• 마이크로전자및패키징학회지
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• 제15권1호
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• pp.33-37
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• 2008

Kirkendall void는 전해도금 Cu/Sn-Ag 솔더 접합부에서 형성되었으며 Cu 도금욕에 함유되는 첨가제에 의존한다. 첨가제로 사용된 SPS의 함량의 증가와 함께 $150^{\circ}C$에서 열처리 후 많은 양의 Kirkendall void가 $Cu/Cu_3Sn$ 계면에 존재하였다. AES 분석은 void 표면에 S가 편석되어 있음을 보여주었다. $Cu/Cu_3Sn$ 계면을 따라 파괴된 시편에서 Cu, Sn, S peak만 검출되었고 AES 깊이 프로파일에서 S는 급격하게 감소하였다. $Cu/Cu_3Sn$ 계면에서 S 편석은 계면에너지를 낮추고 Kirkendall void 핵생성을 위한 에너지장벽을 감소시킨다. 낙하충격시험은 SPS를 사용하여 도금된 Cu의 경우 Kirkendall void가 형성된 $Cu/Cu_3Sn$ 계면에서 파괴가 진행되고 급격하게 신뢰성이 감소됨을 보였다.

• 한국자기학회지
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• 제13권3호
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• pp.121-126
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• 2003

(N $i_{0.2}$C $u_{0.2}$Z $n_{0.6}$)$_{1.085}$(F $e_2$ $O_3$)$_{0.915}$의 기본 조성에 첨가제 Sn $O_2$, CaO 첨가량과 ferrite의 공정을 변화시켜 시편의 전자기적 특성 및 미세구조를 조사하였다. 첨가제에 따른 입자크기의 변화는 거의 없었다. (N $i_{0.2}$C $u_{0.2}$Z $n_{0.6}$)$_{1.085}$(F $e_2$ $O_3$)$_{0.915}$을 소결시 1300 $^{\circ}C$에서 소결하는 것보다 1150 $^{\circ}C$에서 소결한 소결체의 손실이 더욱 적었다. CaO만 첨가할 때 0.2 wt%가 소결밀도를 크게하여 손실을 줄여주는 첨가제로 사용 가능함을 확인하였다 Sn $O_2$차 Ca $O_2$함께 첨가시 SnO2$_2$ 0.06 wt%, CaO 0.4 wt%가 손실을 크게 줄여 주는 것으로 조사되었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.191-191
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• 2015

반도체 소자 성능 향상을 위한 3차원 TSV배선 공정이 연구되었다. 전기도금을 이용한 TSV 공정 시 기존에는 황산 구리 수용액내에 억제제, 가속제, 평탄제등을 첨가한 복잡한 전해질이 사용되었지만 본 연구에서는 억제제만을 이용하여 Cu bottom-up filling에 성공하여 전해질의 조성을 단순화 시켰다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.2028-2030
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• 2005

The electrical conductivity of manganese oxide and complex manganese oxide produced by anodic deposition method was measured. The additive transition metal is Cu, Co and Fe. The transition metals like as Cu, Co and Fe improved electrical conductivity of complex manganese oxide compared with manganese oxide. This is coincide with the results of molecular orbital calculation by DV-Xa.

• Journal of Magnetics
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• 제10권3호
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• pp.118-121
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• 2005

We have investigated the magnetic properties of electroplated thin Cu/Co multilayers by using electrolytes made of copper sulphate and cobalt sulphate and by applying alternating plating voltage. While the multilayers plated with pure electrolyte showed superparamagnetism, those plated with organic additives showed ferromagnetic behavior. These changes are attributed to the so-called 'self-annealing' effect and reduction of grain size caused by the organic additives.

• 한국표면공학회지
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• 제27권5호
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권4호
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• pp.210-218
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• 2000

For the fabrication of $YBa_2Cu_3O_x$ thick film, a substrate of $Y_2BaCuO_5$ was fabricated by adding $CeO_2$ into $Y_2BaCuO_5$ and two types of doping materials added with binder material were prepared. Each doping material was patterned on $Y_2BaCuO_5$substrate by the screen printing method and then was annealed at the temperature with a few step. It could be observed by X-ray diffraction patterns and SEM photographs that through the diffusion process of the $Y_2BaCuO_5$ and each doping material, the $YBa_2Cu_3O_x$ phase was formed. And with n additive of $CeO_2$ the thickness of formed $YBa_2Cu_3O_x$decreased. From the experiment of current limiting on thick film, the sample with thiner thickness of $YBa_2Cu_3O_x$ showed the more effective characteristics of current limiting.

• Tribology and Lubricants
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• 제23권2호
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• pp.66-72
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• 2007

[ $MoS_2$ ], is a well-known metal sulfide applied as solid lubricants and an additive to prolong the life of sintered bearings under severe conditions. However, the high price of $MoS_2$ limited its wide application. This study is aimed to investigate the possibility far application to solid lubricants for $Cu_2S$ as a substitute of $MoS_2$. Bronzes added $Cu_2S$ and $MoS_2$, are produced by powder metallurgy in this study, and then evaluated their friction and wear properties., as well as sintered bronze. The sliding wear test using pin-on-disc type machine, was conducted at several sliding speeds for three type test pieces sintered bronzes added $Cu_2S$ and $MoS_2$, and sintered bronze without lubricants. Addition of $Cu_2S$ to bronze leads to relatively good friction properties, although it is not so good as addition of $MoS_2$. However, the wear properies of sintered bronze added $Cu_2S$ are better than that of sintered bronze added $MoS_2$.

• 한국분말재료학회지
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• 제1권1호
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• pp.79-84
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• 1994

The mechanism of activated sintering of tungsten powder was discussed in terms of diffusion and segregation of activator atoms at W grain boundaries. Shrinkage behaviours of W-0.2wt.% Ni, W-0.2wt.% Cu or pure W powder compacts during sintering at low temperatures of 900~ $1200^{\circ}C$ were investigated. It was found that the Cu additive inhibits sintering process causing lower densification than pure W compact while remarkable shrinkage occurred in the Ni added W powder. Such contrary effect was explained by comparing self diffusion processes along Ni or Cu segregated W boundaries in which Ni segregants enhance but Cu atoms retard the migration of W atoms at W boundaries.

• Bulletin of the Korean Chemical Society
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• 제13권3호
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• pp.280-285
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• 1992

Enantiomeric separation of free amino acids has been achieved by a reversed phase liquid chromatography with addition of a Cu(Ⅱ) complex of N-alkyl-L-proline (alkyl: propyl, pentyl or octyl) to the mobile phase. The amino acids eluted were detected by a postcolumn OPA system. N-alkyl-L-proline was prepared and used as a chiral ligand of Cu(Ⅱ) chelate for the enantiomeric separation. The concentration of the Cu(Ⅱ) chelate, the organic modifier and pH affect the enantiomeric separation of free amino acids. The retention behaviour, varied with change in pH and the concentration of the Cu(Ⅱ) chelate, was different compared with those of the derivatized amino acids. The elution orders between D- and L-forms were consistent except histidine showing that L-forms elute earlier than D-forms. The retention mechanism for the enantiomeric separation can be illustrated by the stereospecificity of the ligand exchange reaction and the hydrophobic interaction between the substituent of amino acids and reversed phase, $C_18$.