe;Park, Kyung-Su
    • Analytical Science and Technology
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    • v.11 no.4
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    • pp.281-291
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    • 1998

  • An analytical method for the simultaneous measurement of trace Cu, Sn, and Bi in blood and urine has been investigated by Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). Microwave oven was used for the pretreatment of blood samples using nitric acid and hydrogen peroxide in a closedvessel digestion system with 1 mL whole blood for 8 minutes. Amberlite IRC-718 resin was used as a solid phase in solid-liquid extraction technique for the removal of matrix interferences such as Na, S, P, and other polyatomic ion species. Detection limits for Cu, Sn, and Bi by this method were 0.000375 ng/mL, 0.000297 ng/mL, and 0.000174 ng/mL, respectively. Recoveries of 99.1% for Cu, 102.5% for Sn, and 98.4% for Bi were obtained for the standard spiked NIST SRM 955a blood sample. The developed method was applied for whole real blood and urine samples.

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