• 한국세라믹학회지
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• 제36권7호
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• pp.718-724
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• 1999

Densification and grain growth behavior of bimodal size distributed alumina powder mixtures were investigated as a function of amount of coarse alumina powder. The specimens which contained coarse alumina powder for 60to 80wt% showed the highest green density. The amount of shrinkage of sintered specimen lineraly decreased with the increase of coarse alumina powder up to the content that showed the highest green density and then further addition of coarse alumina powder led to drastic decrease of shrinkage of specimen. Especially crack-like void were concurrently revealed in the sintered body with addition of coarse alumina powder above 60wt% When the sintering temperature increased up to 1650$^{\circ}C$ the amount of shrinkage of specimen linearly decreased and the grain growth were also retarded with increase of coarse lauminia powder.

• 한국정밀공학회지
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• 제3권1호
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• pp.40-49
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• 1986

Crack, craze and void are common defects which may be found in the bulk of polymeric materials such as either themoplastics or thermosets. The healing phenomena, autohesion, of these defects are known to be a intrinsic material property of various polymeric materials. However, only a few experimental and theoretical investigations on crack, void and craze healing phenomena for various polymeric materials have been reported up to date [1, 2, 3]. This may be partly due to the complications of healing processes and lacking of appropriate theoretical developments. Recently, some investigators have been urged to study the healing phenomena of various polymenic materials since the significance of the use of polymer based alloys or composites has been raised in terms of specific strength and energy saving. In the earlier published reports [1, 2, 3, 4], the crack and void healing velocity, healing toughness and some other healing mechanical and physical properties were measured experimentally and compared with predicted values by utilizing a simple model such as the reptation model under some resonable assumptions. It seems, however, that the general acceptance of the proposed modeling analyses is yet open question. The crack healing processes seem to be complicate and highly dependent on the state of virgin material in terms of mechanical and physical properties. Furthermore, it is also strongly dependent on the histories of crack, craze and void development including fracture suface morphology, the shape of void and the degree of disentanglement of fibril in the craze. The rate of crack healing may be a function of environmental factors such as healing temperature, time and pressure which gives different contact configurations between two separated surfaces. It seems to be reasonable to assume that the crack healing processes may be divided in several distinguished steps like stress relaxation with molecular chain arrangement, surface contact (wetting), inter- diffusion process and com;oete healing (to obtain the original strength). In this context, it is likely that we no longer have to accept the limitation of cumulative damage theories and fatigue life if it is probable to remove the defects such as crack, craze and void and to restore the original strength of polymers or polymer based compowites by suitable choice of healing histories and methods. In this paper, we wish to present a very simple and intuitive theoretical model for the prediction of healed fracture toughness of cracked or defective polymeric components. The central idea of this investigation, thus, may be the modeling of behavior of chain molecules under healing conditions including the effects of chain scission on the healing processes. The validity of this proposed model will be studied by making comparisons between theoretically predicted values and experimentally determined results in near future and will be reported elsewhere.

• 대한기계학회논문집A
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• 제26권11호
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• pp.2457-2465
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• 2002

Numerical modeling of a nondestructive testing system plays an important role in many aspects of quantitative nondestructive evaluation (QNDE). The ultimate goal of a model is to predict test results for a specific flaw in a material. Thus, in ultrasonic testing, a system model should include the transducer, its radiation pattern, the beam reflection and propagation, and scattering from defects. In this paper attention is focused on the scattering model and the scattered fields by defects are observed by an elastodynamic boundary element method. Flaw types addressed are void-like and crack-like flaws. When transverse ultrasonic waves are obliquely incident on the flaw, the angular distribution of far-field scattered displacements are calculated and presented in the form of A-scan mode. The component signals obtained from each scattering problem are identified and their differences are addressed. The numerical results are also compared with those obtained by high frequency approximate solutions.

• 한국자기학회지
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• 제6권2호
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• pp.98-105
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• 1996

스퍼터링 방법으로 제작된 NiFe 박막에서 Ar 압력이 자기 및 자기저항 성질에 미치는 여향을 조사하였다. 타겟으로는 Ni$_{81}$$Fe_{19}$ 조성의 합금타겟을 사용하였다. TEM을 써서 박막의 미세구조를 조사하였으며, 보자력과 포화자화는 VSM으로 측정하였다. 합금박막의 조성은 ICPS로 분석 확인하였다. 10 mTorr 이상의 높은 Ar 압력에서 제작된 박막에서 갈라진 틈새(crack-like void)를 갖는 주상구조가 관찰되었다. 이러한 주상 결정립경계(columnar grain boundary)가 자화 과정에서 자구벽 핀닝자리(pinning site)가 되어, Ar 압력이 커짐에 따라 보자력이 증가 하였으며, 박막의 밀도가 감소하여 포화자화가 줄어드는 것을 볼 수 있었다. 한편, Ar 압력이 증가하면서 자기저항비가 감소하는 결과를 얻었다. 결정립 경계 산란과 결정립간 터널링에 의한 박막의 비저항의 증가가 이러한 자기저항비 감소의 주원인임을 알 수 있었다.다.

• Steel and Composite Structures
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• 제1권4호
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• pp.411-426
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• 2001

This paper treats the failure analysis of prestressing steel wires with different kinds of localised damage in the form of a surface defect (crack or notch) or as a mechanical action (transverse loads). From the microscopical point of view, the micromechanisms of fracture are shear dimples (associated with localised plasticity) in the case of the transverse loads and cleavage-like (related to a weakest-link fracture micromechanism) in the case of cracked wires. In the notched geometries the microscopic modes of fracture range from the ductile micro-void coalescence to the brittle cleavage, depending on the stress triaxiality in the vicinity of the notch tip. From the macroscopical point of view, fracture criteria are proposed as design criteria in damage tolerance analyses. The transverse load situation is solved by using an upper bound theorem of limit analysis in plasticity. The case of the cracked wire may be treated using fracture criteria in the framework of linear elastic fracture mechanics on the basis of a previous finite element computation of the stress intensity factor in the cracked cylinder. Notched geometries require the use of elastic-plastic fracture mechanics and numerical analysis of the stress-strain state at the failure situation. A fracture criterion is formulated on the basis of the critical value of the effective or equivalent stress in the Von Mises sense.

• 한국재료학회지
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• 제2권3호
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• pp.172-179
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• 1992

$Al_2O_3/ZrO_2$복합분말에 상릉분말을 침가하여 상압소결법으로 $Al_2O_3/ZrO_2$복합체를 제조한 후, 밀도, 강도, 경도 및 파괴인성등의 물성을 측정하였으며 미세구조 및 파괴단면도 관찰하였다. 상용분말의 침가량이 중량비로 50%이하인 경우에는 평균 꺽임 강도가 640 MPa정도로 거의 변화가 없었으며, 50%이상 첨가된 경우에는 강도가 저하되었는데, 이는 미세조직과 관계가 있는 것으로 생각된다. 또한 파괴인성(4.3-5.3 $Mpam^{1/2}$)값은 상용분말 첨가량에 비례하여 증가하였다. 파괴단면 관찰결과 파괴원인으로는 가공에서 생기는 표면 결함, $ZrO_2$ agglomeration에 의한 crack-like void 및 $Al_2O_3/ZrO_2$ nano복합체 분말과 상용분말간의 소결성 차이에서 생기는 계면 분리등이 관찰되었는데, nano 복합 분말만을 사용한 소결체에서는 가공에 의한 표면 결함만이 파괴원으로 작용하였다. 또한, 파괴형태는 주로 transgranular fracture이었다

• Journal of Welding and Joining
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• 제32권3호
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.