• Journal of Welding and Joining
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• 제15권4호
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• pp.136-142
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• 1997

In this study, the amorphous foil filler, thickness of 20 - $20~30\mu\textrm{m}$ was made to develop Cu-7.5wt%Mn-7.5wt%Si insert alloy(melting point temperature : solidus line 1003K, liquidus line 1070K). Liquid phase diffusion bonding of 304 stainless steels (STS304), is carried out successfully by using developed Cu-7.5Mn-7.5Si insert alloy. Bonding conditions are taken from bonding pressure of 5MPa, bonding temperatures from 1073K to 1423K varied within 50K and brazing holding times of 0, 30, 60 and 240 minutes. As the results, the tensile strength in the liquid phase diffusion bonding is a little bit lower than that in the solid phase diffusion bonding. The authors find out that the liquid phase diffusion bonding needs lower bonding pressure than the others. Therefore, the liquid phase diffusion bonding had an excellent brazability in which the bonding process showed the typical mechanism of diffusion bonding. In corresponding, the new developed insert alloy of low melting pointed Cu-7.5Mn-7.5Si makes possible brazing between the STS304.

• 한국정밀공학회지
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• 제26권7호
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• 소성∙가공
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• 제10권7호
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• pp.565-572
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• 2001

It is well known that a multicomponent $Zr_{4l.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ bulk metallic glass alloy shows good bulk glass forming ability due to its high resistance to crystallization in the undercooled liquid state. DSC and XRD have been performed to confirm the amorphous structure of the master alloy. To investigate the mechanical properties and deformation behavior of the bulk metallic $Zr_{4l.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy, a series of compression tests has been carried out at the temperatures ranging from $351^{\circ}C$ to $461^{\circ}C$at the various initial strain rates from $2{\times}10^4s^1$ to $2{\times}10^2s^1$. Three types of nominal stress-strain curves have been identified such as linear stress-strain relationship meaning fracture at maximum stress, plastic deformation including stress overshoot and steady-state flow, plastic deformation without stress overshoot depending on the strain rate and test temperature. Also DSC analysis for the compressed specimens was carried out to investigate the change of structure, thermal stability and crystallization behavior for the various test conditions.

• 한국재료학회지
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• 제13권6호
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• pp.352-359
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• 2003

In order to control the grain size, the spark plasma sintering technique is applied for the manufacturing of Cu-26.7Al-4.05AI(wt.%) shape memory alloy with pure Cu, Zn, and Al element powders. The sintering processes were carried out under different atmospheres. The sintered bodies were denser under Ar or Ar＋4%$H_2$gas atmosphere than under vacuum. With use of small-sized powders, a very small average grain size of 2∼3 $\mu\textrm{m}$ was obtained, but the single phase was not formed. With the large-sized powders the single austenitic phase was observed with the average grain size of $70∼72\mu\textrm{m}$. When the different size of raw powders was mixed, it is confirmed that the average grain size of the manufactured alloys was 15 $\mu\textrm{m}$ with single austenitic phase, but the distribution of grain size was not uniform.

• 열처리공학회지
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• 제3권2호
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• pp.1-9
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• 1990

Since the reverse shape memory effect(RSME) was reported in a CuZnAl alloy, further study has been done on the mechanism of this phenomenon and reported that it occurs by the bainitic transformation. But the present authors revealed in the previous work that the RSME in a B2 CuZnAl alloy is not caused by the shear process involved in the bainitic transformation and also that the RSME takes place as the remaining ${\alpha}^{\prime}{_2}$ phase, which is two-step transformed strain induced martensite, is newly transformed into ${\alpha}$ phase. In order to provide further evidence in supporting the facts, thus, more detailed investigations have been carried out in a $DO_3$ CuZnAl alloy.

• 열처리공학회지
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• 제33권6호
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• pp.277-283
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• 2020

Cu-Co-Si based alloy has a strengthening mechanism for Co₂Si intermetallic compounds deposited on the copper matrix after aging treatment and the solution treatment has a key influence on the strength and electrical conductivity of the final products. In this paper, the Cu-1.6%Co-0.38%Si alloy was fixed at the time and the solution treatment temperature was set at a temperature in the range of 800 to 950℃, and the change in mechanical properties was observed by fixing the temperature at 950℃ and changing the time. The microstructure was observed using an electron microscope and an optical microscope, and the changes in hardness, electrical conductivity, and bending workability after aging treatment were investigated. When the solution treatment time is less than 20 seconds, the solution treatment is not sufficient and the formation of precipitates contributing to the increase in hardness decreases and the hardness decreases after the aging treatment, and in more than 50 seconds, the hardness decreases due to the coarsening of the grains and the bending workability got worse.

• 소성∙가공
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• 제32권1호
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• pp.35-40
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• 2023

In the case of a wire with a very fine diameter during the multi-stage drawing process, the heterogeneity of the deformation in the radial direction tends to develop strongly as the amount of deformation is accumulated. It is known that the heterogeneity of deformation in the radial direction of the wire is closely related to the process parameters during the multi-stage drawing process. In this study, finite element analysis (FEA) was used to theoretically examine the effect of friction between the surface of the wire and the drawing die during the multi-stage drawing process of Cu-0.2wt%Mg alloy on the deformation heterogeneity developed in the radial direction of the wire. The distribution of effective strain, radial strain, circumferential strain, and shear strain developed in the radial direction of the wire during the multi-stage drawing process was analyzed while changing the friction coefficient, and the results were analyzed and compared for each path and position. The FEA results revealed that the shear strain developed in the radial direction of the wire during the multi-stage drawing process of Cu-0.2wt%Mg alloy showed the most non-uniform distribution and was also severely affected by the friction coefficient.

• 한국재료학회지
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• 제15권11호
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• pp.697-704
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• 2005

The deformation behavior of a bulk amorphous and crystallized amorphous $Zr_{22.5}Ti_{14}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy extracted from a commercial golf club head was characterized at room temperature ana $300^{\circ}C$. At room temperature, amorphous specimens revealed higher yield stress and ductility than partially crystallized alloy specimens. Amorphous alloy displayed some plasticity before fracture, which resulted from strain hardening and repeated crack initiation and propagation. The fracture is mainly localized on one major shear band, and the compressive fracture angle of the amorphous specimen between the stress axis and the fracture plane was about $40^{\circ}$ Scanning electron microscope observations revealed mainly a vein-like structure in the amorphous alloy But the fracture surface of partially crystallized amorphous alloy consisted of vein-like and featureless fracture structure. The partially crystallized alloy extracted from the thick part of the club fractured in the elastic region, at a much lower stress level than the amorphous, suggesting that relatively coarse crystal particles formed during cooling cause the brittle fracture.

• 대한치과기공학회지
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• 제24권1호
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• pp.65-71
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• 2002

This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker's hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

• 대한치과기공학회지
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• 제19권1호
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• pp.21-35
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• 1997

Au 함량이 20% 미만인 Au-Ag-Pd합금의 기초합금인 Ag-Pd-Cu 3원계 합금의 시효경화 특성을 규명할 목적으로 20wt% Pd 및 20wt% Cu의 용질농도구성비가 1이 되는 3원 합금과 여기에 2wt% Au의 첨가합금에 미치는 석출상의 영향을 분석, 조사하여 아래와 같은 결론을 얻었다. Ag-20wt% Pd-20wt% Cu 3원 함금은 ${\alpha}$의 단일상에서 Ag-rich의 ${\alpha}2$상 및 PdCu규칙상에 의하여 경화반응이 진행되며 연속승온과정에서 $100{\sim}300^{\circ}C$의 경도증가와 $300{\sim}500^{\circ}C$의 경도감소의 2단계 경화특성이 얻어졌다. 연속승온시효과정은 Au첨가에 관계없이 2단계의 석출반응이 저온영역에서는 stage I, stage II로 나타나고 stage I은 고온에서의 소입에 의해 도입된 과잉공공의 이동 및 소멸에 의한 반응이고 stage II는 평형농도의 공공확산에 의한 반응에 대응하였다. 또한 본 합금의 시효석출과정은 ${\alpha}\to{\alpha}+{\alpha}2+PdCu\to{\alpha}_1+{\alpha}_2+PdCu$이고 최대 경화는 ${\alpha}_1,\;{\alpha}_2$, PdCu의 3상공존구역에서 나타났다. 이들 석출반응은 입계반응이고 반응의 진행과 함께 경도값은 상승하며 경화능에 직접적으로 기여하였다. 또한 석출상은 미세한 lamella조직의 nodule을 나타내고 이들 ${\alpha}_1,\;{\alpha}_2$ 및 PdCu상과의 미세한 혼합상의 형성이 시효경화능에 기여하는 주된 원인이 되었다. 과시효는 lamella의 조대화와 PdCu상의 ${\alpha}_2$상으로의 용해에 따른 정량적 감소에 대응하였다. 본 합금의 시효열처리 온도는 $450^{\circ}C$가 적절하며 $1{\sim}120min$ 시효시간에 걸쳐서 소정의 경화특성을 얻을 수 있었다.