• Journal of the Korean Magnetics Society
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• v.12 no.3
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• pp.94-98
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• 2002

Sputtering conditions and various underlayer such as Al, Cu, Ni, Cr, Ag, Mg, Fe, Co, Pd, Au, Pt, Mo and Hf were investigated for coercivity enhancement of 20 nm Ti/CoCrPt thin films in order to increase the coercivity of the films thinner than 20 nm. Among them, Ag and Mg were effective to increase the coercivity. Particularly 2 nm Ag was very effective to increase the coercivity and nucleation field as well as to reduce ${\alpha}$ value in CoCrPt thin film such that the coercivity of 2 nm Ag/18 nm Ti/10 nm CoCrPt film was 2200 Oe. However, it seemed that other coercivity enhancement mechanism operated in CoCrPt films because Ti (002) preferred texture was not developed with Ag underlayer contrary to a general expectation. And the coercivity and nucleation field were decreased when glass substrate with rougher surface was used.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05a
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• pp.192-196
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• 2002

This paper describes on the fabrication and characteristics of a metal thin-film pressure sensor based on Cr strain-gauges for harsh environment applications. The Cr thin-film strain-gauges are sputter-deposited onto a micromachined Si diaphragms with buried cavity for overpressure protectors. The proposed device takes advantages of the good mechanical properties of single-crystalline Si as diaphragms fabricated by SDB and electrochemical etch-stop technology, and in order to extend the operating temperature range, it incorporates relatively the high resistance, stability and gauge factor of Cr thin-films. The fabricated pressure sensor presents a low temperature coefficient of resistance, high-sensitivity, low non-linearity and excellent temperature stability. The sensitivity is 1.097~1.21 $mV/V{\cdot}kgf/cm^2$ in the temperature range of $25{\sim}200^{\circ}C$ and the maximum non-linearity is 0.43 %FS.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1475-1477
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• 2001

In odor to set high saturation magnetization and coercivity, it had need to orient axis of easy magnetization of CoCr-based thin film perpendicular direction(c-axis) to the substrate plane. It was known that crystalline orientation of CoCr-based thin film was improved by introducing underlayer like Ti, Ge. We prepared singlelayer and double layer with Si underlayer by Facing Targets Sputtering System. As a result, intensity and c-axis dispersion angle ${\Delta}{\theta}_{50}$ of singlelayer were improved with increasing film thickness. Also, it was found that CoCr/Si and CoCrTa/Si double layer showed good c-axis dispersion angle due to introducing Si.

• Journal of the Korean Magnetics Society
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• v.7 no.4
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• pp.205-211
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• 1997

The magnetic properties change which was induced by addition of small amount of Ni into Cr underlayer in CoCrTa/ CrNi thin film deposited by electron beam evaporator was investigated. The additional Ni element was found to be beneficial for incease in the coercivity of the thin film deposited at the room temperature. The origin of coercivity increase was elucidated by crystal orientation and microstructure investigation using XRD and AFM respectively. It was found that the grain size were increased by Ni addition. The coercivity of the film with CrNi underlayer is lower than that of film with Cr underlayer when prepared with higher substrate temperature. This result may be originated with the increase in grain size. When film was deposited at 280 $^{\circ}C$ substrate temperature, Cr segregation in grain boundary is found to be the other factor for determining coercivity value.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.10
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• pp.1375-1381
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• 2018

In this paper, we studied coatings of the DLC thin film for improving loosening torque of dental implant screw. We used a filtered arc ion plating process which can realize the most dense DLC layer by coating the DLC thin film on the surface of the dental abutment screw. It showed both hardness comparable to diamond and low friction coefficient similar to graphite, and to improve the loosening phenomenon by increasing the screw tightening force Cr/CrN, Ti/TiN or Ti/TiN/Cr/CrN buffer layers were deposited for 5 to 10 minutes to improve the adhesion of the DLC thin film to the surface of the Ti (Gr.5), and then the DLC thin film was coated for about 15 minutes. As a result, the Cr/CrN buffer layer exhibited the highest hardness of 29.7 GPa, the adhesion of 18.62N on average, and a very low coefficient of friction of less than 0.2 as a whole. And we measured loosening torque after one million times with masticatory movement simulator. As a result, the values of the coated screw loosening torque were clearly higher than those of the uncoated screw. From this, it was found that the DLC coating was effective methods improving the loosening torque. In addition, it was confirmed that the cytotoxicity test and cell adhesion test showed high biocompatibility.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.573-576
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• 2000

The physical, electrical and piezoresitive characteristics of CrN(chromium nitride) thin-films on silicon substrates have been investigated for use as strain gauges. The thin-film depositions have been carried out by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(5∼25 %)Na$_2$). The deposited CrN thin-films with thickness of 3577${\AA}$ and annealing conditions(300$^{\circ}C$, 48 hr) in Ar-10 % N$_2$deposition atmosphere have been selected as the ideal piezoresistive material for the strain gauges. Under optimum conditions, the CrN thin-films for the strain gauges is obtained a high electrical resistivity, $\rho$=1147.65 ${\mu}$$\Omega$cm, a low temperature coefficient of resistance, TCR=-186 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF=11.17.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.52 no.2
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• pp.56-60
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• 2003

In this work, we have fabricated thin film resistors using the DC/RF magnetron sputter of 51wt%Ni-41wt%Cr-8wt%Si alloy target and studied the effect of the process parameters on the electrical properties. In fabrication process, sputtering power, substrate temperature and annealing temperature have been varied as controllable parameters. TCR decreases with increasing the substrate temperature, but TCR increases over 300 [$^{\circ}C$]. The films are annealed to 400 [$^{\circ}C$] in air atmosphere, TCR increases with increasing the annealing temperature. The resistivity was 172 [${\mu}{\Omega}{\cdot}cm$] and 209 [${\mu}{\Omega}{\cdot}cm$] for the RF and DC as a sputtering power sources, respectively. Also, TCR was -52 [$ppm/^{\circ}C$] and -25 [$ppm/^{\circ}C$]. As a results of them, it is suggested that the sheet resistance and TCR of thin films can be controlled by variation of sputter process parameter and annealing of thin film.

• Journal of the Korean Magnetics Society
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• v.3 no.3
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• pp.208-214
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• 1993

In order to investigate the origin of an increase in the coercivity with the Ta addition to Co-Cr films, the perpendicular magnetic anisotropy of Co-Cr film and CoCrTa film was measured by a torque magnetometer and VSM. In Co-Cr binary alloy film, the uniaxial anisotropy increased with increasing Cr content. The perpendicular magnetic anisotropy of $Co_{81.7}Cr_{16.7}Ta_{1.6}$ film was larger than that of $Co_{81}Cr_{19}$ film, both of which were deposited at the same substrate temperature of $100^{\circ}C$. The change in the perpendicular magnetic anisotropy with annealing was studied to understand the Ta addition effect. The amount of decrease in perpendicular magnetic anisotropy of the CoCrTa film by the annealing was larger than that of Co-Cr film. And the perpendicular magnetic anisotripies of Co-Cr film and CoCrTa film after annealing were almost the same. The cause of this was interpretated as the enhanced segregation of solute atoms in the Ta added thin film in the as-deposited state. The enhanced segregation of solute atoms increases the perpendicular magnetic anisotropy of the film, and causes the increase of perpendicular coercivity of the film.

• Analytical Science and Technology
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• v.6 no.2
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• pp.217-223
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• 1993

Thin films of the Au/Cr, Au/Ni/Cr and Au/Pd/Cr systems were deposited on alumina substrates at ambient temperature and $250^{\circ}C$ in a high-vacuum resistance heating evaporator and annealed at $300^{\circ}C$, $450^{\circ}C$ and $600^{\circ}C$ for 1 hour in air, respectively. The film thicknesses of Au, Ni(or pd), and Cr were $1000{\AA}$, $300{\AA}$, and $50{\AA}$, respectively. The substrate temperature during deposition and the post-deposition annealing temperature affected the sheet resistance of thin-films due to the inter-diffusion of each layer. As a result of Auger depth profile analysis, in the Au/Cr system Cr already diffused out to Au surface during deposition at the substrate temperature of $250^{\circ}C$ and Au distribution changed after heat treatment. In the Au/Ni/Cr and Au/Pd/Cr systems, diffusion phenomena of Ni and Pd were found and especially Ni (approximately 45 at.%) diffused out to Au surface and oxidized.

• Journal of the Korean institute of surface engineering
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• v.28 no.4
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• pp.219-224
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• 1995

The peel adhesion and plastic deformation in Cu-Cr alloy films, sputter-deposited onto polyimide films, have been studied as a function of Cr content in the film. The adhesion strength has been measured by T-peel test and the amount of plastic deformation in the peeled metal strip was determined qualitatively by XRD technique. Peel adhesion strength has a maximum in the film containing 22-33wt.% Cr and the peel strength of pure Cr film is lower than the maximum. The film having the highest peel strength is deformed most heavily. The effect of Cr content on the peel strength is discussed in terms of the interfacial bond strength and mechanical properties of Cu-Cr alloy film.