• Journal of Biosystems Engineering
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• 제17권1호
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• pp.79-90
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• 1992

Viscoelastic characteristics of agricultural products may be determined through three basic tests ; stress relaxation, creep, and dynamic test. Considering the changeability of living materials, dynamic test in which information is derived in a relatively short time appears to be highly desirable, in which either cyclic stress or cyclic strain is imposed and the remaining quantity (strain or stress) is measured. The periodically varying stress will also result in periodically varying strain which in a viscoelastic material should theoretically be out of phase with the stress, because part of the energy subjected to sample is stored in the material as potential energy and part is dissipated as heat. This behavior results in a complex frequency-dependent compliance denoted by J($i{\omega}$). The complex compliance and therefore the storage compliance, the loss compliance, the phase angle, and percent energy loss for the sample should be obtainable with a given static viscoelastic property of the material under static load. The complex compliance of the rough rice kernel were computed from the Burger's model describing creep behavior of the material which were obtained in the previous study. Also, the effects of cyclic load and moisture content of grain on the dynamic viscoelastic behavior of the samples were analyized. The results obtained from this study were summarized as follows ; 1. The storage compliance of the rough rice kernel slightly decreased with the frequency applied but at above the frequency of 0.1 Hz it was nearly constant with the frequency, and the loss compliance of the sample very rapidly decreased with increase in the frequency on those frequency ranges. 2. It was shown that the storage compliance and the loss compliance of the sample increased with increase in grain moisture content. Effect of grain moisture content on the storage compliance of the sample was highly significant than effect of the frequency applied, but effect of the frequency on the loss compliance of the sample was more significant than effect of grain moisture content. 3. In low moisture content, the percent energy loss of Japonica-type rough rice was much higher than that of Indica-type rough rice, but, in high moisture content, vice versa.

• Animal Bioscience
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• 제35권10호
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• pp.1524-1534
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• 2022

Objective: The objective was to test if creep feeding (CF) improves the average daily gain (ADG) and weaning weight of calves submitted to temporary weaning (TW) and if the combination of CF and TW improves conception and pregnancy rates of cows. Methods: Primiparous (n = 74) and primiparous and multiparous (n = 104) cows grazing native grasslands were used in experiment 1 and 2; respectively. The experimental design was in plots divided into complete random blocks with two replications. The CF was the big plot and TW the small plot, thus four experimental groups were formed: i) -CF-TW (n = 21 and 27); ii) -CF+TW (n = 16 and 24); iii) +CF-TW (n = 20 and 26); iv) +CF+TW (n = 17 and 27) with cow-calf pairs for experiments 1 and 2; respectively. Nose plate application for TW had a duration of 14 and 15 days for experiment 1 and 2: respectively. In experiment 1, calves were fed at 1% of live weight for 112 days using a commercial supplement with 18.4% crude protein. In experiment 2, the supplementation lasted 98 days, and was carried out with corn dried distillers grains with soluble (DDGS) at 40% of the potential intake on a daily basis. Results: The TW reduced ADG during the TW period and the following 14 days, but the negative effect of TW was maintained until the final weaning only in experiment 2. The CF increased ADG during TW period in both experiments. The TW promoted an earlier conception of the dams (12 days in -CF treatment and 19 days in +CF treatment, p<0.01) and CF increased pregnancy rate in experiment 1, being the effects not consistent between experiments. Conclusion: The CF consistently promoted an increase in ADG during the period of TW and increased final weaning weight of calves, therefore it is economically viable.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2003년도 봄 학술발표회 논문집
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• pp.463-468
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• 2003

A finite element formulation to predict the flexural behavior of composite girder is presented in which the early-age properties of concrete are specified including maturing of elastic modulus, creep and shrinkage. The time dependent constitutive relation accounting for the early-age concrete properties is derived in an incremental format by expanding the total form of stress-strain relation by the first order Taylor series with respect to the reference time. The total potential energy of the flexural composite member is minimized to derive the time dependent finite element equilibrium equation. Numerical applications are made for the 3-span double composite steel box girders which is a composite bridge girder filled with concrete at the bottom of the steel box in the negative moment region. The numerical analysis with considering the variation of concrete elastic modulus are performed to investigate the effect of it on the early-age behavior of composite structures. The one dimensional finite element analysis results are compared with the analytical method based on the sectional analysis. Close agreement is observed among the two methods.

• 접착 및 계면
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• 제21권1호
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• pp.6-13
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• 2020

The objective of the current study is to characterize the long-term stability and efficacy of a structural adhesive assembly under static load. An apparatus was designed to be used in the Instron tensile test machine that would allow for real time modeling of the failure characteristics of an assembly utilizing a moisture- cure adhesive which was bonded to concrete. A regression model was developed that followed a linear - natural log function which was used to predict the expected life of the assembly. Evaluations at different curing times confirmed the structure was more robust with longer cure durations prior to loading. Finally, the results show that under the conditions the assembly was tested, there was only a small amount of inelastic creep and the regression models demonstrated the potential for a stable structure lasting several decades.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.47-52
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• 2005

전세계 전자패키지 산업에서 납(Pb) 사용에 대한 환경규제 움직임이 본격화되고 있어 새로운 무연솔더의 개발이 활발히 이루어지고 있다. 게다가 무연솔더의 신뢰성에 대한정보가 아직까지 많이 부족한 실정이다 무연솔더의 신뢰성에 영향을 줄수 있는 것 중의 하나가 Sn pest라고 알려진 동소체 변태이다. Sn pest가 형성될 때 동반되는 부피의 증가는 솔더 조인트의 신뢰성을 저하시킨다. 이미 보고된 바에 따르면, Sn 고용도가 있는 원소(Pb, Bi, Sb)들을 첨가시킬 경우 Sn pest가 효과적으로 억제된다. 그러나 Sn pest를 억제하는 합금에 대한 기계적인 특성에 연구가 거의 이루어지지 않았다. 본 연구에서는 Sn과 Sn-0.7Cu를 기반으로 하여 Bi, Sb을 첨가한 솔더 합금을 사용하여 lap shear크리프 실험을 하였다. 본 연구에서 사용한 합금들의 변형율은 전체적으로 Sn-3.5Ag를 기반으로 하는 합금들보다 높았다. 파괴까지 이르는 변형량은 Sn-0.5Bi가 가장 크고 Sn-0.7Cu-0.5Sb 합금이 가장 작았는데 이러한 경향은 Sn-0.5Bi 합금의 파단면에 Sn globules이 길게 늘어나 있고 Sn-0.7Cu-0.5Sb 합금에서는 더 짧은 Sn globules 이 관찰되는 결과와 일치하였다.

• Design & Manufacturing
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• 제12권1호
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• pp.1-6
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• 2018

In this study, we calculated the redistribution of vacancy concentration in metal specimens induced by stress-induced diffusion at a high temperature. To deduce the governing equation, we associated the unit volume change equation of strains with a differential equation of vacancy concentration as a function of stress using the stress-strain relationship. In this governing equation, we considered stress as the only chemical potential parameter to stay in the scope of this study, which provided the vacancy concentration equation as of stress gradient in metals. The equation was then mathematically delineated to derive a analytical solution for a transient, one-dimensional diffusion case. With the help of Korhonen's approximation and the boundary conditions, we successfully deduced a general solution from the governing equation. To visualize the feasibility of our solutions, we applied the solution to two different stress-induced cases - a rod with fixed concentrated stresses at both ends and a rod with varying concentrated stresses at both ends. Although it is necessary to legitimatized the model in the future for improvement, our results showed that the model can be used to interpret the location of structural defects, the formation of vacancy, and furthermore the high temperature behavior of metals.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2003년도 봄 학술발표회 논문집
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• pp.257-264
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• 2003

Tunnelling in water bearing soils influences the ground water regime. It has been indicated in the literature that the existence of ground water above a tunnel influences tunnel stability and the settlement profile. Only limited research, however, has been done on ground water movements around tunnels and their influence on tunnel performance. Time dependent soil behaviour can be caused by the changes of pore water pressure and/or the viscous properties of soil(creep) under the stress change resulting from the advance of the tunnel face. De Moor(1989) demonstrated that the time dependent deformations due to tunnelling are mainly the results of pore pressure dissipation and should be interpreted in terms of effective stress changes. Drainage into tunnels is governed by the permeability of the soil, the length of the drainage path and the hydraulic boundary conditions. The potential effect of lime dependent settlement in a shallow tunnel is likely to occur rapidly due to the short drainage path and possibly high coefficient of consolidation. Existing 2D modelling methods are not applicable to these tunnelling problems, as it is difficult to define empirical parameters. In this paper the time-based 2D modelling method is adopted to account for the three dimensional effect and time dependent behaviour during tunnel construction. The effect of coupling between the unloading procedure and consolidation during excavation is profoundly investigated with the method. It is pointed out that realistic modelling can be achieved by defining a proper permeability at the excavation boundary and prescribing appropriate time for excavation Some guidelines for the numerical modelling of drained and undrained excavation has been suggested using characteristic time factor. It is highlighted that certain range of the factor shows combined effect between the unloading procedure due to excavation and consolidation during construction.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국건설순환자원학회논문집
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• 제2권3호
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• pp.239-246
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• 2014

온실가스 저감 및 자원활용 목적으로 고로슬래그 미분말을 다량으로 활용한 콘크리트에 대한 연구가 활발히 진행되고 있으나, 조기강도 및 내구성능 확보에 어려움이 있다. 따라서, 본 연구에서는 무수석고 함량(0%, 4%, 6%, 8%, 10%)에 따라 고로슬래그 미분말을 대량 활용한 콘크리트의 수화, 강도발현, 크리프, 탄산화, 건조수축 특성을 분석하였다. 무수석고를 바인더의 4~6% 수준으로 치환할 경우 고로슬래그 미분말 대량 활용 콘크리트의 가장 취약점인 초기강도 발현을 보완할 수 있으며, 내구성 측면에서도 보통 포틀랜드 시멘트를 사용한 콘크리트와 유사한 성능을 발현하는 것을 알 수 있었다. 반면, 무수석고를 8% 이상 활용할 경우 초기강도 증진 효과가 미흡한 결과를 나타냈다.