• Journal of the Korean Ceramic Society
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• v.36 no.7
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• pp.718-724
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• 1999

Densification and grain growth behavior of bimodal size distributed alumina powder mixtures were investigated as a function of amount of coarse alumina powder. The specimens which contained coarse alumina powder for 60to 80wt% showed the highest green density. The amount of shrinkage of sintered specimen lineraly decreased with the increase of coarse alumina powder up to the content that showed the highest green density and then further addition of coarse alumina powder led to drastic decrease of shrinkage of specimen. Especially crack-like void were concurrently revealed in the sintered body with addition of coarse alumina powder above 60wt% When the sintering temperature increased up to 1650$^{\circ}C$ the amount of shrinkage of specimen linearly decreased and the grain growth were also retarded with increase of coarse lauminia powder.

• Journal of the Korean Society for Precision Engineering
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• v.3 no.1
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• pp.40-49
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• 1986

Crack, craze and void are common defects which may be found in the bulk of polymeric materials such as either themoplastics or thermosets. The healing phenomena, autohesion, of these defects are known to be a intrinsic material property of various polymeric materials. However, only a few experimental and theoretical investigations on crack, void and craze healing phenomena for various polymeric materials have been reported up to date [1, 2, 3]. This may be partly due to the complications of healing processes and lacking of appropriate theoretical developments. Recently, some investigators have been urged to study the healing phenomena of various polymenic materials since the significance of the use of polymer based alloys or composites has been raised in terms of specific strength and energy saving. In the earlier published reports [1, 2, 3, 4], the crack and void healing velocity, healing toughness and some other healing mechanical and physical properties were measured experimentally and compared with predicted values by utilizing a simple model such as the reptation model under some resonable assumptions. It seems, however, that the general acceptance of the proposed modeling analyses is yet open question. The crack healing processes seem to be complicate and highly dependent on the state of virgin material in terms of mechanical and physical properties. Furthermore, it is also strongly dependent on the histories of crack, craze and void development including fracture suface morphology, the shape of void and the degree of disentanglement of fibril in the craze. The rate of crack healing may be a function of environmental factors such as healing temperature, time and pressure which gives different contact configurations between two separated surfaces. It seems to be reasonable to assume that the crack healing processes may be divided in several distinguished steps like stress relaxation with molecular chain arrangement, surface contact (wetting), inter- diffusion process and com;oete healing (to obtain the original strength). In this context, it is likely that we no longer have to accept the limitation of cumulative damage theories and fatigue life if it is probable to remove the defects such as crack, craze and void and to restore the original strength of polymers or polymer based compowites by suitable choice of healing histories and methods. In this paper, we wish to present a very simple and intuitive theoretical model for the prediction of healed fracture toughness of cracked or defective polymeric components. The central idea of this investigation, thus, may be the modeling of behavior of chain molecules under healing conditions including the effects of chain scission on the healing processes. The validity of this proposed model will be studied by making comparisons between theoretically predicted values and experimentally determined results in near future and will be reported elsewhere.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2457-2465
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• 2002

Numerical modeling of a nondestructive testing system plays an important role in many aspects of quantitative nondestructive evaluation (QNDE). The ultimate goal of a model is to predict test results for a specific flaw in a material. Thus, in ultrasonic testing, a system model should include the transducer, its radiation pattern, the beam reflection and propagation, and scattering from defects. In this paper attention is focused on the scattering model and the scattered fields by defects are observed by an elastodynamic boundary element method. Flaw types addressed are void-like and crack-like flaws. When transverse ultrasonic waves are obliquely incident on the flaw, the angular distribution of far-field scattered displacements are calculated and presented in the form of A-scan mode. The component signals obtained from each scattering problem are identified and their differences are addressed. The numerical results are also compared with those obtained by high frequency approximate solutions.

• Journal of the Korean Magnetics Society
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• v.6 no.2
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• pp.98-105
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• 1996

스퍼터링 방법으로 제작된 NiFe 박막에서 Ar 압력이 자기 및 자기저항 성질에 미치는 여향을 조사하였다. 타겟으로는 Ni$_{81}$$Fe_{19}$ 조성의 합금타겟을 사용하였다. TEM을 써서 박막의 미세구조를 조사하였으며, 보자력과 포화자화는 VSM으로 측정하였다. 합금박막의 조성은 ICPS로 분석 확인하였다. 10 mTorr 이상의 높은 Ar 압력에서 제작된 박막에서 갈라진 틈새(crack-like void)를 갖는 주상구조가 관찰되었다. 이러한 주상 결정립경계(columnar grain boundary)가 자화 과정에서 자구벽 핀닝자리(pinning site)가 되어, Ar 압력이 커짐에 따라 보자력이 증가 하였으며, 박막의 밀도가 감소하여 포화자화가 줄어드는 것을 볼 수 있었다. 한편, Ar 압력이 증가하면서 자기저항비가 감소하는 결과를 얻었다. 결정립 경계 산란과 결정립간 터널링에 의한 박막의 비저항의 증가가 이러한 자기저항비 감소의 주원인임을 알 수 있었다.다.

• Steel and Composite Structures
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• v.1 no.4
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• pp.411-426
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• 2001

This paper treats the failure analysis of prestressing steel wires with different kinds of localised damage in the form of a surface defect (crack or notch) or as a mechanical action (transverse loads). From the microscopical point of view, the micromechanisms of fracture are shear dimples (associated with localised plasticity) in the case of the transverse loads and cleavage-like (related to a weakest-link fracture micromechanism) in the case of cracked wires. In the notched geometries the microscopic modes of fracture range from the ductile micro-void coalescence to the brittle cleavage, depending on the stress triaxiality in the vicinity of the notch tip. From the macroscopical point of view, fracture criteria are proposed as design criteria in damage tolerance analyses. The transverse load situation is solved by using an upper bound theorem of limit analysis in plasticity. The case of the cracked wire may be treated using fracture criteria in the framework of linear elastic fracture mechanics on the basis of a previous finite element computation of the stress intensity factor in the cracked cylinder. Notched geometries require the use of elastic-plastic fracture mechanics and numerical analysis of the stress-strain state at the failure situation. A fracture criterion is formulated on the basis of the critical value of the effective or equivalent stress in the Von Mises sense.

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.172-179
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• 1992

$Al_2O_3/ZrO_2$ composites were fabricated by pressureless sintering from commercial powders and/or nano composite powder of $Al_2O_3/ZrO_2$. The Properties of the composites such as density, strength, hardness and fracture toughness were evaluated. Microstructures and fracture surfaces ware also examined. The flexural strength remains unchanged(~640 MPa) as long as the content of commercial powders is not extreamly high, and depends on microstructures of the composites. Fracture toughness(4.3-5.3 $Mpa{\cdot}m^{1/2}$) increases with increasing content of commercial powders. Fractography shows that failure-initiating sources are 1)surface flaws resulting from machining damage, 2)crack-shaped voids formed due to $ZrO_2$ agglomeration, and 3)surface separation caused by inhomogeneous blending and by sinterability difference between nato composite powder and commercial powders of $Al_2O_3/ZrO_2$. Failure mode of the composites was mainly transgranular.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.